Solid state imaging device having a chambered imaging chip corner

• US 5,291,010 A
• Filed: 10/03/1991
• Issued: 03/01/1994
• Est. Priority Date: 10/04/1990
• Status: Expired due to Term

• Current Assignee: Olympus Optical Corporation Limited (Olympus Corporation)
• Original Assignee: Olympus Optical Corporation Limited (Olympus Corporation)
• Inventors: Tsuji, Kiyoshi
• Primary Examiner(s): Nelms, David C.
• Assistant Examiner(s): LE, QUE TAN
• Application Number:
  US07/770,274
• Time in Patent Office: 880 Days
• Field of Search: 250/208.1, 250/208.5, 358/98, 358/229, 358/213.11, 128/6, 257/433
• US Class Current: 250/208.1
• CPC Class Codes: A61B 1/05 characterised by the image sensor, e.g. camera, being in the distal end portion
• CPC Class Codes: A61B 1/051 Details of CCD assembly
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H04N 23/55 Optical parts specially adapted for electronic image sensors; Mounting thereof
• CPC Class Codes: H04N 23/555 for picking-up images in sites, inaccessible due to their dimensions or hazardous conditions, e.g. endoscopes or borescopes

Abstract

This invention is a solid state imaging device provided with an imaging chip having an imaging area and a package enclosing this imaging chip wherein, among a plurality of corners of the image area on the imaging chip, a plurality of corners of the imaging chip and a plurality of corners of the above mentioned package, at least one corner in each corresponding position is chamfered. The chamfered corner of the image area is a region not required to display pictures and does not reduce the displaying performance. In the electronic endoscope, the above mentioned solid state imaging device is arranged within the small area of the insertable section with the chamfered corner directed to the outside.

Claims

1. A solid state imaging device, comprising:

an imaging chip having an imaging area for imaging an image and a package for enclosing said imaging chip, wherein at least one corner at a corresponding position in said imaging chip, and said package is chamfered.

2. A solid state imaging device according to claim 1, wherein three corners at corresponding positions of the imaging chip and the package are chamfered.

3. A solid state imaging device according to claim 1, wherein said imaging chip has transfer lines for receiving electric charges from said image area, and wherein said at least one corner at a corresponding position of said imaging chip and said package, which is opposite a side on which said transfer lines are arranged, is chamfered.

4. A solid state imaging device according to claim 1, wherein said solid state imaging device is arranged in an electronic endoscope having an insertable section, and wherein at least one corner of each of said imaging chip and said package which is positioned on the outer peripheral side of the insertable section of said electronic endoscope is chamfered.

5. A solid state imaging device according to claim 1, wherein said solid state imaging device is arranged in an electronic endoscope having an insertable section, and wherein at least one corner of each of said imaging chip and said package, which is positioned inside the insertable section of said electronic endoscope, is chamfered.

6. A solid state imaging device, comprising:

an imaging chip having an imaging area for imaging an image and a package for enclosing said imaging chip, wherein at least one corner at a corresponding position in the image area on said imaging chip, said imaging chip, and said package is chamfered.

7. A solid state imaging device according to claim 6, wherein three corners at corresponding positions of the image area on said imaging chip, the imaging chip and the package are chamfered.

8. A solid state imaging device according to claim 6, wherein said imaging chip has transfer lines for receiving electric charges from said image area, and

wherein said at least one corner at a corresponding position of the image area on said imaging chip, said imaging chip and said package, which is opposite a side on which said transfer lines are arranged, is chamfered.

9. A solid state imaging device according to claim 8, wherein said imaging chip has electrodes for inputting and for outputting electric charges received by said transfer lines or for receiving signals from an outside source;

and

wherein said electrodes are located on a side on which non-chamfered corners of said imaging chip and corners of packages are arranged.

10. A solid state imaging device according to claim 8, wherein said imaging chip has electrodes for inputting and for outputting electric charges received by said transfer lines or for receiving signals from an outside source;

wherein said electrodes are located in non-chamfered corners of said imaging chip and on the side on which a plurality of packages are arranged.

11. A solid state imaging device according to claim 6,

wherein said solid state imaging device is arranged in an electronic endoscope having an insertable section, and wherein at least one corner of each of the image area on said imaging chip to be chamfered, said imaging chip and said package which is positioned on the outer peripheral side of the insertable section of said electronic endoscope is chamfered.

