Foamable epoxy resin composition

• US 5,274,006 A
• Filed: 02/18/1992
• Issued: 12/28/1993
• Est. Priority Date: 02/19/1991
• Status: Expired due to Fees

• Current Assignee: Nippon Zeon Co., Ltd. (BASF SE)
• Original Assignee: Nippon Zeon Co., Ltd. (BASF SE)
• Inventors: Mikuni, Takamitu, Kagoshima, Yutaka, Nagase, Toshio, Kobayashi, Takeo
• Primary Examiner(s): Foelak, Morton
• Application Number:
  US07/836,600
• Time in Patent Office: 679 Days
• Field of Search: 521/135, 521/104, 521/128, 521/129, 521/135, 521/85, 521/94, 521/95, 521/54
• US Class Current: 521/85
• CPC Class Codes: C08J 2363/00 Characterised by the use of epoxy resins; Derivatives of epoxy resins
• CPC Class Codes: C08J 9/06 by a chemical blowing agent
• CPC Class Codes: C08J 9/141 Hydrocarbons
• CPC Class Codes: C08L 2666/02 Organic macromolecular compounds, natural resins, waxes or and bituminous materials
• CPC Class Codes: C08L 63/00 Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Abstract

The present invention provides a foamable epoxy resin composition (A) 100 parts by weight of a liquid epoxy resin (B) 0.5-20 parts by weight of a latent curing agent, (C) 0.5-15 parts by weight of a foaming agent having a decomposition temperature of 100°-220° C., (D) 0.05-5 parts by weight of a surface active agent and (E) 10-200 parts by weight of a rubbery elastomer or a powdery halogen-free thermoplastic resin of 150 μm or less in average particle diameter, which composition has a melt viscosity of 2.5×10³ -5×10⁴ dPa·s at the decomposition temperature of said foaming agent. The composition can provide a foamed material of rigidity and good heat resistance, having an expansion ratio of 5 times or more and a dense cell structure of 0.5 mm or less in average cell diameter.

Claims

1. A foamable epoxy resin composition comprising

(A) 100 parts by weight of a liquid epoxy resin having at least one epoxy group in the molecule,

(B) 0.5-20 parts by weight of a latent curing agent for epoxy resin selected from the group consisting of an imidazole, an isophthalic acid dihydrazide, an N,N-dialkylurea, an N,N-dialkylthiourea, tetrahydrophthalic anhydride, isophoronediamine, m-phenylene diamine, N-aminoethylpiperazine, a boron trifluoride complex compound and trisdimethylaminomethylphenol,

(C) 0.5-15 parts by weight of a foaming agent having a decomposition temperature of 100°

-220°

C.,

(D) 0.5-5 parts by weight of an anionic surface active agent, and

(E) 10-200 parts by weight of at least one rubbery elastomer insoluble in said epoxy resin at room temperature by miscible with and dispersible in said epoxy resin at temperatures of 80°

-150°

C. and selected from the group consisting of a chloroprene rubber, a butadiene-acrylonitrile rubber, a carboxyl-modified butadiene-acrylonitrile rubber, an epoxy-modified butadiene-acrylonitrile rubber, a butadiene rubber and an isoprene rubber,

which composition has a melt viscosity of 2.5×

10³ -5×

10⁴ dPa·

s at the decomposition temperature of said foaming agent.

2. The composition according to claim 1, wherein the epoxy resin (A) is (1) a diglycidyl ether using bisphenol A, bisphenol F or resorcin as a base, (2) a polyglycidyl ether of a phenolic novolac resin or a cresol novolac resin, (3) a diglycidyl ether of hydrogenated bisphenol A, (4) a glycidylamine type, (5) a linear aliphatic epoxide type or (6) a diglycidyl ester of phthalic acid, hexahydrophthalic acid or tetrahydrophthalic acid and has an epoxy equivalent of 100-300.

3. The composition according to claim 1, wherein the foaming agent (C) is azodicarbonamide, p-toluenesulfonyl hydrazide, dinitrosopentamethylenetetramine, 4,4'"'"'-oxybisbenzenesulfonyl hydrazide, sodium hydrogen-carbonate, sodium boron hydride or microcapsules comprising a vinylidene chloride resin and a low-boiling hydrocarbon encapsulated therein.

4. The composition according to claim 3, wherein the foaming agent (C) has uniform particle diameters of 20 μ

m or less.

5. The composition according to claim 1, wherein the rubbery elastomer is powdery.