Dewall plating technique

• US 5,281,769 A
• Filed: 11/04/1991
• Issued: 01/25/1994
• Est. Priority Date: 11/05/1990
• Status: Expired due to Term

• Current Assignee: Nippon Telegraph and Telephone Corporation
• Original Assignee: Nippon Telegraph and Telephone Corporation
• Inventors: Hirano, Makoto, Tokumitsu, Tsuneo, Toyoda, Ichihiko, Tokumitsu, Masami, Imai, Yuhki, Asai, Kazuyoshi
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): Figlin, Cheryl R.
• Application Number:
  US07/787,136
• Time in Patent Office: 813 Days
• Field of Search: 174/261, 174/250, 361/412, 257/379, 257/528
• US Class Current: 174/250
• CPC Class Codes: H01L 21/28581 Deposition of Schottky electrodes
• CPC Class Codes: H01L 21/28587 characterised by the sectional shape, e.g. T, inverted T
• CPC Class Codes: H01L 21/28593 asymmetrical sectional shape
• CPC Class Codes: H01L 2223/6627 Waveguides, e.g. microstrip line, strip line, coplanar line
• CPC Class Codes: H01L 23/5221 Crossover interconnections
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 23/5283 Cross-sectional geometry
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 27/13 combined with thin-film or thick-film passive components
• CPC Class Codes: H01L 29/66863 Lateral single gate transistors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/1903 including wave guides

Abstract

A new design concept is presented and demonstrated for the fabrication of active and passive components in integrated circuit (IC) devices for microwave signal transmission. High circuit packing density is desirable but the current configurations of the conventional flat strip type conductors present physical limitations to achieving such an objective. The new conductor configuration not only overcomes such circuit packing problems of the conventional line design, but provides additional improvements in performance parameters, such as lower circuit resistance and lower parasitic interactions; an ability to fabricate circuits to design specifications and to improve reliability at low cost. The new concept has been applied to the fabrication of transmission lines, capacitors, inductors, air bridges and to formulating the fabrication steps for a FET. Polyimide film enables an improved fabrication step to be performed in the invention, and a new processing technique for polyimide material has also been demonstrated.

Claims

1. A circuit means in an integrated circuit fabricated on a semiconductor substrate, comprising:

signal transmission means, extending from the substrate, for transmitting signals; and

ground line means separated from said signal transmission means;

wherein at least one of said transmission means and said ground line means has a cross-sectional shape including a rectangular portion, the vertical size of which is longer than the horizontal size thereof.

2. The circuit means of claim 1, wherein

the ground line means is a planar ground conductor parallel to the substrate and

the signal transmission means is a vertically disposed opposing conductive body extending from the planar ground conductor and substrate and having a cross-sectional shape of one of an I, a T, and L, a U, and an inverted L;

the circuit means including an insulative layer between the planar ground conductor and the conductive body.

3. The circuit means of claim 1, wherein the signal transmission means and the ground line means each have a rectangular portion extending from the substrate, the ground line means parallel to and spaced from the signal transmission means, at least one of said signal transmission means and said ground line means has a cross-sectional shape of one of an I, a T, an L, a U, and an inverted L, the circuit means including an insulative layer between the ground line means and the signal transmission means.

4. The circuit means of claim 1, wherein the signal transmission means includes a rectangular portion attached to and extending from the substrate and

the ground line means includes a pair of ground lines parallel to and spaced equidistant from the rectangular portion of said signal transmission means;

wherein at least one of said signal transmission means and said ground lines has a cross-sectional shape of one of an I, a T, an L, a U, and an inverted L.

5. A spiral inductive line element comprising a vertical strip of a rectangular cross sectional shape formed on a horizontal insulating substrate material, wherein said line element is in contact with the substrate material locally in spots to support remaining portions of the line element above the substrate material and said line element has a cross-sectional shape of one of an I, a T, an L, a U, and an inverted L.

6. A inductive line of a vertical rectangular cross sectional shape, having a width and a depth;

said inductive line comprising;

an inner terminal end adapted for use as a lead-in terminal and

a spiral central line element, wherein;

(a) said inner terminal end is formed on an horizontal insulating substrate material wherein the width of the inner terminal is widest at an outer section, and becomes narrower toward an innermost portion of said inner terminal; and

(b) said inductive line element is formed on a plane distally separated from the substrate material.

7. The inductive line element as claimed in claim 6, wherein said inner terminal end is disposed on said distal plane, and said inductive line element is disposed on the substrate material.

8. The inductive line element as claimed in claim 6, wherein the line conductor is in contact with the substrate material locally to provide structural support while the rest of the portion of the line element are separated away from the substrate material;

and wherein the inner terminal end, including the innermost circular section, is in contact with the substrate material.