12. A solid state imaging device according to claim 6,

wherein said solid state imaging device is arranged in an electronic endoscope having an insertable section, and wherein at least one corner of each of the image area on said imaging chip to be chamfered, said imaging chip and said package, which is positioned inside the insertable section of said electronic endoscope, is chamfered.

13. An electronic endoscope having an insertable section tip portion, comprising a solid state imaging device provided with an imaging chip having an image area for imaging an image,

wherein at least one corner at a corresponding position of each of the image area on said imaging chip of said solid state imaging device and said imaging chip is chamfered to form said solid state imaging device.

14. An electronic endoscope according to claim 13, wherein said solid state imaging device is arranged so that the image area on said imaging chip of said solid state imaging device is parallel with a plane intersecting at right angles with an axial direction of the insertable section of said electronic endoscope.

15. An electronic endoscope according to claim 13, wherein said solid state imaging device is arranged so that at least one of said chamfered corners of the image area on said imaging chip of said solid state imaging device and the imaging chip are along a contour of the insertable section of said electronic endoscope.

16. An electronic endoscope according to claim 13, wherein said solid state imaging device is arranged so that at least one of said chamfered corners of the image area on said imaging chip of said solid state imaging device and the imaging chip are directed to an inside portion of the insertable section of said electronic endoscope and components are arranged adjacent to the corners of said solid state imaging device which are arranged so as to be directed to the inside portion of said insertable section.

17. An electronic endoscope according to claim 13, wherein the imaging chip of said solid state imaging device has a transfer line for receiving an electric charge from said image area, and wherein at least one of said chamfered corners of the image area on said imaging chip and said imaging chip is positioned opposite the side on which said transfer line is arranged in said solid state imaging device.

18. An electronic endoscope according to claim 13, wherein the imaging chip of said solid sate imaging device has an electrode for inputting and for outputting an electronic charge received by said transfer line or for receiving a signal from an outside source, and

wherein said solid state imaging device is arranged in the position of said electrode as displaced on the side on which the non-chamfered corners of said imaging chip and corners of said package are arranged.

19. An electronic endoscope according to claim 13, wherein the image area on a non-chamfered imaging chip of said solid state imaging device and components arranged near the corners of the imaging chip have cross-sectioned areas which are smaller than the cross-sectioned areas of the image area on said chamfered imaging chip and the components arranged near the corners of the imaging chip.

20. A solid state imaging device, comprising:

an imaging chip having an imaging area for imaging an image and a package for enclosing said imaging chip, wherein all the corners other than at a corresponding position in the image area on said imaging chip, said imaging chip and said package are chamfered.

21. A solid state imaging device having an insertable section, comprising an imaging chip having an imaging area for imaging an image and a package for enclosing said imaging chip

mounted at said insertable section, wherein at least one corner at a corresponding position of each of said imaging chip and said package is chamfered and is arranged at an outer peripheral side of said insertable section.

22. A solid state imaging device having an insertable section, comprising an imaging chip having an imaging area for imaging an image and a package for enclosing said imaging chip

mounted at said insertable section, wherein at least one corner at a corresponding position of each of said imaging chip and said package is chamfered and is arranged at an inside portion of said insertable section.

23. A solid state imaging device, comprising an imaging chip having an image area for imaging an image,

wherein at least one corner at a corresponding position of each of the image area on said imaging chip of said solid state imaging device and said imaging chip is chamfered to thereby provide a solid state imaging device which can prevent an output image from darkening due to a shortage of incident light in an image area corresponding to a peripheral part of an objective lens.

24. A solid state imaging device according to claim 23, wherein the imaging chip of said solid state imaging device has a transfer line for receiving an electric charge from said image area, and wherein at least one of said chamfered corners of the image area on said imaging chip and said imaging chip is positioned opposite the side on which said transfer line is arranged.

25. A solid state imaging device according to claim 24, wherein the imaging chip of said solid state imaging device has an electrode for inputting and for outputting an electric charge received by said transfer line or for receiving a signal from an outside source, and

wherein said electrode is arranged as displaced in the position on the side on which the non-chamfered corners of said imaging chip and corners of said a package are arranged.