Atomic layer epitaxy (ALE) apparatus for growing thin films of elemental semiconductors
First Claim
1. A growth apparatus for atomic layer epitaxial (ALE) growth of thin films upon the surfaces of a plurality of substrates of the elemental semiconductors comprising:
- a growth reactor chamber means for securing said plurality of substrates therein to allow the growth of thin films upon said surfaces thereof;
a purge means operatively connected to said growth reactor chamber means for evacuating all impurities therefrom and to purge clean said surfaces of said plurality of substrates;
a heater means operatively connected to said growth reactor chamber means for maintaining a predetermined purge temperature within a range of purge temperatures, and a predetermined growth temperature within a range of growth temperatures on said surfaces of said plurality of substrates;
a first reactant gas means operatively connected to said growth reactor chamber means for flooding thereof with a first reactant gas so as to expose said surfaces of said plurality of substrates thereto;
a second reactant gas means operatively connected to said growth reactor chamber means for flooding thereof with a second reactant gas so as to expose said surfaces of said plurality of substrates thereto; and
a differential pressure means operatively connected to said growth reactor chamber means for desorbing said surfaces of said plurality of substrates of all physisorbed species of said first and second reactant gases and for maintaining a predetermined purge pressure within a range of purge pressures and a predetermined growth pressure within a range of growth pressures in said growth reactor chamber means.
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Abstract
An apparatus for and a method of growing thin films of the elemental semiductors (group IVB), i.e., silicon, germanium, tin, lead, and, especially diamond, using modified atomic layer epitaxial (ALE) growth techniques are disclosed. In addition, stoichiometric and non-stoichiometric compounds of the group IVB elements are also grown by a variation of the method according to the present invention. The ALE growth of diamond thin films is carried-out, inter alia, by exposing a plurality of diamond or like substrates alternately to a halocarbon reactant gas, e.g., carbon tetrafluoride (CF4), and a hydrocarbon reactant gas, e.g., methane (CH4), at substrate temperatures between 300 and 650 Celsius. A stepping motor device portion of the apparatus is controlled by a programmable controller portion such that the surfaces of the plurality of substrates are given exposures of at least 1015 molecules/cm2 of each of the reactant gases. The chemical reaction time to complete the growth of an individual atom layer is approximately 25×10-6 second.
778 Citations
13 Claims
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1. A growth apparatus for atomic layer epitaxial (ALE) growth of thin films upon the surfaces of a plurality of substrates of the elemental semiconductors comprising:
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a growth reactor chamber means for securing said plurality of substrates therein to allow the growth of thin films upon said surfaces thereof; a purge means operatively connected to said growth reactor chamber means for evacuating all impurities therefrom and to purge clean said surfaces of said plurality of substrates; a heater means operatively connected to said growth reactor chamber means for maintaining a predetermined purge temperature within a range of purge temperatures, and a predetermined growth temperature within a range of growth temperatures on said surfaces of said plurality of substrates; a first reactant gas means operatively connected to said growth reactor chamber means for flooding thereof with a first reactant gas so as to expose said surfaces of said plurality of substrates thereto; a second reactant gas means operatively connected to said growth reactor chamber means for flooding thereof with a second reactant gas so as to expose said surfaces of said plurality of substrates thereto; and a differential pressure means operatively connected to said growth reactor chamber means for desorbing said surfaces of said plurality of substrates of all physisorbed species of said first and second reactant gases and for maintaining a predetermined purge pressure within a range of purge pressures and a predetermined growth pressure within a range of growth pressures in said growth reactor chamber means. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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Specification