Method and apparatus for detecting excess/insufficient solder defects

• US 5,291,535 A
• Filed: 08/05/1991
• Issued: 03/01/1994
• Est. Priority Date: 10/30/1987
• Status: Expired due to Term

• Current Assignee: Agilent Technologies, Inc.
• Original Assignee: Four Pi Systems Corp. (HP Inc.)
• Inventors: Baker, Bruce D., Adams, John A., Corey, Robert L., Ross, Edward W.
• Primary Examiner(s): Porta, David P.
• Assistant Examiner(s): WONG, DON KITSUN
• Application Number:
  US07/740,631
• Time in Patent Office: 939 Days
• Field of Search: 378/22, 378/62, 378/207, 378/4, 358/111
• US Class Current: 378/22
• CPC Class Codes: G01N 23/043 using fluoroscopic examination, with visual observation or video transmission of fluoroscopic images
• CPC Class Codes: G01N 23/044 using laminography or tomosynthesis
• CPC Class Codes: G01R 31/302 Contactless testing G01R31/66 takes precedence
• CPC Class Codes: G01R 31/304 of printed or hybrid circuits G01R31/305 - G01R31/315 take precedence
• CPC Class Codes: G01R 31/311 of integrated circuits G01R31/31728 takes precedence

Abstract

A method and apparatus for the detection of excess or insufficient solder conditions at electrical connections on printed circuit boards are disclosed. The invention analyzes a cross-sectional image of an electrical connection to obtain the average solder thickness of the connection. This average solder thickness is then compared to an upper threshold value to determine if the connection is an excess solder defect, and a lower threshold value to determine if the connection is an insufficient solder defect. In one embodiment, the present invention compensates for variations in image intensity due to the background by employing a first and second correction factor in the calibration technique. The first correction factor is the measured background gray scale value local to the connection, while the second correction factor is determined to have a substantially linear relationship to the background image intensity local to each solder connection. The present invention further includes a process control feedback system which detects and compensates for trends in the solder application process. This helps to insure that defective solder joints are avoided before they are produced. In one embodiment, the process control feedback system is fully automated.

Claims

1. A method of detecting an insufficient solder defect comprising the steps of:

producing a cross-sectional image of a cutting plane of a solder joint;

analyzing said cross-sectional image to determine the thickness of a portion of said solder joint;

defining a lower solder thickness threshold value; and

comparing said thickness to said lower threshold value.

2. A method as defined in claim 1 wherein said analyzing step further comprises the steps of:

defining a region of interest on said image;

partitioning said region of interest into a grid of pixels;

assigning an image intensity value to each of said pixels wherein said image intensity value corresponds to the intensity of the portion of the image represented by each of said pixels;

calculating an average image intensity value of the pixels within said region of interest; and

correlating said average image intensity value with a calibration standard.

23. A method as defined in claim 2, wherein said preselected foreground level is equal to the foreground level corresponding to the lowest of said determined background levels.

3. A method of detecting an excess solder defect comprising the steps of:

producing a cross-sectional image of a cutting plane of a solder joint;

analyzing said cross-sectional image to determine the thickness of a portion of said solder joint;

defining an upper solder thickness threshold value; and

comparing said thickness to said upper threshold value.

4. A method as defined in claim 3 wherein said analyzing step further comprises the steps of:

defining a region of interest on said image;

partitioning said region of interest into a grid of pixels;

assigning an image intensity value to each of said pixels wherein said image intensity value corresponds to the intensity of the portion of the image represented by each of said pixels;

calculating an average image intensity value of the pixels within said region of interest; and

correlating said average image intensity value with a calibration standard.

5. A method of measuring the thickness of connective material forming an electrical connection, said method comprising the steps of:

exposing said connective material to a source of transmissive energy;

detecting the intensity of said transmissive energy which passes through said material;

producing a cross-sectional image of a cutting plane of said material with said detected energy;

defining a region of said cross-sectional image corresponding to a region of said material wherein the thickness of said material is to be determined;

calculating an average image intensity for said region and

comparing said average image intensity to a calibration standard which correlates image intensity with material thickness.

