Hermetically sealed circuit modules having conductive cap anchors

• US 5,280,413 A
• Filed: 09/17/1992
• Issued: 01/18/1994
• Est. Priority Date: 09/17/1992
• Status: Expired due to Fees

• Current Assignee: General Dynamics Information Systems, Inc. (General Dynamics Corporation)
• Original Assignee: Ceridian Corporation
• Inventors: Pai, Deepak K.
• Primary Examiner(s): Donovan, Lincoln
• Assistant Examiner(s): Whang, Young
• Application Number:
  US07/946,950
• Time in Patent Office: 488 Days
• Field of Search: 361/380, 361/396, 361/397, 361/388, 361/400, 361/401, 361/403, 361/412, 361/414, 361/417, 361/418, 361/421, 174/17.05, 174/50.5, 174/50.51, 174/52.1, 29/840, 257/700, 257/686
• US Class Current: 361/792
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/057 the leads being parallel to the base
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 23/5383 Multilayer substrates H01L23/5385 takes precedence; multilayer metallisation on monolayer substrates H01L23/538
• CPC Class Codes: H01L 23/5384 Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors H01L23/5383, H01L23/5385 take precedence; pins attached to insulating substrates H01L23/49811
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/15192 Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/16195 Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H05K 5/0095 hermetically-sealed

Abstract

A circuit module includes a multilayer circuit board having a plurality of alternate layers defining circuit paths and insulation with conductive vias between selected circuit paths of different layers. A hermetic seal is sealed to the top layer of the multilayer circuit board, and the circuit paths and/or vias are selectively connected to external pads by vias extending through the multilayer circuit board, one via terminating at a pad internal to the sealed region and another via terminating at the external pad. In one form, the vias providing the external connection extend into a substrate supporting the board, and circuit paths in the substrate electrically connect the vias together. In a second form, the vias providing the external connection are electrically connected together by selected circuit paths in the circuit board. A conductive anchor extends through the circuit board to the substrate to provide an anchor for the seal. Where the vias providing external connection are connected by selected circuit paths in the circuit board, the conductive anchor comprises posts having openings through which the selected circuit paths pass.

Claims

1. An electronic module comprising, in combination:

(a) a multi-layer circuit board comprising a plurality of layers defining circuit paths in a plurality of first layers and insulation in a plurality of second layers between the first layers, and conductive vias extending through selected layers between selected ones of the circuit paths in different ones of the first layers, at least some of the circuit paths being exposed to a top surface of the circuit board;

(b) a plurality of circuit components supported on the top surface of the circuit board and electrically connected to selected ones of the exposed circuit paths;

(c) a substrate, the multi-layer circuit board being supported on the substrate;

(d) a cap anchor formed of a conductive portion in each of the plurality of layers of the circuit board, the conductive portions being stacked between the top surface and the substrate;

(e) a cap having a lid and a skirt portion hermetically sealed to the top surface of the circuit board to enclose a region of the circuit board in which the circuit components are supported, the skirt of the cap being sealed to the cap anchor;

(f) a plurality of conductive pads on the top surface of the circuit board outside the region enclosed by the cap; and

(g) conductive paths connecting individual conductive pads to selected ones of the circuit paths and vias.

2. The module of claim 1 wherein a conductive adhesive connects the skirt portion to the cap anchor at the top surface of the circuit board.

3. The module of claim 1 wherein the skirt portion is soldered to the cap anchor at the top surface of the circuit board.

4. The module of claim 1 wherein the cap anchor substantially surrounds the region of the circuit board supporting the circuit components.

5. The module of claim 1 wherein the cap anchor further includes a conductive anchor portion in the substrate.

6. The module of claim 1 wherein the stack of conductive portions forming the cap anchor forms a conductive wall surrounding the region of the circuit board supporting the circuit components and the conductive paths each comprise a conductive portion in the substrate below and separated from the conductive wall, a second conductive via extending through the plurality of layers forming the circuit board between the conductive portion and the top surface of the circuit board outside the region enclosed by the cap, and a third conductive via extending through at least a portion of the circuit board between the conductive portion and a selected circuit path or the top surface of the circuit board within the region of the circuit board supporting the circuit components.

7. The module of claim 6 wherein the cap anchor further includes a conductive anchor portion in the substrate.

8. The module of claim 6 wherein a conductive adhesive connects the skirt portion to the cap anchor at the top surface of the circuit board.

9. The module of claim 6 wherein the cap anchor substantially surrounds the region;

of the circuit board supporting the circuit components.

10. The module of claim 1 wherein the stack of conductive portions forming the cap anchor forms a plurality of spaced cap anchor posts substantially surrounding the region of the circuit board supporting the circuit components and the conductive paths each comprise an extension of a selected circuit path of the circuit board extending between adjacent cap anchor posts to a location in the circuit board outside the region enclosed by the cap and a second conductive via connected between the extension of the circuit path and the top surface of the circuit board outside the region enclosed by the cap.

11. The module of claim 10 wherein the skirt portion is soldered to the cap anchor at the top surface of the circuit board.

12. The module of claim 10 wherein the cap anchor substantially surrounds the region of the circuit board supporting the circuit components.

13. The module of claim 10 wherein a conductive adhesive connects the skirt portion to the cap anchor at the top surface of the circuit board.

14. An electronic module comprising, in combination:

(a) a substrate;

(b) a circuit board supported on the substrate, the circuit board having a plurality of circuit paths;

(c) a plurality of circuit components supported on the circuit board and electrically connected to selected ones of the circuit paths;

(d) a conductive cap anchor through the circuit board between a top surface of the circuit board and the substrate;

(e) a cap having a lid and a skirt portion connected to the cap anchor and hermetically sealed to the top surface of the circuit board to enclose a region of the circuit board in which the circuit components are supported;

(f) a plurality of conductive pads on the top surface of the circuit board outside the region enclosed by the cap; and

(g) conductive paths connecting individual conductive pads to selected ones of the circuit paths.

15. The module of claim 14 wherein a conductive adhesive connects the skirt portion to the cap anchor at the top surface of the circuit board.

16. The module of claim 14 wherein the skirt portion is soldered to the cap anchor at the top surface of the circuit board.

17. The module of claim 14 wherein the cap anchor further includes a conductive anchor portion in the substrate.