Semiconductor die packages having lead support frame

• US 5,286,680 A
• Filed: 07/09/1992
• Issued: 02/15/1994
• Est. Priority Date: 12/07/1988
• Status: Expired due to Fees

• Current Assignee: Cerprobe Corporation (Kulicke and Soffa Industries Incorporated)
• Original Assignee: Tribotech, Co.
• Inventors: Cain, Earl S.
• Primary Examiner(s): Hearn, Brian E.
• Assistant Examiner(s): Picardat, Kevin M.
• Application Number:
  US07/912,032
• Time in Patent Office: 586 Days
• Field of Search: 437/216, 437/217, 437/220, 437/209, 437/214
• US Class Current: 29/827
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 23/49572 consisting of thin flexible metallic tape with or without a film carrier H01L23/49503 - H01L23/49568 and H01L23/49575 - H01L23/49579 take precedence
• CPC Class Codes: H01L 23/4985 Flexible insulating substrates H01L23/49572 and H01L23/49855 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: Y10T 29/49004 including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/49121 Beam lead frame or beam lead device
• CPC Class Codes: Y10T 29/53183 Multilead component
• CPC Class Codes: Y10T 29/53265 with work-holder for assembly

Abstract

A process for forming a lead pack including a frame of electrical insulating material with a plurality of spaced embedded leads extending inwardly and outwardly from said frame. Additionaly connecting the inwardly extending leads to the contact pads of a semiconductor device and the outwardly extending leads to a transport tape for testing.

Claims

1. A method of forming a lead pack comprising the steps of:

forming in a conductive foil such as copper a plurality of elongated spaced windows extending outwardly from a central area to define therebetween flat spaced elongated leads having an inner end at said central area and extending outwardly from said central area;

applying first and second frame members of electrical insulating material, one to each side of said elongated leads spaced from the inner ends of said leads;

pressing said frame members together so that they join to imbed and support the leads; and

excising the foil adjacent the two ends of the leads to form a lead pack comprising a frame of electrical insulating material supporting a plurality of spaced leads extending inwardly and outwardly from said frame.

2. A method of forming a lead pack as in claim 1 including the additional step of die forming boding bumps or dimples on the inwardly extending ends of said leads prior to excising said foil.

3. A method of forming a lead pack as in claim 1 or 2 including the additional step of plating said inwardly extending leads.

4. A tape automated bonding, packaging and testing process for semiconductor devices comprising the steps of:

forming a lead pack including the steps of;

forming in a conductive foil such as copper, a plurality of elongated, spaced windows extending outwardly from a central area to define therebetween flat, spaced elongated leads having an inner end at said central area and extending outwardly from said central area;

applying first ad second frame members of electrical insulating material, one to each side of said elongated leads spaced from the inner end of said leads;

pressing said frame members together so that they join to imbed and support the leads;

excising the foil adjacent the two ends of the leads to form a lead pack comprising a frame of electrical insulating material supporting a plurality of spaced leads extending inwardly and outwardly from said frame;

attaching the outer end of the leads of the lead pack to spaced splayed conductors carried by transport tape and extending between ends which receive the lead pack leads and ends which include test pads; and

electrically connecting the inner ends of the lead pack leads to the contact pads of a semiconductor device.

5. A tape automated bonding, packaging and testing process as in claim 4 including the step of housing said semiconductor in a housing which seals to the frame material.

6. A tape automated bonding process as in claim 5 including the additional steps of excising the spaced package leads and thereafter removing the ends of said leads which are fixed to the tape transport for reception of a new lead pack.