6. An apparatus for measuring the thickness of material forming an electrical connection comprising:

an imaging system for producing a cross-sectional image of a cutting plane of an electrical connection; and

an image analysis system for analyzing said cross-sectional image to determine the thickness of said material, said image analysis system further comprising;

means for defining a region of said cross-sectional image corresponding to a region of said material wherein the thickness of said material is to be determined;

a processor for calculating an average image intensity value for said region; and

a comparator for comparing said average image intensity value to a calibration standard having a correlation between image intensity and material thickness to obtain the thickness of said material forming said electrical connection.

7. A method of detecting a defect in a solder joint comprising the steps of:

producing a cross-sectional image of said solder joint wherein said image displays features of said solder joint against a background;

dividing said cross-sectional image into a pixel grid wherein each of said pixels in said grid has an image intensity value which corresponds to the intensity of said image at the location of said pixel;

defining a region of interest;

determining a background image intensity value of said cross-sectional image, said determining step further including the steps of;

defining a background region; and

calculating an average background value;

subtracting said average background value from the image intensity values of each pixel comprising said region of interest to create a set of background-corrected image intensity values for the pixels comprising said region of interest;

calculating an average of said background-corrected image intensity values for the pixels comprising said region of interest;

providing a calibration standard which correlates image intensity value with solder thickness value; and

comparing said average of said background-corrected image intensity value within said region of interest to said calibration standard to determine an average solder thickness value for said region of interest.

8. A method as defined in claim 7 wherein said step of calculating an average background level comprises the steps of:

filtering out pixels within said background region which do not correspond to a part of said background; and

determining an average background value which is equal to the average image intensity value of the pixels within said background region that correspond to a part of said background.

9. A method as defined in claim 8 wherein said filtering step comprises the steps of:

calculating an upper boundary value which is equal to the average image intensity value of all of the pixels within said background region; and

selecting those pixels which have image intensity values that are below said upper boundary value as pixels that correspond to a part of said background.

10. A method as defined in claim 7 further comprising the steps of:

defining a nominal solder thickness value, an upper threshold solder thickness value and a lower threshold solder thickness value;

dividing said average solder thickness value for said region of interest by said nominal solder thickness value to produce a solder thickness ratio value; and

comparing said solder thickness ratio value to said upper threshold value and said lower threshold value.

11. A method for monitoring and controlling a solder application apparatus which forms solder joints, said method comprising the steps of:

producing cross-sectional images of cutting planes of a plurality of solder joints;

determining the thickness of each of said plurality of solder joints;

comparing said determined solder thickness with a nominal solder thickness;

generating a feedback signal in response to said comparison; and

providing said feedback signal to said solder application device.

12. A method as defined in claim 11 wherein said comparing step comprises the step of dividing said determined solder thickness value by said nominal solder thickness value.

13. A method as defined in claim 11 wherein said generating step comprises the steps of:

accessing a predetermined set of response data; and

outputting a control signal from said set of response data.

14. A method as defined in claim 13 wherein said set of response data is programmed into a PROM table.

15. A method as defined in claim 13 wherein said set of response data is programmed into a microprocessor.

16. A method as defined in claim 11, further comprising the step of increasing the solder deposition rate of said solder application device if said determined solder thickness is less than said nominal solder thickness.

17. A method as defined in claim 11, further comprising the step of decreasing the solder deposition rate of said solder application device if said determined solder thickness is greater than said nominal solder thickness.

