×

Layer frequency selective surface assembly and method of modulating the power or frequency characteristics thereof

  • US 5,287,118 A
  • Filed: 06/11/1991
  • Issued: 02/15/1994
  • Est. Priority Date: 07/24/1990
  • Status: Expired due to Term
First Claim
Patent Images

1. A layered frequency selective surface assembly device comprising:

  • a dielectric substrate layer;

    at least one conductive layer of electrically conductive elements arranged in array configuration, said at least one conductive layer overlapping and spaced apart from said dielectric substrate layer; and

    layer positioning means, coupled to one of either said dielectric substrate layer and said at least one conductive layer, for selectively varying the distance between the dielectric substrate layer and said at least one conductive layer so as to tune the layered frequency selective surface assembly device to a position where externally provided signals are either reflected or accepted in accordance with each signal'"'"'s characteristics.

View all claims
  • 3 Assignments
Timeline View
Assignment View
    ×
    ×