Method to determine tool paths for thinning and correcting errors in thickness profiles of films

• US 5,291,415 A
• Filed: 12/13/1991
• Issued: 03/01/1994
• Est. Priority Date: 12/13/1991
• Status: Expired due to Fees

• Current Assignee: Integrated Process Equipment Corp. (Speedfam Co., Ltd)
• Original Assignee: Hughes Aircraft Company (Rtx Corporation)
• Inventors: Bollinger, L. David, Zarowin, Charles B.
• Primary Examiner(s): Smith, Jerry
• Assistant Examiner(s): GORDON, PAUL P
• Application Number:
  US07/807,544
• Time in Patent Office: 809 Days
• Field of Search: 364/474.15, 364/474.3, 364/563, 156/625, 156/626, 156/643, 204/192.1, 204/192.11, 204/192.13
• US Class Current: 700/188
• CPC Class Codes: G01B 11/0616 of coating
• CPC Class Codes: G05B 19/182 characterised by the machine tool function, e.g. thread cutting, cam making, tool direction control G05B19/21 - G05B19/40 take precedence
• CPC Class Codes: G05B 2219/45026 Circuit board, pcb
• CPC Class Codes: G05B 2219/49235 Control depth as function of grey level of scanned object, map of thickness
• CPC Class Codes: G05B 2219/49236 Translate thickness to be removed in dwell delay, then to corresponding speed
• CPC Class Codes: G05B 2219/50067 Measure surface for thickness and store map in memory, machine surface
• CPC Class Codes: H01L 21/3065 Plasma etching; Reactive-ion etching
• CPC Class Codes: H01L 21/76251 using bonding techniques
• CPC Class Codes: H01L 22/12 for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions electrical measurement of diffusions H01L22/14
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

Abstract

A method to determine the tool path of a material removal tool which is part of a system to shape the surface of a substrate is disclosed. The method conditions initial metrology data of the substrate into a dwell time versus position on the surface for the removal tool. The dwell time array is subsequently converted into a velocity versus position array so that a position controller means may be utilized to guide the movement of the substrate with respect to the removal tool to perform precise material removal on the surface of the substrate.

Claims

1. A method for determining a path of a removal tool of a system to remove material from a surface of a substrate so as to allow precision changes to be made in a thickness profile of the substrate, said method comprising the steps of:

a) constructing a conditioned data array from a pre-removal process thickness data array, said conditioned data array comprising substrate thickness data as a function of position on a coordinate plane so as to provide a means for insuring continuous and smooth tool movement over the entire surface of the substrate;

b) constructing a dwell time array relating dwell time for the removal tool as a function of position on the coordinate plane from said conditioned data array;

c) converting the dwell time array into a multi-directional velocity array relating multi-directional velocity for the removal tool as a function of position on the coordinate plane; and

d) communicating said multi-directional velocity array to a position controller so as to allow continuous and controlled motion of the removal tool.

2. The method of claim 1, wherein the step of constructing the conditioned data array further comprises the step of extending the data array beyond an edge of the substrate to provide extended data points so as to further allow continuous guided movement of the removal tool beyond the substrate surface.

3. The method of claim 2, wherein extension of the data array is at least the distance of a footprint of the removal tool.

4. The method of claim 2, wherein the step of extending the data array further comprises a step to account for a slope of the thickness profile at the edge of the substrate and a step to include said slope into the extended data points.

5. The method of claim 4, wherein the accounting step is performed by numerically fitting the data points near the substrate edge.

6. The method of claim 1, wherein the conditioning step further comprises a step to increase the number of data points of the pre-removal process thickness versus position data array.

7. The method of claim 6, wherein the step to increase the number of data points is performed by interpolation of existing points in the data array.

8. The method of claim 7, wherein the method of interpolation is a two dimensional linear interpolation.

9. The method of claim 7, wherein the method of interpolation is a polynomial spline fit.

10. The method of claim 1, wherein the conditioning step further comprises a step to smooth spurious data and substrate thickness data that is beyond the capability of the system to accurately correct due to limitations of the removal tool.

11. The method of claim 10, wherein the smoothing step comprises averaging multiple thickness measurements.

12. The method of claim 10, wherein the smoothing step comprises limiting an allowable change in the slope of the thickness profile.

13. The method of claim 10, wherein the smoothing step comprises averaging multiple thickness measurements and limiting an allowable change in the slope of the thickness profile.