18. A method for determining, in a digital cross-sectional image of a circuit board, the centroid of an image feature having a predetermined shape, said method comprising the steps of:

defining a pixel template having an inner region, an outer region and a reference pixel;

wherein said inner region is of substantially the same shape as said image feature and said outer region substantially surrounds said inner region;

creating a centroid image having a one to one pixel correlation with a portion of said circuit board image containing said image feature, said creating step further comprising the steps of;

a) superimposing said template on said portion of said circuit board image;

b) summing the image intensity values of pixels comprising said circuit board image falling within said inner region of said template;

c) summing the image intensity values of said digital image falling within said outer region of said template;

d) taking the difference of said inner region sum and said outer region sum;

e) defining the intensity of a pixel of said centroid image corresponding to said template reference pixel to be equal to said difference; and

f) repeating steps a) through e) until a substantial number of the pixels comprising said portion of said circuit board image have bee covered by said template reference pixel;

comparing the image intensity values of the pixels comprising said centroid image to locate the pixel having the maximum value; and

defining a pixel of said circuit board image corresponding to said maximum value pixel of said centroid image to be the location of the centroid of said image feature.

19. An apparatus for measuring the thickness of material forming an electrical connection comprising:

an imaging system for producing a cross-sectional image of an electrical connection;

an image analysis system for analyzing said cross-sectional image to determine the thickness of said material, said image analysis system further comprising;

means for defining a region of said cross-sectional image corresponding to a region of said material wherein the thickness of said material is to be determined;

a processor for calculating an average image intensity value for said region;

a means for subtracting a first correction factor from said average image intensity value and setting the resulting difference equal to a first corrected intensity value;

a means for multiplying said first corrected intensity value by a second correction factor, said product equal to a second corrected intensity value; and

a comparator for comparing said second corrected intensity value to a calibration standard having a correlation between image intensity value and material thickness.

20. A method of measuring the thickness of material forming a subject electrical connection comprising the steps of:

producing a cross-sectional image of said subject electrical connection;

analyzing said cross-sectional image to determine the thickness of said material, said analyzing step further comprising the steps of;

defining a region of said cross-sectional image corresponding to a region of said material wherein the thickness of said material is to be determined;

calculating an average image intensity value for said region;

subtracting a first correction factor from said average image intensity value and setting the resulting difference equal to a first corrected intensity value;

multiplying said first corrected intensity value by a second correction factor, said product equal to a second corrected intensity value; and

comparing said second corrected intensity value to a calibration standard having a correlation between image intensity value and material thickness.

21. A method as defined in claim 20, wherein said first correction factor is equal to the background level of said cross-sectional image.

22. A method as defined in claim 20, wherein said second correction factor is determined by the steps of:

sampling a plurality of electrical connections having a substantially uniform thickness;

determining a background level local to each of said electrical connections;

determining a foreground level for each of said electrical connections, said foreground level being equal to an average image intensity value of said image region corresponding to said electrical connection, minus said background level local to said electrical connection;

correlating said foreground and background levels of said electrical connections;

normalizing said foreground levels with respect to a preselected foreground level, said preselected foreground level being within a range of foreground levels that corresponds to said determined background levels;

determining a background level local to said subject electrical connection; and

designating the normalized foreground level which is correlated with said determined background level local to said subject electrical connection as said second correction factor.

24. A method of measuring the volume of connective material forming an electrical connection, said method comprising the steps of:

exposing said connective material to a source of transmissive energy;

detecting the intensity of said transmissive energy which passes through said material;

producing a cross-sectional image of said material with said detected energy;

defining a region of said cross-sectional image corresponding to a region of said material wherein the volume of said material is to be determined, said region having a predetermined area;

calculating an average image intensity for said region;

comparing said average image intensity to a calibration standard which correlates image intensity with material thickness to obtain an average thickness measurement value over said region of interest; and

multiplying said obtained average thickness measurement value by said predetermined area of said region of interest to obtain the volume of said connective material.

25. An apparatus for measuring the volume of material forming an electrical connection comprising:

an imaging system for producing a cross-sectional image of a cutting plane of an electrical connection; and

an image analysis system for analyzing said cross-sectional image to determine the volume of said material, said image analysis system further comprising;

means for defining a region of said cross-sectional image corresponding to a region of said material wherein the volume of said material is to be determined, said region having a predetermined area;

a processor for calculating an average image intensity value for said region;

a comparator for comparing said average image intensity value to a calibration standard having a correlation between image intensity and material thickness; and

a multiplier for calculating the volume of said connective material within said region of interest using said material thickness and said predetermined area.

