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Method and apparatus for partially overmolded integrated circuit package

  • US 5,278,726 A
  • Filed: 01/22/1992
  • Issued: 01/11/1994
  • Est. Priority Date: 01/22/1992
  • Status: Expired due to Term
First Claim
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1. A method for forming a partially overmolded integrated circuit package, comprising the steps of:

  • (a) providing a substrate having conductive circuit runners;

    (b) attaching a semiconductor die having contact pads to the substrate;

    (c) applying conductive bumps to the contact pads of the semiconductor die;

    (d) transfer molding a resin over the semiconductor die and a first lower portion of each conductive bump, so as to leave a second upper portion of each conductive bump exposed and elevated above the uppermost surface of the transfer molded resin;

    (e) electrically interconnecting the second upper portion of each conductive bump to the conductive circuit runners.

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