Optical isolation amplifier with sigma-delta modulation

• US 5,287,107 A
• Filed: 06/05/1992
• Issued: 02/15/1994
• Est. Priority Date: 06/05/1992
• Status: Expired due to Term

• Current Assignee: Avago Technologies ECBU IP Singapore Pte Limited (Broadcom, Inc.)
• Original Assignee: Hewlett-Packard Company (HP Inc.)
• Inventors: McJimsey, Michael D., Gampell, David J., Canha, Randall, Lovelace, Ralph E.
• Primary Examiner(s): Hoff, Marc S.
• Application Number:
  US07/893,786
• Time in Patent Office: 620 Days
• Field of Search: 341/110, 341/137, 341/143
• US Class Current: 341/137
• CPC Class Codes: G01R 15/22 using light-emitting devices, e.g. LED, optocouplers G01R31/31901 takes precedence
• CPC Class Codes: H03M 3/368 of noise other than the quantisation noise already being shaped inherently by delta-sigma modulators

Abstract

The present invention provides an optical isolation amplifier which generates a low-noise analog output signal linearly related to an analog input signal and which conveniently fits within a conventional 8-pin dual in-line package. The optical isolation amplifier package includes an input chip having a sigma-delta analog-to-digital (A/D) converter for converting an analog input signal to a digital signal. The sigma-delta converter is used to modulate an off-chip LED which optically transmits the signal to a photodetector on a separate output chip having an accurate optical recovery section for reproducing the transmitted signal. Also contained on the output chip is a digital-to-analog (D/A) converter for converting the digital signal to an analog output signal linearly related to the analog input signal.

Claims

1. An optical isolation amplifier package comprising:

an input chip having a chopper-stabilized sigma-delta converter for converting an analog input signal to a digital signal;

a light source for optically transmitting the digital signal; and

an output chip having;

means for detecting the optically transmitted digital signal; and

means for converting the optically transmitted digital signal into an analog output signal substantially proportional to the analog input signal.

2. The optical isolation amplifier package of claim 1, wherein the input chip further comprises at least one input pad for receiving the analog input signal and a clamping circuit coupled to the pad for clamping the analog input signal and inhibiting substrate current in a CMOS chip.

3. The optical isolation amplifier package of claim 2, wherein each input pad comprises a p-channel punch through device.

4. The optical isolation amplifier package of claim 1, further comprising an edge encoder on the input chip coupled to the sigma-delta converter.

5. The optical isolation amplifier package of claim 4, wherein the means for converting the transmitted digital signal to the analog output signal comprises an edge decoder.

6. The optical isolation amplifier package of claim 5, wherein the edge encoder comprises an oscillator, and the edge decoder comprises a timing circuit which tracks the oscillator.

7. The optical isolation amplifier package of claim 1, wherein the input chip and the output chip are both cut from a single semiconductor wafer.

8. The optical isolation amplifier package of claim 1, wherein the input chip further comprises an input chip reference voltage generator, and the output chip further comprises an output chip reference voltage generator matched with the input chip reference voltage generator.

9. The optical isolation amplifier package of claim 1, wherein the input chip and the output chip are both housed in a single dual in-line package.

10. An optical isolation amplifier comprising:

input pads for receiving an analog input signal;

a sigma-delta converter coupled to the input pads for converting the analog input signal to a digital pulse stream;

an encoder coupled to the sigma-delta converter for converting the digital pulse stream to edge-encoded digital signals; and

an optical transmitter/receiver coupled to the encoder for transmitting an optical signal indicative of the digital signal over an optical channel and detecting the transmitted optical signal.

11. The optical isolation amplifier of claim 10 further comprising:

an optical recovery circuit coupled to the optical transmitter/receiver for converting the detected signal to a digital output signal substantially similar to the digital signal; and

a digital-to-analog converter coupled to the optical recovery circuit for converting the digital output signal to an analog output signal linearly related to the analog input signal.

12. The optical isolation amplifier of claim 10 further comprising a decoder circuit coupled between the optical recovery circuit and the digital-to-analog converter.

13. The optical isolation amplifier of claim 10 further comprising an analog filter coupled to output of the digital-to-analog converter.

14. The optical isolation amplifier of claim 10, wherein each input pad comprises a p-channel punch-through device.

15. The optical isolation amplifier of claim 10, wherein each input pad comprises clamping circuitry for clamping the analog input voltage at a sufficient level below ground for preventing substrate current in a CMOS chip.

16. The optical isolation amplifier of claim 10, wherein the sigma-delta converter comprises chopper-stabilized operational amplifiers.

17. The optical isolation amplifier of claim 10 wherein the optical transmitter/receiver comprises a light-emitting diode and a photodiode.

18. The optical isolation amplifier of claim 10, wherein the optical isolation amplifier is housed within a dual in-line package.

19. A method for sensing signals in a system comprising the steps of:

providing an optical isolation amplifier having an input chip including a sigma-delta analog-to-digital converter optically coupled to an output chip;

passing an analog voltage input signal into the isolation amplifier;

converting the analog voltage signal to a plurality of digital pulses having a time-average value substantially equal to the analog voltage input signal;

edge-encoding the digital pulses; and

modulating a light emitting diode with the edge-encoded digital pulses.

20. The method of claim 19 further comprising the step of converting the digital pulses to analog voltage output signals substantially proportional to the analog voltage input signals.

21. The method of claim 19, wherein the step of providing an optical isolation amplifier comprises providing the input chip and the output chip within a single dual in-line package.

22. An optical isolation amplifier package comprising:

an input chip having a p-channel punch-through device coupled to a sigma-delta converter for receiving an analog signal and converting the analog signal to a digital signal;

a light source for optically transmitting the digital signal; and

an output chip optically coupled to the light source for receiving the digital signal.

23. The optical isolation amplifier package of claim 22 further comprising means coupled to the sigma-delta convertor for edge-encoding the digital signal before it is optically transmitted by the light source.