Pressure sensor having a laminated substrate
First Claim
1. In pressure sensor apparatus, the combination comprisingA. a substrate having first and second opposed sides, said substrate being laminated of at least first and second layers and having electrical conductors extending between said opposed sides in apertures through said substrate, and wherein said apertures are sealed pressure-wise,B. a bonding layer on said first side of said substrate,C. electrical connector elements connected with said electrical conductors and mounted on said substrate to extend from said second side of said substrate, said connector elements being disposed for removable and replaceable connection with mating connector elements, andD. a pressure sensing element having a sensor diaphragm and electrical contacts and developing at said electrical contacts an electrical signal responsive to diaphragm deflection, said sensing element being bonded by said bonding layer to said first side of said substrate and said contacts being connected electrically to said conductors, said sensing element defining a chamber between one side of said sensor diaphragm and said substrate and wherein said sensor diaphragm deflects in response to the pressure difference and between said chamber and the pressure on the other side of said sensing element.
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Accused Products
Abstract
A pressure sensor sub-assembly (18) has a solid-state sensing element (22) mounted on a laminated ceramic substrate (20) and has the electrical signal contacts (22a) on the sensing element electrically connected to connector pins (24) on the substrate. A manufacturing process can fabricate a batch of sub-assemblies on a substrate structure that is sub-divided to form the separate sub-assemblies. The sensor sub-assemblies can be tested, and graded, before or after the sub-division step, and then each mounted in a housing.
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Citations
15 Claims
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1. In pressure sensor apparatus, the combination comprising
A. a substrate having first and second opposed sides, said substrate being laminated of at least first and second layers and having electrical conductors extending between said opposed sides in apertures through said substrate, and wherein said apertures are sealed pressure-wise, B. a bonding layer on said first side of said substrate, C. electrical connector elements connected with said electrical conductors and mounted on said substrate to extend from said second side of said substrate, said connector elements being disposed for removable and replaceable connection with mating connector elements, and D. a pressure sensing element having a sensor diaphragm and electrical contacts and developing at said electrical contacts an electrical signal responsive to diaphragm deflection, said sensing element being bonded by said bonding layer to said first side of said substrate and said contacts being connected electrically to said conductors, said sensing element defining a chamber between one side of said sensor diaphragm and said substrate and wherein said sensor diaphragm deflects in response to the pressure difference and between said chamber and the pressure on the other side of said sensing element.
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12. Pressure sensor apparatus having a minimum testable format and for post-testing assembly in a housing, said pressure sensor apparatus comprising
A. a ceramic substrate having first and second opposed sides, said substrate being laminated of at least first and second layers apertured with a through pressure passage, said substrate further having electrical conductors extending between said opposed sides, said substrate being pressure-tight between said opposed sides except at said pressure passage, B. a bonding layer on said first side of said substrate, C. electrical connector elements mounted on said substrate and connected with said electrical conductors, said connector elements extending from said substrate and being disposed for removable and replaceable connection with mating connector elements, D. a solid-state pressure sensing element having a sensor diaphragm and electrical contacts and developing at said electrical contacts and electrical signal responsive to diaphragm deflection, said sensing element being bonded to said first side of said substrate by said bonding layer and said contacts being connected electrically to said conductors, E. whereby the electrical response of said sensing element to pressure differentials between said first side and said pressure passage can be tested at said connector elements before the post-testing assembly.
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13. In pressure sensor apparatus, the combination comprising
A. a substrate having a first side, said substrate being laminated of at least first and second layers and having electrical conductors extending from said first side in apertures through said substrate, and wherein said apertures are closed pressure-wise, B. a bonding layer on said first side of said substrate, C. electrical connector elements connected with said electrical conductors and mounted on said substrate to extend therefrom for removable and replaceable connection with mating connector elements, and D. a pressure sensing element having a sensor diaphragm and electrical contacts, and developing at said electrical contacts an electrical signal responsive to diaphragm defection, said sensing element being bonded by said bonding layer to said first side of said substrate and said contacts being connected electrically to said conductors, said sensing element defining a chamber between one side of said sensor diaphragm and said substrate and wherein said sensor diaphragm deflects in response to the pressure difference and between said chamber and the pressure on the other side of said sensing element.
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15. Pressure sensor apparatus having a minimum testable format and for post-testing assembly in a housing, said pressure sensor apparatus comprising
A. a dielectric substrate having a first side and being laminated of at least first and second layers apertured with a through pressure passage, said substrate having electrical conductors exposed on said first side, B. a bonding layer on said first side of said substrate, C. electrical connector elements mounted on said substrate and connected with said electrical conductors, said connector elements extending from said substrate for removable and replaceable connection with mating connector elements, D. a solid-state pressure sensing element having a sensor diaphragm and electrical contacts and developing at said electrical contacts an electrical signal responsive to diaphragm deflection, said sensing element being bonded to said first side of said substrate by said bonding layer and said contacts being connected electrically to said conductors, E. whereby the electrical response of said sensing element to pressure differentials between said first side and said pressure passage can be tested at said connector elements before the post-testing assembly.
Specification