Method and apparatus for producing variable spatial frequency control in plasma assisted chemical etching

• US 5,292,400 A
• Filed: 03/23/1992
• Issued: 03/08/1994
• Est. Priority Date: 03/23/1992
• Status: Expired due to Fees

• Current Assignee: Integrated Process Equipment Corp. (Speedfam Co., Ltd)
• Original Assignee: Hughes Aircraft Company (Rtx Corporation)
• Inventors: Mumola, Peter B.
• Primary Examiner(s): Powell, William A.
• Application Number:
  US07/854,718
• Time in Patent Office: 715 Days
• Field of Search: 156/643, 156/646, 156/657, 156/662, 156/345, 156/626, 118/720, 118/723, 118/729, 118/50.1, 118/620, 134/1, 427/3.8, 204/192.32, 204/192.37, 204/298.31, 204/298.33, 204/298.35
• US Class Current: 216/71
• CPC Class Codes: H01J 37/32082 Radio frequency generated discharge H01J37/32357, H01J37/32366, H01J37/32394 and H01J37/32403 take precedence
• CPC Class Codes: H01J 37/3244 Gas supply means
• CPC Class Codes: H01J 37/32623 Mechanical discharge control means
• CPC Class Codes: H01J 37/32733 Means for moving the material to be treated

Abstract

A reactor 10 having a vacuum housing 30 which encloses a plurality of plasma chambers 14a, 14b is used to perform local plasma assisted chemical etching on an etchable substrate 12. The chambers 14a, 14b are movable and are sized according to the removal material footprint desired. Radio frequency driven electrodes 20a, 20b and gas diffuser/electrodes 22a, 22b have the same diameter as the chambers 14a, 14b. The substrate 12 is mounted on a substrate holder 44 which also acts as the other electrode. The holder 44 is mounted on an X-Y positioning table 46. A process gas is flowed into a preselected chamber with rf power so as to disassociated the process gas into a plasma. The plasma chambers 14a, 14b may be scanned over the substrate surface while the gap between the chambers and the substrate is varied to yield a desired etch profile.

Claims

1. An rf head for a plasma assisted chemical etching reactor, said rf head comprising:

a dielectric insulator having a plurality of cavities therein, and wherein each cavity occupies a different volume of said dielectric insulator;

a plurality of electrodes, wherein an electrode is positioned within each cavity;

a plurality of process gas feed tubes, wherein each process gas feed tube is connected between a supply of process gas and one of the plurality of cavities; and

a plurality of rf power conductors, wherein each conductor is connected between a supply of rf power and an electrode positioned within a cavity.

2. An rf head for a plasma assisted chemical etching reactor, said rf head comprising:

a plurality of dielectric insulators, wherein each dielectric insulator has a cavity therein, and wherein each cavity occupies a different volume;

a plurality of electrodes, wherein an electrode is positioned within each cavity;

a plurality of process gas feed tubes, wherein each process gas feed tube is connected between a supply of process gas and one of the plurality of cavities; and

a plurality of rf power conductors, wherein each conductor is connected between a supply of rf power and an electrode positioned within a cavity.

3. A material removal tool for performing plasma assisted chemical etching reactions on the surface of a substrate comprising a reactor having:

a housing;

a first dielectric insulator positioned within the housing having a plurality of cavities for performing a local plasma etching reaction about a localized region of a substrate, and wherein each cavity occupies a different volume within the insulator.

means for selectively supplying each cavity with a flow of process gas;

means for selectively providing the process gas within each cavity with rf power so as to generate a plasma therein;

a second dielectric insulator positioned within the housing and around the first dielectric insulator, said second dielectric insulator extending outward from the first dielectric insulator so as to insulate conductive and proximate surfaces, and thereby facilitating extinction of any plasma outside each cavity;

means for supporting the substrate; and

means for adjusting the position of each cavity with respect to said substrate surface.

4. The material removal tool of claim 3, wherein the means for selectively supplying rf power to a cavity includes a first electrode and an electrically conductive rf gas diffuser/electrode positioned within the cavity, and a second electrode positioned outside the cavity so that the substrate is positioned between the first and second electrodes so as to complete an electrical circuit for supplying rf power to the process gas within the selected cavity.

