Method of manufacturing a high density connector system

• US 5,276,964 A
• Filed: 01/11/1993
• Issued: 01/11/1994
• Est. Priority Date: 04/03/1992
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Anderson, Herbert R. Jr., Walsh, Thomas J., Lussow, Robert O., Myers, Donald E., Bross, Arthur, Cempa, Julian G.
• Primary Examiner(s): VO, PETER DUNG BA
• Application Number:
  US08/002,159
• Time in Patent Office: 365 Days
• Field of Search: 29/441.1, 29/442, 29/447, 29/846, 29/847, 29/849, 29/852, 29/853, 29/743, 29/432.2, 29/DIG. 44, 29/33 M, 439/59, 439/75, 228/180.2, 72/361
• US Class Current: 29/853
• CPC Class Codes: H01R 12/526 the printed circuits being on the same board with plated through holes H05K3/42
• CPC Class Codes: H01R 4/02 Soldered or welded connections H01R4/625, H01R4/723, H01R12/59 take precedence
• CPC Class Codes: H01R 43/02 for soldered or welded connections
• CPC Class Codes: H01R 43/16 for manufacturing contact members, e.g. by punching and by bending
• CPC Class Codes: H05K 2201/0129 Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
• CPC Class Codes: H05K 2201/0367 Metallic bump or raised conductor not used as solder bump solder materials or compositions and methods of application thereof H05K3/3457
• CPC Class Codes: H05K 2201/0382 Continuously deformed conductors
• CPC Class Codes: H05K 2201/091 Locally and permanently deformed areas including dielectric material
• CPC Class Codes: H05K 2201/09754 Connector integrally incorporated in the PCB or in housing mounted connecter H05K2201/10189
• CPC Class Codes: H05K 2201/10234 Metallic balls solder balls H05K2203/041
• CPC Class Codes: H05K 2203/1105 Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
• CPC Class Codes: H05K 2203/1189 Pressing leads, bumps or a die through an insulating layer
• CPC Class Codes: H05K 3/4015 using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
• CPC Class Codes: H05K 3/403 Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof H05K3/4092 takes precedence
• CPC Class Codes: H05K 3/4046 using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
• CPC Class Codes: Y10S 29/044 Vacuum
• CPC Class Codes: Y10S 439/951 PCB having detailed leading edge
• CPC Class Codes: Y10T 29/49167 with deforming of conductive path
• CPC Class Codes: Y10T 29/49853 of sphere, i.e., ball, in socket
• CPC Class Codes: Y10T 29/53191 Means to apply vacuum directly to position or hold work part

Abstract

There is disclosed a high density electronic connector system in which a plastic insulating body supports on one or more levels a plurality of conductive circuit traces. Output contacts to these traces are provided by small metal balls. The metal balls are driven into tight contact with respective ones of the conductive traces and captivated by the plastic body. The balls are covered with gold and provide miniature, wear resistant closely spaced output contacts in the connector system. A ball may contact conductive traces on two levels of the insulating body and thereby provide an electrical connection between conductive traces. A method of manufacture of the connector system includes the steps of heating the plastic body to an elevated temperature, and driving the small metal balls through or against a respective conductive trace and into the plastic body which thereby captivates it. The conductive traces may be solder plated. After a ball is seated in contact with a conductive trace, the solder plating may be reflowed.

Claims

1. A method of manufacturing an electronic connector system comprising the steps of:

providing a plastic body having a plurality of upper and lower conductive traces thereon;

placing a punch over a respective one of the upper conductive traces of said plastic body, said punch having an end facing said one of said conductive traces;

placing a piece of metal against the end of the punch;

placing an anvil under a lower conductive trace, said anvil having an upper surface facing said lower conductive trace; and

,

driving the piece of metal by said punch with suitable force and speed through said one conductive trace into the plastic body and against the lower conductive trace, thereby essentially deforming said lower conductive trace into the upper surface of the anvil by the force of the piece of metal thereby captivating the piece of metal tightly in position.

2. The method of claim 1 wherein the plastic body is heated to an elevated temperature when the small shaped piece of metal is driven into it and wherein the conductive traces are bonded to the plastic body.

3. A method of manufacturing an electronic connector system comprising the steps of:

providing an insulating body of liquid crystal polymer having a plurality of conductive traces thereon;

heating the insulating polymer body to an elevated temperature;

placing a small shaped piece of solid metal over a respective one of the conductive traces on one level; and

placing an anvil under a conductive trace on a second level, said anvil having an upper surface facing the conductive trace on the second level; and

driving the small shaped piece of metal by said punch with sufficient force and speed through the conductive trace on said one level into the polymer body and into contact with the conductive trace on the second level thereby essentially deforming the conductive trace on the second level into the upper surface of the anvil and thereby providing mechanical and electrical engagement of the small shaped piece of metal and the conductive traces thereby establishing a via between the traces.

4. The method of claim 3 wherein the small shaped piece of metal is a gold covered ball, and the traces are solder plated, and further comprising the step of reflowing the solder plating to effect a soldered joint between the trace and the gold covered ball.

5. A method of manufacturing an electronic connector system comprising the steps of:

providing an insulating body of liquid crystal polymer having a plurality of conductive traces thereon;

heating the insulating polymer body to an elevated temperature;

placing a small gold cover ball over a respective one of the conductive traces on one level; and

driving the small gold covered ball with sufficient force and speed through the conductive trace said on one level into the polymer body and into contact with a conductive trace on a second level thereby providing mechanical and electrical engagement of the small gold covered ball and the conductive traces thereby establishing a via between the traces.