Process for flip chip connecting a semiconductor chip
First Claim
1. A process for flip chip connection of a semiconductor chip, in which solder bumps formed on the semiconductor chip in a matrix, arrangement are mated with a solder bumps formed on corresponding circuit board for flip chip connection, the process of said flip chip connection comprising the steps of:
- forming a plurality of stud bumps on the semiconductor chip, on which a plurality of solder bumps are formed in the vicinity of the outer periphery thereof and the outer side of said solder bumps;
providing a cutting groove between a plurality of said solder bumps and said stud bumps;
mating the solder bumps on said semiconductor chip and the corresponding solder bumps on said circuit board and heating for integration of the mating solder bumps; and
breaking away the outer peripheral portion of said semiconductor chip along said cutting groove after a flip chip connection in order to remove said stud bumps.
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Accused Products
Abstract
A process for a flip chip connection of a semiconductor chip includes the steps of forming a plurality of stud bumps on the semiconductor chip, on which a plurality of solder bumps are formed, in the vicinity of the outer periphery thereof and on the outside of the solder bumps, providing a cut groove between a plurality of the solder bumps and the stud bumps, mating the solder bumps on the semiconductor chip and the corresponding solder bumps on the circuit board and heating for subsequent integration of the mating solder bumps, and breaking way the outer peripheral portion of the semiconductor chip along the cutting groove after a flip chip connection in order to remove the stud bumps.
230 Citations
6 Claims
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1. A process for flip chip connection of a semiconductor chip, in which solder bumps formed on the semiconductor chip in a matrix, arrangement are mated with a solder bumps formed on corresponding circuit board for flip chip connection, the process of said flip chip connection comprising the steps of:
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forming a plurality of stud bumps on the semiconductor chip, on which a plurality of solder bumps are formed in the vicinity of the outer periphery thereof and the outer side of said solder bumps; providing a cutting groove between a plurality of said solder bumps and said stud bumps; mating the solder bumps on said semiconductor chip and the corresponding solder bumps on said circuit board and heating for integration of the mating solder bumps; and breaking away the outer peripheral portion of said semiconductor chip along said cutting groove after a flip chip connection in order to remove said stud bumps. - View Dependent Claims (2, 3, 4, 5, 6)
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Specification