Valve closure mechanism for semiconductor deposition apparatus
First Claim
1. A means for closing an aperture formed through a wall comprising:
- an aperture cover plate;
at least one articulated linkage for moving the cover plate between an open position and an aperture closing position, each of said at least one linkage including at least a first member attached to the plate and a second member for pivotally mounting relative to the wall in which the aperture is formed, the members furthermore being pivotally attached with respect to each other to define an angle between them such that increasing the angle causes the plate to move between said aperture closing position and said open position whereby, when the cover plate is in the aperture closing position, said angle between the first and second members, is greater than one hundred and eighty degrees; and
actuating means for driving said articulated linkage.
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Accused Products
Abstract
This invention provides a closure means for an aperture in a semiconductor deposition furnace, the closure means including an aperture cover plate; at least one articulated linkage including at least two arms, the arms being pivotally mounted with respect to each other to define an angle between them such that variation of the angle causes the plate to move between an aperture closing position and an open position in which the plate is clear of the aperture; and an actuator for driving the articulated linkage and for locking the plate in the aperture closing position. The articulated linkage is in the form of a first arm connected to the cover plate, and a second arm for transferring motive force from the actuator to the first arm. As the plate is moved from its open position to its aperture closing position, the angle between the first and second arms changes from a relatively small angle to a relatively large angle.
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Citations
22 Claims
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1. A means for closing an aperture formed through a wall comprising:
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an aperture cover plate; at least one articulated linkage for moving the cover plate between an open position and an aperture closing position, each of said at least one linkage including at least a first member attached to the plate and a second member for pivotally mounting relative to the wall in which the aperture is formed, the members furthermore being pivotally attached with respect to each other to define an angle between them such that increasing the angle causes the plate to move between said aperture closing position and said open position whereby, when the cover plate is in the aperture closing position, said angle between the first and second members, is greater than one hundred and eighty degrees; and actuating means for driving said articulated linkage. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A semiconductor substrate processing apparatus comprising:
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(i) a reactor including at least one wall defining a substrate processing chamber; (ii) an aperture formed through one of the at least one wall; (iii) an aperture cover plate; (iv) at least one articulated linkage for moving the cover plate between an open position and an aperture closing position, each of said at least one linkage including at least a first member attached to the plate and a second member pivotably mounted relative to the wall in which the aperture is formed, the members furthermore being pivotally attached with respect to each other to define an angle between them such that increasing the angle causes the plate to move between said open position and said aperture closing position, and whereby when the cover plate is in the aperture closing position, the angle between the first and second members, is greater than one hundred and eighty degrees; and (v) actuating means for driving said articulated linkage. - View Dependent Claims (18, 19, 20, 21, 22)
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Specification