14. The method of claim 1, wherein the step of constructing the dwell time array further comprises the steps of setting an initial dwell time for a point on the dwell time array proportional to a film thickness error at that point and repeating said step to obtain an initial dwell time versus the position on the dwell time array.

15. The method of claim 14, wherein the step of constructing the dwell time array further comprises the steps of simulating the thickness profile obtained with an initial dwell time array, comparing the simulated profile with a desired profile to obtain a residual error for each point, and scaling the initial dwell time array by the residual error to obtain a corrected dwell time array.

16. The process of claim 15, wherein the steps are repeated in an iterative fashion to achieve a desired accuracy.

17. The method of claim 14, wherein the construction step of constructing the dwell time array step further comprises the step of adjusting the initial dwell time of the film thickness error to account for its local, spatial dependence.

18. The method of claim 17, wherein the adjusting step comprises adding a difference to each point on the initial dwell time array, further adjusted by characteristics of the footprint of the removal tool, between the film thickness error at each point and the average film thickness error for points located within a predetermined distance S from each point.

19. The method of claim 18, wherein the adjustment is repeated for each point on the dwell time array.

20. The method of claim 1, wherein the dwell time array is converted to a velocity data array by transposing dwell time data into velocity data determined as a function of removal depth.

23. The method of claim 1, wherein the coordinate plane is Cartesian.

21. A method for determining a path for a removal tool of a system to remove material from a surface of a substrate so as to allow precision changes to be made in a thickness profile of the substrate, said method comprising the steps of:

a) constructing a conditioned data array from a pre-removal process thickness data array comprising substrate thickness data as a function of position on a coordinate plane to provide continuous and smooth tool movement over the surface of the substrate in accordance with the substeps of;

1) extending the data array beyond an edge of the substrate by at least a distance corresponding to a footprint of the removal tool, and accounting for a slope of the thickness profile at the edge of the substrate into said extended data array,

2) increasing the number of data points of the pre-removal process thickness data array by interpolating measured data points, and

3) smoothing spurious data and thickness data which is beyond the capability of the system to accurately correct due to limitations of the removal tool;

b) constructing a dwell time array relating dwell time for the removal tool as a function of position on the coordinate plane from said conditioned data array in accordance with the substeps of;

1) setting an initial dwell time for a point on the dwell time array proportional to film thickness error at that point and repeating this step to obtain an initial dwell time for each point of the conditioned array,

2) simulating a post-processing thickness profile of the substrate that would be obtained with the initial dwell time array by comparing the simulated profile with a desired profile to obtain a residual error for each point, and scaling the initial dwell time array by the residual error to obtain a corrected dwell time array, and

3) repeating the simulation step in an iterative fashion to achieve a desired accuracy;

c) converting the dwell time array into a multi-dimensional array relating velocity of the removal tool as a function of position to a desired removal depth; and

d) communicating said multi-dimensional velocity array to a position controller so as to allow continuous and controlled motion of the removal tool.

22. The method of claim 21, wherein the multi-dimensional velocity array is two-dimensional.

24. A method for determining a path of a removal tool of a system to remove material from a surface of a substrate so as to allow precision changes to be made in a thickness profile of the substrate, said method comprising the steps of:

a) generating a conditioned data array comprising substrate thickness data as a function of position;

b) generating from said conditioned data array a dwell time array relating dwell time for the removal tool as a function of position;

c) converting the dwell time array into a velocity array relating velocity of the removal tool as a function of position; and

d) communicating said velocity array to a position controller that is adapted to control movement of the removal tool.

25. The method of claim 24 wherein the step of constructing the conditioned data array further comprises the step of extending the data array beyond an edge of the substrate to provide extended data points to allow continuous guided movement of the removal tool beyond the substrate surface.

26. The method of claim 24, wherein the step of constructing the dwell time array further comprises the steps of setting an initial dwell time for a point on the dwell time array proportional to a film thickness error at that point and repeating this step to generate an initial dwell time versus the position on the dwell time array.

27. The method of claim 24, wherein the step of constructing the dwell time array further comprises the steps of simulating the thickness profile obtained with an initial dwell time array, comparing the simulated profile with a desired profile to obtain a residual error for each point, and scaling the initial dwell time array by the residual error to generate a corrected dwell time array.