Method for attaching a semiconductor die to a leadframe using a patterned adhesive layer

• US 5,286,679 A
• Filed: 03/18/1993
• Issued: 02/15/1994
• Est. Priority Date: 03/18/1993
• Status: Expired due to Term

• Current Assignee: Round Rock Research LLC
• Original Assignee: Micron Technology, Inc.
• Inventors: Moden, Walter, Farnworth, Warren M., Shrock, Ed A., Clifford, Scott, King, Jerrold L.
• Primary Examiner(s): NOT, DEFINED
• Assistant Examiner(s): Picardat, Kevin M.
• Application Number:
  US07/033,140
• Time in Patent Office: 334 Days
• Field of Search: 437/209, 437/211, 437/217, 437/220, 437/214, 437/206
• US Class Current: 438/118
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/06136 Covering only the central area of the surface to be connected, i.e. central arrangements
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/4826 Connecting between the body and an opposite side of the item with respect to the body
• CPC Class Codes: H01L 2224/73215 Layer and wire connectors
• CPC Class Codes: H01L 2224/83855 Hardening the adhesive by curing, i.e. thermosetting
• CPC Class Codes: H01L 2224/8388 Hardening the adhesive by cooling, e.g. for thermoplastics or hot-melt adhesives
• CPC Class Codes: H01L 2224/85447 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 23/4951 Chip-on-leads or leads-on-chip techniques, i.e. inner lead fingers being used as die pad
• CPC Class Codes: H01L 23/49513 having bonding material between chip and die pad
• CPC Class Codes: H01L 24/06 of a plurality of bonding areas
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/3512 : Cracking

Abstract

An improved method for attaching a semiconductor die to a leadframe is provided The improved method comprises forming a patterned adhesive layer on a side of a semiconductor wafer prior to singulation of the dies from the wafer. The adhesive layer is patterned such that wire bonding pads on the dies, as well as the streets between the dies, are free of adhesive material The adhesive layer may be deposited and patterned using a hot or cold screen printing process, by depositing and photopatterning a photosensitive adhesive, or using a resist etch back method. During a packaging process for attaching a die to a leadframe, the adhesive layer is heated and the lead fingers of the leadframe are placed in contact with the die under pressure. In an alternate embodiment of the invention, the lead fingers, rather than a side of the dies, are coated with an adhesive layer.

Claims

1. A method of attaching a semiconductor die formed with a plurality of bonding pads to a leadframe having a plurality of continuous metal lead fingers adapted to extend across a surface of the die for attachment to the bonding pads using fine bond wires, comprising:

depositing an adhesive selected from the group consisting of thermoplastic adhesives or thermosetting adhesives on the die and patterning the adhesive to form a preapplied patterned adhesive layer on a surface of the die with the bonding pads of the die free of adhesive;

heating the adhesive layer during a packaging process; and

pressing the die, heated adhesive layer and lead fingers of the leadframe together during the packaging process to bond the adhesive layer and lead fingers and attach the lead fingers to the die.

2. The method as claimed in claim 1 and wherein the die is coated with an adhesive layer by depositing a patterned liquid adhesive layer on a front side of a wafer formed with a plurality of dies.

3. The method as claimed in claim 2 and wherein the adhesive layer is patterned such that the streets on the wafer between the dies are free of adhesive.

4. The method as claimed in claim 3 and wherein a liquid adhesive is deposited and patterned using a screen printing process.

5. The method as claimed in claim 3 and wherein a photosensitive liquid adhesive is deposited and patterned by a photopatterning/etching process and then hard baked to form the adhesive layer.

6. The method as claimed in claim 1 and wherein a liquid adhesive is deposited and patterned using a resist etch back process.

7. The method as claimed in claim 1 and wherein a liquid adhesive is deposited and patterned on a back side of a wafer formed with a plurality of dies.

8. The method as claimed in claim 3 and wherein the adhesive layer is heated during the packaging process by heating the leadframe.

9. The method as claimed in claim 3 and wherein the adhesive layer is heated during the packaging process by heating the die.

10. In semiconductor manufacture a method for attaching a semiconductor die to a leadframe, having a plurality of continuous metal lead fingers, said method comprising:

forming a semiconductor wafer with a plurality of semiconductor dies having bond pads electrically connected to integrated circuits;

coating a side of the wafer and dies with an adhesive selected from the group consisting of thermoplastic or thermosetting adhesives and patterning the adhesive to form a patterned adhesive layer on the wafer with the bond pads free of adhesive;

separating the dies from the wafer;

heating the patterned adhesive layer during a packaging process;

pressing the lead fingers of the leadframe to a side of the adhesive coated die during the packaging process to bond the adhesive layer and leadframe and attach the lead fingers to the die; and

continuing the packaging process.

11. The method as claimed in claim 10 and wherein a liquid adhesive is deposited and patterned using a hot screen printing process.

12. The method as claimed in claim 10 and wherein a liquid adhesive is deposited and patterned using a cold screen printing process.

13. The method as claimed in claim 10 and wherein a liquid adhesive is deposited and patterned using a solvent.

14. The method as claimed in claim 10 and wherein a photosensitive the liquid adhesive is deposited and patterned using a photopatterning process and is hard baked.

15. The method as claimed in claim 10 and wherein a liquid adhesive is deposited and patterned using a resist etch back process.

16. The method as claimed in claim 10 and wherein the adhesive layer is formed on a front side of the die for attaching a lead-on-chip (LOC) die to a lead-on-chip (LOC) leadframe.

17. The method as claimed in claim 10 and wherein the adhesive layer is formed on a backside of the wafer for attaching a lead-under-chip (LUC) die to a leadframe or for chip stacking.

18. The method as claimed in claim 10 and wherein the adhesive layer has a thickness of from about 8 μ

m to about 200 μ

m.

19. The method as claimed in claim 19 and wherein the adhesive layer is formulated to function as an insulating/passivating layer for the wafer.

20. A method for attaching a semiconductor die to a leadframe for a semiconductor package, comprising:

providing a leadframe having a plurality of continuous lead fingers adapted to extend over a side of the die;

applying an adhesive selected from the group consisting of thermoplastic adhesives or thermosetting adhesives to an underside of the lead fingers in a pattern that matches a placement of the lead fingers over the die to form a preapplied patterned adhesive layer;

heating the patterned adhesive layer during a packaging process; and

pressing the lead fingers, adhesive layer and die together to bond the adhesive layer and die and attach the lead fingers to the die.

21. The method as claimed in claim 20 and wherein a liquid adhesive is applied to the lead fingers and patterned to form the adhesive layer using a screen printing process.

22. The method as claimed in claim 20 and wherein the die is a lead-on-chip (LOC) die.