Semiconductor pressure sensor

• US 5,291,788 A
• Filed: 09/24/1992
• Issued: 03/08/1994
• Est. Priority Date: 09/24/1991
• Status: Expired due to Term

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Yonemoto, Satoshi, Oohata, Satoshi, Fukai, Wataru
• Primary Examiner(s): Chilcot, Jr., Richard E.
• Assistant Examiner(s): MOLLER, RICHARD ALAN
• Application Number:
  US07/950,162
• Time in Patent Office: 530 Days
• Field of Search: 73/720, 73/721, 73/726, 73/727, 73/756, 73/182, 338/3, 338/4, 338/36, 338/42
• US Class Current: 73/727
• CPC Class Codes: G01L 9/0054 integral with a semiconducting diaphragm

Abstract

A semiconductor pressure sensor according to the invention comprises a first semiconductor substrate and a second semiconductor substrate, disposed around the first substrate, so that signals obtained by the semiconductor pressure sensor under static or differential pressure conditions can be properly corrected and both static and differential pressures can be detected accurately and reliably measured on the same semiconductor substrates. Another object of the invention is provide a semiconductor pressure sensor which utilizes a single substrate with an aperture, which acts as a pressure overload stop mechanism, and which does not suffer from any effects of diaphragm deformation as a result of possible pressure overload.

Claims

1. A semiconductor pressure sensor comprising:

a first semiconductor substrate made of a monocrystalline semiconductive material having a crystal axis, the first semiconductor substrate having first and second surfaces, a recessed portion being formed on the first surface;

a second semiconductor substrate also made of a monocrystalline semiconductive material having a crystal axis, the second semiconductor substrate having first and second surfaces and being disposed around the first semiconductor substrate;

a tubular seat having first and second end surfaces, the first end surface being connected to the first surface of the first semiconductor substrate, the first end surface being connected to the first surface of the first semiconductor substrate to surround the recessed portion, the tubular seat comprising a pressure guide path communicating the second end surface the recessed portion;

at least a differential pressure sensor disposed on the second surface of the first semiconductor substrate for detecting differential pressure in a direction vertical to the crystal axis of the firs semiconductor substrate;

at least a differential pressure sensor disposed on the second surface of the first semiconductor substrate for detecting differential pressure in a direction parallel with the crystal axis of the first semiconductor substrate;

at least a static pressure sensor disposed on the second surface of the second semiconductor substrate for detecting static pressure in a direction vertical to the crystal axis of the second semiconductor substrate; and

at least a static pressure sensor disposed on the second surface of the semiconductor substrate for detecting static pressure in a direction parallel with the crystal axis of the second semiconductor substrate.

2. A semiconductor pressure sensor according to claim 1, wherein the tubular seat is made of Pyrex glass.

3. A semiconductor pressure sensor according to claim 1, wherein the differential pressure sensors and the static pressure sensors are formed by diffusion and doping of an impurity material.

4. A semiconductor pressure sensor comprising:

a first semiconductor substrate made of a monocrystalline semiconductive material having a crystal axis, the first semiconductor substrate having first and second surfaces;

a tubular seat having first and second end surfaces, the first end surface being connected to the first surface of the first semiconductor substrate, the first end surface being connected to the first surface of the first semiconductor substrate to surround the recessed portion, the tubular seat comprising a pressure guide path communicating the second end surface the recessed portion;

at least a differential pressure sensor disposed on the second surface of the first semiconductor substrate for detecting differential pressure in a direction vertical to the crystal axis of the first semiconductor substrate;

at least a differential pressure sensor disposed on the second surface of the first semiconductor substrate for detecting differential pressure in a direction parallel with the crystal axis of the first semiconductor substrate;

a second semiconductor substrate also made of a monocrystalline semiconductive material having a crystal axis, the second semiconductor substrate having first and second surfaces and being disposed around the first semiconductor substrate;

a second tubular seat having an end connected to the first surface of the second semiconductor substrate to surround the first tubular seat;

at least a static pressure sensor disposed on the second surface of the second semiconductor substrate for detecting static pressure in a direction vertical to the crystal axis of the second semiconductor substrate; and

at least a static pressure sensor disposed on the second surface of the semiconductor substrate for detecting static pressure in a direction parallel with the crystal axis of the second semiconductor substrate.

5. A semiconductor pressure sensor according to claim 4, wherein the first and second tubular seats are made of Pyrex glass.

6. A semiconductor pressure sensor according to claim 4, wherein the differential pressure sensors and the static pressure sensors are formed by diffusion and doping of an impurity material.

7. A semiconductor pressure sensor comprising:

a semiconductor substrate having first and second surfaces and an aperture cut through the substrate from the first surface to the second surface and having a given form;

a tubular seat made of a material different from that of the semiconductor substrate and having first and second end surfaces, the first end surface being connected to the first surface of the semiconductor substrate to cover the opening, the tubular seat also having a pressure guide path for keeping the second end surface in communication with the first end surface connected to the opening of the semiconductor substrate; and

a plurality of strain sensors formed in a peripheral area of the opening on the second surface of the semiconductor substrate.

8. A semiconductor pressure sensor according to claim 7, wherein the semiconductor substrate is made of a monocrystalline material.

9. A semiconductor pressure sensor according to claim 7, wherein the aperture is formed by anisotropic etching.

10. A semiconductor pressure sensor according to claim 7, wherein the tubular seat is made of Pyrex glass.

11. A semiconductor pressure sensor according to claim 7, wherein the strain sensors are formed by diffusion and doping of an impurity material onto the semiconductor substrate.