Semiconductor die packages having lead support frame
First Claim
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1. A method of forming a lead pack comprising the steps of:
- forming in a conductive foil such as copper a plurality of elongated spaced windows extending outwardly from a central area to define therebetween flat spaced elongated leads having an inner end at said central area and extending outwardly from said central area;
applying first and second frame members of electrical insulating material, one to each side of said elongated leads spaced from the inner ends of said leads;
pressing said frame members together so that they join to imbed and support the leads; and
excising the foil adjacent the two ends of the leads to form a lead pack comprising a frame of electrical insulating material supporting a plurality of spaced leads extending inwardly and outwardly from said frame.
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Abstract
A process for forming a lead pack including a frame of electrical insulating material with a plurality of spaced embedded leads extending inwardly and outwardly from said frame. Additionaly connecting the inwardly extending leads to the contact pads of a semiconductor device and the outwardly extending leads to a transport tape for testing.
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Citations
6 Claims
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1. A method of forming a lead pack comprising the steps of:
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forming in a conductive foil such as copper a plurality of elongated spaced windows extending outwardly from a central area to define therebetween flat spaced elongated leads having an inner end at said central area and extending outwardly from said central area; applying first and second frame members of electrical insulating material, one to each side of said elongated leads spaced from the inner ends of said leads; pressing said frame members together so that they join to imbed and support the leads; and excising the foil adjacent the two ends of the leads to form a lead pack comprising a frame of electrical insulating material supporting a plurality of spaced leads extending inwardly and outwardly from said frame. - View Dependent Claims (2, 3)
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4. A tape automated bonding, packaging and testing process for semiconductor devices comprising the steps of:
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forming a lead pack including the steps of; forming in a conductive foil such as copper, a plurality of elongated, spaced windows extending outwardly from a central area to define therebetween flat, spaced elongated leads having an inner end at said central area and extending outwardly from said central area; applying first ad second frame members of electrical insulating material, one to each side of said elongated leads spaced from the inner end of said leads; pressing said frame members together so that they join to imbed and support the leads; excising the foil adjacent the two ends of the leads to form a lead pack comprising a frame of electrical insulating material supporting a plurality of spaced leads extending inwardly and outwardly from said frame; attaching the outer end of the leads of the lead pack to spaced splayed conductors carried by transport tape and extending between ends which receive the lead pack leads and ends which include test pads; and electrically connecting the inner ends of the lead pack leads to the contact pads of a semiconductor device. - View Dependent Claims (5, 6)
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Specification