Integrated circuit having metal substrate

• US 5,274,570 A
• Filed: 04/16/1993
• Issued: 12/28/1993
• Est. Priority Date: 05/22/1989
• Status: Expired due to Fees

• Current Assignee: Mazda Motor Corporation
• Original Assignee: Mazda Motor Corporation
• Inventors: Itoh, Yuichi, Izumi, Tomoji, Fujita, Nagahisa
• Primary Examiner(s): Trans, Vincent N.
• Application Number:
  US08/047,387
• Time in Patent Office: 256 Days
• Field of Search: 364/488, 364/489, 364/490, 364/578, 364/431.04, 364/431.12, 361/331, 361/380, 361/392, 361/395, 361/399, 361/400, 361/401, 361/403, 361/404
• US Class Current: 361/679.32
• CPC Class Codes: B60R 16/0239 Electronic boxes
• CPC Class Codes: H01L 2224/2612 Auxiliary members for layer connectors, e.g. spacers
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01R 12/59 for flexible printed circuits, flat or ribbon cables or like structures
• CPC Class Codes: H01R 12/7076 for connection between PCB and component, e.g. display
• CPC Class Codes: H01R 13/6658 on printed circuit board H01R13/6666 - H01R13/6691 take precedence
• CPC Class Codes: H05K 1/05 Insulated conductive substrates, e.g. insulated metal substrate
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 3/361 Assembling flexible printed circuits with other printed circuits
• CPC Class Codes: H05K 5/0043 comprising a frame housing mating with two lids wherein the PCB is flat mounted on the frame housing

Abstract

An integrated circuit of this application includes a circuit board in which a conductive layer of a desired pattern is formed on a metal substrate through an insulating layer, a circuit element mounted on the insulating layer, and first and second connectors for connecting at least the circuit element and an external device. The circuit element is nondetachably mounted on the insulating layer, and has a nonvolatile content which can be rewritten by an external operation. The first connector connects at least the circuit element to a portion to be controlled, and the second connector connects the circuit element and an external processing device via a path different from that of the first connector so as to process a storage content of the circuit element.

Claims

1. An integral circuit having a metal substrate, comprising:

a first circuit board in which a conductive layer of desired pattern is formed on said metal substrate through an insulating layer;

a memory device nondetachably mounted on said first circuit board and storing nonvolatile data which can be rewritten by an external operation;

a controlling device mounted on said first circuit board and connected to said memory device and performing a predetermined controlling operation based on the nonvolatile data stored in said memory device;

a first connector, mounted on said first circuit board, and having a first group of terminals connected to a first path for passing control signals from said controlling device to an external object which will be electrically controlled by said controlling device;

a second connector, mounted on said first circuit board, arranged separately from said first connector and externally accessible, and having a second group of terminals connected to a detachable second path, for passing signals to rewrite the nonvolatile data in said memory device responsive to the external operation performed by an external processing device via the second path which is different from the first path in said first connector, said second connector having a female-connector shape so that said second connector can be sealed by filling a resin after rewriting of the nonvolatile data stored in said memory device; and

seal means for sealing an outer surface of said first circuit board except said first and second connectors so that said first and second connectors are exposed to the outside.

2. The integrated circuit according to claim 1, wherein said conductive layer includes a first signal line group for connecting said memory device to another circuit element, and a second signal line group for connecting said memory device to said second connector, and

signal shut-off means for stopping data transmission to said another circuit element when the storage content of said memory device to be written is arranged at a position of said first signal line group and adjacent to said memory device.

3. The integrated circuit according to claim 1, wherein said second connector is mounted on a portion to be mounted for connection to said external processing device.

4. The integrated circuit according to claim 1, wherein said external processing device comprises a tuning device for changing a controlling manner of said controlling device by rewriting the storage content of said memory device.

5. The integrated circuit according to claim 1, wherein said external processing device comprises a tuning device for monitoring the storage content of said memory device.

6. The integrated circuit according to claim 1, wherein said controlling device connects to said external processing device through said second connector means.

7. The integrated circuit according to claim 6, wherein said external processing device comprises a tuning device for rewriting a control content of said controlling device.

8. The integrated circuit according to claim 6, wherein said external processing device comprises an emulator for emulating a control content of said controlling device.

9. The integrated circuit according to claim 1, wherein said first connector comprises a first male connector integrally mounted on one end of said integrated circuit, and a first female connector detachably attached to said first male connector, and connected to said external object to be controlled.

10. The integrated circuit according to claim 1, wherein said second connector comprises a second female connector integrally mounted on another end of said integrated circuit, and a second male connector detachably attached to said second female connector, and connected to said external processing device.

11. The integrated circuit according to claim 1, wherein said first and second connectors are arranged at both ends of said first circuit board, opposing each other.

12. The integrated circuit according to claim 1, wherein said seal means includes:

a second circuit board arranged to oppose said first circuit board; and

a pair of seal members for sealing both sides of said first circuit board and said second circuit board; and

wherein said second connector is formed to have an opening portion surrounded by an inner surface of said first circuit board, an inner surface of said second circuit board and inner surfaces of said pair of seal members, so that said second connector has a female-connector shape.

13. The integrated circuit according to claim 12, wherein connecting terminals for said second connector are arranged on the respective inner surfaces of said first circuit board and said second circuit board.