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Method for attaching a semiconductor die to a leadframe using a patterned adhesive layer

  • US 5,286,679 A
  • Filed: 03/18/1993
  • Issued: 02/15/1994
  • Est. Priority Date: 03/18/1993
  • Status: Expired due to Term
First Claim
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1. A method of attaching a semiconductor die formed with a plurality of bonding pads to a leadframe having a plurality of continuous metal lead fingers adapted to extend across a surface of the die for attachment to the bonding pads using fine bond wires, comprising:

  • depositing an adhesive selected from the group consisting of thermoplastic adhesives or thermosetting adhesives on the die and patterning the adhesive to form a preapplied patterned adhesive layer on a surface of the die with the bonding pads of the die free of adhesive;

    heating the adhesive layer during a packaging process; and

    pressing the die, heated adhesive layer and lead fingers of the leadframe together during the packaging process to bond the adhesive layer and lead fingers and attach the lead fingers to the die.

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