Vacuum-sealed silicon incandescent light

• US 5,285,131 A
• Filed: 12/03/1990
• Issued: 02/08/1994
• Est. Priority Date: 12/03/1990
• Status: Expired due to Fees

• Current Assignee: University of California
• Original Assignee: University of California Berkeley (University of California)
• Inventors: Mastrangelo, Carlos H., Muller, Richard S.
• Primary Examiner(s): Yusko, Donald J.
• Assistant Examiner(s): Patel, Ashok
• Application Number:
  US07/621,678
• Time in Patent Office: 1,163 Days
• Field of Search: 313/578, 313/580, 313/634, 313/636, 313/522, 313/495, 313/633, 313/315, 313/317, 313/324
• US Class Current: 313/578
• CPC Class Codes: G01J 3/108 for measurement in the infrared range
• CPC Class Codes: G01P 15/0894 by non-contact electron transfer, i.e. electron tunneling
• CPC Class Codes: G03F 7/00 Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor using photoresist structures for special production processes, see the relevant places, e.g. B44C, H01L, e.g. H01L21/00, H05K
• CPC Class Codes: H01J 21/105 with microengineered cathode and control electrodes, e.g. Spindt-type
• CPC Class Codes: H01J 61/30 Vessels; Containers
• CPC Class Codes: H01J 9/02 Manufacture of electrodes or electrode systems
• CPC Class Codes: H01K 1/04 characterised by the material thereof
• CPC Class Codes: H01K 1/12 Bodies which are non-conductive when cold, e.g. for Nernst lamp
• CPC Class Codes: H01K 1/28 Envelopes; Vessels
• CPC Class Codes: H01K 13/00 Lamps having an incandescent body which is substantially non-conductive until heated, e.g. Nernst lamp
• CPC Class Codes: H01K 3/00 Apparatus or processes adapted to the manufacture, installing, removal, or maintenance of incandescent lamps or parts thereof manufacture of vessels from glass C03B
• CPC Class Codes: H01K 7/04 for indicating

Abstract

A microlamp including a polysilicon filament coated with a protective layer and enclosed by a window in a vacuum-sealed cavity.

Claims

1. A microlamp, comprising:

a substrate;

a cavity formed in said substrate;

a polysilicon filament coated with a protective layer disposed in said cavity; and

a window means for vacuum sealing said cavity wherein radiation emitted by said filament is visible through said window means.

2. The microlamp of claim 1 wherein said protective layer is a silicon-nitride coating.

3. The microlamp of claim 2 wherein said window means is silicon nitride.

4. A microstructure comprising:

a substrate having a groove;

sealing means disposed over said groove to form a sealed cavity;

a filament suspended in said cavity, the ends of said filament connected to the sides of said cavity; and

means for heating said filament to cause said filament to produce radiation.

5. The microstructure of claim 4 wherein said filament is polysilicon.

6. The microstructure of claim 4 wherein said filament is a refractory metal.

7. The microstructure of claim 6 wherein said refractory metal is selected from the group consisting of tungsten, tantalum, platinum, palladium, molybdenum, zirconium, titanium, nickel and chromium.

8. The microstructure of claim 4 wherein said filament is coated with a protective layer.

9. The microstructure of claim 8 wherein said protective layer is silicon nitride.

10. The microstructure of claim 4 wherein said sealing means includes a window through which radiation from said filament may pass.

11. The microstructure of claim 4 wherein said radiation is electrons.

12. The microstructure of claim 4 wherein said filament is between 110 μ

m and 550 μ

m in length.