LED head having heat radiating mount
First Claim
Patent Images
1. An LED head comprising:
- (a) a circuit substrate on which a light emitting element and drive IC are mounted;
(b) an array of lenses for condensing light emitted from the light emitting element;
(c) a metallic head cover which holds the array of lenses spaced a predetermined distance away from the light emitting element, said metallic head cover communicating with the circuit substrate to radiate heat from said circuit substrate; and
(d) mounting means for firmly holding said circuit substrate and said metallic head cover together.
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Accused Products
Abstract
An LED head includes a circuit substrate on which a light emitting element and drive IC are mounted, a SELFOC lens for condensing the irradiating light from the light emitting element on the circuit substrate, and a head cover of aluminum for holding the SELFOC lens spaced a given distance away from the light emitting element and for radiating heat from the circuit substrate.
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Citations
5 Claims
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1. An LED head comprising:
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(a) a circuit substrate on which a light emitting element and drive IC are mounted; (b) an array of lenses for condensing light emitted from the light emitting element; (c) a metallic head cover which holds the array of lenses spaced a predetermined distance away from the light emitting element, said metallic head cover communicating with the circuit substrate to radiate heat from said circuit substrate; and (d) mounting means for firmly holding said circuit substrate and said metallic head cover together. - View Dependent Claims (2, 5)
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3. An LED head comprising:
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(a) a circuit substrate on which a light emitting element and drive IC are mounted; (b) an array of lenses for condensing emitted light from the light emitting element; (c) a metallic head cover which holds the array of lenses spaced a predetermined distance away from the light emitting element, said metallic head cover communicating with the circuit substrate to radiate heat from said circuit substrate; and (d) mounting means for firmly holding said circuit substrate and said metallic head cover together; wherein said circuit substrate has a bottom face, and wherein said mounting means comprises a plurality of mounting members which engage the bottom face of said circuit substrate to bias said circuit substrate against said head cover; and wherein each of said mounting members includes a stamped part adapted to engage at least a part of one side of said circuit substrate adjacent to said bottom side. - View Dependent Claims (4)
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Specification