Layer frequency selective surface assembly and method of modulating the power or frequency characteristics thereof
First Claim
1. A layered frequency selective surface assembly device comprising:
- a dielectric substrate layer;
at least one conductive layer of electrically conductive elements arranged in array configuration, said at least one conductive layer overlapping and spaced apart from said dielectric substrate layer; and
layer positioning means, coupled to one of either said dielectric substrate layer and said at least one conductive layer, for selectively varying the distance between the dielectric substrate layer and said at least one conductive layer so as to tune the layered frequency selective surface assembly device to a position where externally provided signals are either reflected or accepted in accordance with each signal'"'"'s characteristics.
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Accused Products
Abstract
The power or frequency characteristics of a layered frequency selective surface assembly (1) having a dielectric substrate layer (2) and, superimposed therewith at a spacing (X) therefrom, at least one layer (3) of electrically conductive elements (4) disposed in an array, is modulated by moving at least one layer (2, 3) relative to the or each other layer (2, 3). The layers (2, 3) maybe substantially planar or substantially non-planar and may be disposed substantially parallel to one another. Relative movement between the layers (2, 3) may retain the substantially parallel orientation or may not retain the substantially parallel orientation. The relative movement may have the effect of changing the spacing between the layers (2, 3) for example to tilt, skew or rotate one layer relative to the or each other layer.
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Citations
12 Claims
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1. A layered frequency selective surface assembly device comprising:
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a dielectric substrate layer; at least one conductive layer of electrically conductive elements arranged in array configuration, said at least one conductive layer overlapping and spaced apart from said dielectric substrate layer; and layer positioning means, coupled to one of either said dielectric substrate layer and said at least one conductive layer, for selectively varying the distance between the dielectric substrate layer and said at least one conductive layer so as to tune the layered frequency selective surface assembly device to a position where externally provided signals are either reflected or accepted in accordance with each signal'"'"'s characteristics. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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Specification