Contactless microcircuit card

• US 5,283,423 A
• Filed: 02/24/1992
• Issued: 02/01/1994
• Est. Priority Date: 03/15/1991
• Status: Expired due to Term

• Current Assignee: NXP B.V. (NXP Semiconductors NV)
• Original Assignee: US Philips Corporation (Koninklijke Philips N.V.)
• Inventors: Molko, Henri, Venambre, Jacques
• Primary Examiner(s): SHEPPERD, JOHN W
• Application Number:
  US07/840,368
• Time in Patent Office: 708 Days
• Field of Search: 257/679, 235/492, 235/449, 174/254, 361/398
• US Class Current: 235/492
• CPC Class Codes: G06K 19/07728 the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48228 the bond pad being disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/0102 Calcium [Ca]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01087 Francium [Fr]

Abstract

The invention relates to a microcircuit card having a card support with a cavity in which a cover foil (200) is fixed, which foil (200) includes a circuit support (20) and at least one circuit (210) arranged on an inner surface of the circuit support (20) facing towards the interior of the cavity, the circuit (210) being arranged opposite a first portion of a bottom of the cavity. The circuit support (20) includes on its lower surface at least one energy transfer element (220) arranged opposite a second portion of the bottom of the cavity at a distance from the first portion.

Claims

1. A microcircuit card comprising a card support which has a cavity in which a cover foil is fixed, which foil has a circuit support and at least one circuit arranged on a lower surface of the circuit support facing towards the interior of the cavity, the circuit being provided opposite a first portion of a bottom of the cavity, characterized in that the circuit support comprises on its lower surface at least one energy transfer element arranged opposite a second portion of the bottom of the cavity remote from said first portion.

2. A card as claimed in claim 1, characterized in that the circuit support is a flexible printed circuit with the energy transfer element patterned thereon.

3. A card as claimed in claim 1, characterized in that at least one energy transfer element is a coil.

4. A card as claimed in claim 1 to 3, characterized in that the bottom comprises at least one thinned part situated at least substantially outside said first portion.

5. A card as claimed in claim 1, characterized in that the said second portion is arranged close to a lateral edge of the cavity.

6. A card as claimed in claim 1, characterized in that at least one part of the second portion of the bottom of the cavity has a region of increased thickness.

7. A card as claimed in claim 1, characterized in that said increased thickness is such that the energy transfer element is substantially in contact therewith.