×

Scalable processor to processor and processor-to-I/O interconnection network and method for parallel processing arrays

  • US 5,280,474 A
  • Filed: 01/05/1990
  • Issued: 01/18/1994
  • Est. Priority Date: 01/05/1990
  • Status: Expired due to Fees
First Claim
Patent Images

1. A multi-stage interconnect network (MIN) for a parallel processor array comprising:

  • first, second and third switching stages for forming routing paths between processor elements (PEs) of the parallel processor array, each stage resolving one or more bits of a data routing header; and

    address bit duplicating means for duplicating bits resolved in a first stage such that the same bits are again resolved in a later stage to balance data routing loading;

    wherein;

    each PE is identified as belonging to a cluster of a plurality of PEs;

    each cluster is identified as belonging to one of a plurality of PE circuit boards; and

    said multi-stage interconnect network is divided into first, second, third and fourth resolving stages for resolving a plurality of route-requesting bits identifying each target PE, the second resolving stage being implemented in said second switching stage for revolving route requests according to the PE board on which the target PE resides, the fourth resolving stage being implemented in said each cluster of PEs for resolving the bits of a route requesting signal according to the location of the target PE within a specified PE cluster, and the first and third resolving stages being implemented in said first and third switching stages respectively for resolving the cluster number of the target PE.

View all claims
  • 4 Assignments
Timeline View
Assignment View
    ×
    ×