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Heat sink plate for multiple semi-conductors

  • US 5,285,350 A
  • Filed: 08/28/1992
  • Issued: 02/08/1994
  • Est. Priority Date: 08/28/1992
  • Status: Expired due to Term
First Claim
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1. A heat sink dissipating heat from one or more semiconductors on a printed circuit board comprising:

  • a plate having a top surface and a bottom surface,said plate being made of heat conductive material and having said bottom surface contacting the semiconductors to be cooled,said plate having at least one chimney means, each said chimney means including a tapered sidewall defining a first opening in said plate and a smaller second opening away from said plate, so as to convect heated air from the area adjacent to said bottom surface of said plate to the area adjacent to said top surface,attachment means connecting said bottom surface of said plate to the semiconductors so that said plate conducts heat generated by the semiconductors when the semiconductors are in operation, andconnecting means connecting said plate to a printed circuit board.

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