Method of making light influencing element for high resolution optical systems

• US 5,281,450 A
• Filed: 05/28/1993
• Issued: 01/25/1994
• Est. Priority Date: 06/01/1992
• Status: Expired due to Term

• Current Assignee: Advanced Technology Incubator Incorporated
• Original Assignee: Zvi Yaniv
• Inventors: Yaniv, Zvi
• Primary Examiner(s): PIANALTO, BERNARD D
• Application Number:
  US08/068,305
• Time in Patent Office: 242 Days
• Field of Search: 156/99, 156/145, 156/310, 427/108, 427/165, 427/169, 427/269, 427/270, 427/272, 427/289, 427/389.7, 427/393.5, 427/512, 427/514, 427/521, 427/557, 427/555, 427/595, 427/596
• US Class Current: 427/510
• CPC Class Codes: G02F 1/133512 Light shielding layers, e.g. black matrix G02F1/136209 takes precedence
• CPC Class Codes: G02F 1/133516 Methods for their manufacture, e.g. printing, electro-deposition or photolithography

Abstract

A light influencing element and the process of fabricating the same is disclosed, wherein the light influencing element is fabricated by disposing a layer of a substantially opaque material upon a transparent substrate. One or more openings or wells may then be cut or formed in the surface of the layer of opaque material. Into such openings a light influencing material is then disposed, preferable said materials are injected thereinto as by ink-jet type injection heads. Liquid crystal displays and subassemblies formed upon the light influencing elements of the instant invention are also provided.

Claims

1. A method of fabricating an element adapted to influence light, said method comprising the steps of:

providing a substantially transparent substrate member;

disposing a layer of a substantially opaque material upon one side of said substrate;

forming at least one opening through said layer of substantially opaque material by providing a high power excimer laser capable of at least micron scale resolution;

placing said substrate with said layer of opaque material in close proximity to said laser;

providing means for achieving relative movement between said laser and said opaque material coated substrate;

employing said laser to cut at least one opening in said layer of opaque material; and

disposing a light influencing material in said at least one opening, comprising the further steps of;

providing a light influencing material in non-solid phase having the optical characteristics thereof optimized for a desired application;

injecting a sufficient amount of said light influencing material into said openings so as to achieve a desired light influencing effect;

curing said non-solid light influencing material to the solid phase;

providing an infrared oven means; and

disposing said substrate, layer of opaque material and light influencing material in said infrared oven means so as to solidify said light influencing material.

2. A method as in claim 1, wherein the step of providing a substantially transparent substrate member includes the further step of selecting said member from the group of materials consisting of glass, plastic and combinations thereof.

3. A method as in claim 1, wherein the substantially opaque material is a black polyimide material.

4. A method as in claim 1, wherein the step of forming at least one via includes the further step of forming a plurality of similarly sized and shaped vias arranged in a densely packed, uniformly spaced array.

5. A method as in claim 1, wherein the step of injecting light influencing material into said openings includes the further steps of;

providing at least one nozzle for injecting said materials, in close proximity to one of said openings; and

providing means for achieving relative movement between said nozzle and said opaque material coated substrate, for disposing light influencing material into each preselected ones of said openings.