5. The material removal tool of claim 4, wherein the first electrode having upper and lower surfaces is positioned so that the upper surface is in contact with the ceiling surface of the cavity and the rf gas diffuser/electrode, having an upper and lower surface is positioned so that its upper surface is in contact with the lower surface of the first electrode.

6. The material removal tool of claim 5, wherein the upper and lower surface areas of the first electrode have approximately the same area and approximately the same planar geometry as the surface of the ceiling of the cavity.

7. The material removal tool of claim 5, wherein the upper and lower surface areas of the electrically conductive gas diffuser/electrode have approximately the same area and approximately the same planar geometry as the surface of the ceiling of the cavity.

8. The material removal tool of claim 4, wherein the electrically conductive gas diffuser/electrode is fabricated from porous silicon carbide.

9. The material removal tool of claim 4, wherein the electrically conductive gas diffuser/electrode is fabricated from stainless steel (316).

10. The material removal tool of claim 4, wherein the second electrode is maintained substantially at ground potential.

11. The material removal tool of claim 3, wherein the means for adjusting the position of a cavity with respect to said substrate surface in the orthogonal direction comprises an x-y positioning table.

12. The material removal tool of claim 3, wherein said housing includes means for applying a vacuum to the housing to remove reaction product and excess process gas.

13. The material removal tool of claim 3, further comprising extending the first dielectric insulator defining the walls of each cavity a predetermined amount beyond the surface of the second dielectric proximate to the substrate surface so as to create a region of high plasma and low reactive gas flow conductance circumferentially adjacent to a site where plasma etching is occurring.

14. A material removal tool for performing confined plasma assisted chemical etching reactions on the surface of a substrate comprising a reactor having:

a first dielectric insulator positioned within the housing and wherein said insulator has plurality of plasma chambers for performing a local plasma etching reaction about a localized region of a substrate;

means for selectively supplying a plasma chamber of said plurality with a flow of process gas including a gas diffuser/electrode;

means for selectively providing the process gas within a selected plasma chamber with rf power so as to generate a plasma therein, and wherein said means includes a first electrode positioned within each plasma chamber, an electrically conductive rf gas diffuser/electrode, and a second electrode positioned outside the plasma chamber so that the substrate is positioned between the first and second electrodes so as to complete an electrical circuit for supplying rf power to the process gas within the plasma chamber;

a second dielectric insulator positioned within the housing and around the first dielectric insulator, said second dielectric insulator extending outward from the first dielectric insulator so as to insulate conductive and proximate surfaces, and thereby facilitating extinction of any plasma outside the selected plasma chamber, and extending downward toward the substrate surface a distance shorter than the first dielectric insulator so as to allow the first dielectric insulator to create a region of high plasma and reactive flow impedance circumferentially adjacent to a site where plasma etching is occurring so that plasma outside the region is extinguished;

means for supporting the substrate; and

an X-Y positioning table means for adjusting the position of said substrate surface with respect to the selected plasma chamber in an orthogonal direction.

15. A method for local precision figuring, flattening or smoothing of a substrate or film with a plasma assisted chemical etching apparatus having a plurality of plasma chambers comprising the steps of:

mounting an etchable substrate surface to an electrode;

selecting a plasma chamber for performing plasma assisted chemical etching;

positioning said preselected plasma chamber over a spot on the surface of the substrate, the precise position of the chamber dictated by the etching profile desired;

feeding a process gas stream into a feed inlet of an rf driven gas diffuser/electrode within said preselected plasma chamber;

applying rf power to an electrode within said preselected the plasma chamber to create an rf electric field within the preselected plasma chamber for decomposing the process gas into a plasma; and

controlling the area of etching and the profile of etching by relative movement between the substrate and said preselected plasma chamber.

16. The method of claim 15, wherein the area and the profile of etching is controlled by moving the substrate in two or more directions with respect to a fixed preselected plasma chamber.

17. The method of claim 15, wherein the area and profile of etching is controlled by moving the preselected plasma chamber in two or more directions with respect to a fixed substrate.