26. An apparatus for measuring the thickness of material forming an electrical connection comprising:

an imaging system for producing a cross-sectional image of a cutting plane of an electrical connection; and

an image analysis system for analyzing said cross-sectional image to determine the thickness of said material, said image analysis system further comprising;

a processor for calculating an average image intensity value for a region of said cross-sectional image corresponding to a region of said material wherein the thickness of said material is to be determined; and

a comparator for comparing said average image intensity value to a calibration standard having a correlation between image intensity and material thickness.

27. An apparatus for monitoring and controlling a solder application device which forms solder joints, said apparatus comprising:

a solder joint inspection device which determines the thickness of each of said solder joints wherein said solder joint inspection device comprises;

an imager that produces cross-sectional images of cutting planes of solder joints; and

an image analyzer which analyzes said cross-sectional images to determine the thickness of each of said solder joints;

a comparator which compares said determined solder thickness with a nominal solder thickness and provides an output comparison value; and

a controller which receives as input said comparison value and generates a feedback signal which causes said solder application device to increase or reduce the amount of solder deposited onto said solder joints.

28. An apparatus for measuring the thickness of material forming an electrical connection comprising:

an imaging system for producing a cross-sectional image of an electrical connection; and

an image analysis system for analyzing said cross-sectional image to determine the thickness of said material, said image analysis system further comprising;

a processor that calculates an average image intensity value for a region of said cross-sectional image corresponding to a region of said material wherein the thickness of said material is to be determined, said processor further comprising a subtractor which subtracts a first correction factor from said average image intensity value and sets the resulting difference equal to a first corrected intensity value, said processor further comprising a multiplier which multiplies said first corrected intensity value by a second correction factor and sets the resulting product equal to a second corrected intensity value; and

a comparator that compares said second corrected intensity value to a calibration standard having a correlation between image intensity and material thickness to obtain said material thickness.

29. An apparatus for measuring the volume of material forming an electrical connection comprising:

an imaging system for producing a cross-sectional image of a cutting plane of an electrical connection; and

an image analysis system for analyzing said cross-sectional image to determine the volume of said material, said image analysis system further comprising;

a processor that calculates an average image intensity value for a region of said cross-sectional image corresponding to a region of said material wherein the volume of said material is to be determined, said region having a predetermined area, said processor further comprising a comparator that compares said average image intensity value to a calibration standard having a correlation between image intensity and material thickness, said processor further comprising a multiplier that calculates the volume of said connective material within said region of interest using said material thickness and said predetermined area.

30. A method of detecting an insufficient solder defect comprising the steps of:

producing a cross-sectional image of a cutting plane of a solder joint;

analyzing said cross-sectional image to determine the thickness of a portion of said solder joint, said analyzing step further comprising the steps of;

defining a region of interest on said image;

partitioning said region of interest into a grid of pixels;

assigning an image intensity value to each of said pixels wherein said image intensity value corresponds to the intensity of the portion of the image represented by each of said pixels;

calculating an average image intensity value of the pixels within said region of interest; and

correlating said average image intensity value with a calibration standard;

defining a lower solder thickness threshold value; and

comparing said thickness to said lower threshold value.

31. A method of detecting an excess solder defect comprising the steps of:

producing a cross-sectional image of a cutting plane of a solder joint;

analyzing said cross-sectional image to determine the thickness of a portion of said solder joint, said analyzing step further comprising the steps of;

defining a region of interest on said image;

partitioning said region of interest into a grid of pixels;

assigning an image intensity value to each of said pixels wherein said image intensity value corresponds to the intensity of the portion of the image represented by each of said pixels;

calculating an average image intensity value of the pixels within said region of interest; and

correlating said average image intensity value with a calibration standard;

defining an upper solder thickness threshold value; and

comparing said thickness to said upper threshold value.