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Method and apparatus for detecting excess/insufficient solder defects

  • US 5,291,535 A
  • Filed: 08/05/1991
  • Issued: 03/01/1994
  • Est. Priority Date: 10/30/1987
  • Status: Expired due to Term
First Claim
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1. A method of detecting an insufficient solder defect comprising the steps of:

  • producing a cross-sectional image of a cutting plane of a solder joint;

    analyzing said cross-sectional image to determine the thickness of a portion of said solder joint;

    defining a lower solder thickness threshold value; and

    comparing said thickness to said lower threshold value.

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