Electronic packages and smart structures formed by thermal spray deposition

• US 5,278,442 A
• Filed: 07/15/1991
• Issued: 01/11/1994
• Est. Priority Date: 07/15/1991
• Status: Expired due to Fees

• Current Assignee: Daniel P. Siewiorek, Fritz B. Prinz, Lee E. Weiss
• Original Assignee: Daniel P. Siewiorek, Fritz B. Prinz, Lee E. Weiss
• Inventors: Siewiorek, Daniel P., Prinz, Fritz B., Weiss, Lee E.
• Primary Examiner(s): Hille, Rolf
• Assistant Examiner(s): POTTER, ROY KARL
• Application Number:
  US07/730,226
• Time in Patent Office: 911 Days
• Field of Search: 357/74, 357/71, 357/55, 357/30 Q, 257/679, 257/687, 257/701, 257/702, 257/706, 257/723, 257/729, 257/417, 257/467
• US Class Current: 257/417
• CPC Class Codes: B22F 3/115 by spraying molten metal, i.e. spray sintering, spray casting
• CPC Class Codes: B29C 64/141 using only solid materials
• CPC Class Codes: B29C 64/40 Structures for supporting 3D objects during manufacture and intended to be sacrificed after completion thereof
• CPC Class Codes: B33Y 30/00 Apparatus for additive manufacturing; Details thereof or accessories therefor
• CPC Class Codes: B33Y 70/00 Materials specially adapted for additive manufacturing
• CPC Class Codes: H01L 21/67121 Apparatus for making assemblies not otherwise provided for, e.g. package constructions
• CPC Class Codes: H05K 3/14 using spraying techniques to apply the conductive material , e.g. vapour evaporation
• CPC Class Codes: H05K 3/4644 by building the multilayer layer by layer, i.e. build-up multilayer circuits making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602
• CPC Class Codes: Y10T 29/49986 Subsequent to metal working

Abstract

A smart structure or an electronic package is formed by thermal spraying utilizing a plurality of masks positioned and removed over a work surface in accordance with a predetermined sequence. The masks correspond to cross sections normal to a centerline through the structure. Masks are placed above a work surface and sprayed with either at least one primary material to form at least one electronic component and a complementary material. In this manner, layers of material form a block of deposition material and complementary material. Then, the complementary material which serves as a support structure during forming may be removed.

Claims

1. An electronic/mechanical structure comprised of layers which layers were formed by spray deposition of at least one primary material and complementary material adjacent said at least one primary material, at least one primary material forming a casing and forming at least one of an electrical conductor and a heat conductor, the electronic/mechanical structure also containing embedded therein at least one of a strain gauge, a capacitive switch and a thermocouple, and a structure which produces an electrical signal when activated by one of a mechanical force and a temperature change.

2. The structure of claim 1 wherein at least one primary material is one of a metal, a ceramic, and a plastic.

3. The structure of claim 1 wherein at least two adjacent layers interlock.

4. The structure of claim 1 wherein at least one of a strain gauge, a capacitive switch and a thermocouple is formed by spray deposition of at least one layer.

5. The structure of claim 1 wherein at least one mechanical component is a prefabricated component placed within at least one layer.

6. The structure of claim 1 wherein at least one primary material and the secondary primary material are identical materials.