Ceramic-glass IC package assembly having multiple conductive layers

• US 5,293,069 A
• Filed: 11/12/1992
• Issued: 03/08/1994
• Est. Priority Date: 11/15/1991
• Status: Expired due to Fees

• Current Assignee: NGK Spark PLUG Company Limited (Niterra Co., Ltd.)
• Original Assignee: NGK Spark PLUG Company Limited (Niterra Co., Ltd.)
• Inventors: Maruyama, Kazuyuki, Kato, Naomiki
• Primary Examiner(s): Clark, Sheila V.
• Application Number:
  US07/974,894
• Time in Patent Office: 481 Days
• Field of Search: 257/691, 257/698, 257/700
• US Class Current: 257/698
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48237 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/49109 outside the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/04 characterised by the shape of the container or parts, e.g. caps, walls
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 23/24 solid or gel at the normal operating temperature of the device H01L23/3135 takes precedence
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/1517 Multilayer substrate
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/16152 : Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/16195 : Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/16315 : Shape
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/30107 : Inductance

Abstract

A ceramic base of an IC package has a laminated structure and has two conductive layers sandwiched between insulating ceramic layers. One of the conductive layers is used as a power source layer and electrically connects a plurality of power source terminals of an IC chip to a single power source lead. The other conductive layer is used as an earth layer and electrically connects a plurality of earth terminals of the IC chip to a single earth lead.

Claims

1. An IC package assembly comprising:

a ceramic base having a laminated structure including first and second conductive layers;

an IC chip installed on said base and having a plurality of power source terminals electrically connected to said first conductive layer by wire bonding and a plurality of earth terminals connected to said second conductive layer by wire bonding;

a first external lead electrically connected to said first conductive layer to serve as a power source lead;

a second external lead electrically connected to said second conductive layer to serve as an earth lead;

first sealing glass means for securing said first and second external leads to said base;

a closure member; and

second sealing glass means for securing said closure member to said base and hermetically sealing said IC chip;

said first sealing glass means further comprising a sheet of first low temperature glass having a pair of openings filled with silver glass for electrically connecting said first and second external leads to said first and second conductive layers, respectively.

2. An IC package assembly according to claim 1, wherein said ceramic base has a pair of openings at locations coinciding with said openings of said first low temperature glass, said openings of said base having bottoms defined by said first and second conductive layers, respectively, said openings of said base being filled with conductive ink to form conductive posts electrically connected to said silver glass filling said opening of said first low temperature glass for thereby electrically connecting said first and second external leads to said first and second conductive layers, respectively.

3. An IC package assembly according to claim 2, wherein said conductive posts are covered by Ni plating at portions where they are electrically connected to said silver glass.

4. An IC package assembly according to claim 2, wherein said conductive posts are covered by Au plating at portion where they are electrically connected to said silver glass.

5. An IC package assembly according to claim 2, wherein said ceramic base is formed from three ceramic green sheets consisting of a first green sheet having a central portion for installing thereon said IC chip and an upper surface covered by said second conductive layer, a second green sheet placed upon said first green sheet and having at a central portion thereof and opening for loosely surrounding said IC chip, said second green sheet having an upper surface covered by said first conductive layer, and a third green sheet placed upon said second green sheet and having at a central portion thereof an opening larger than said opening of said second green sheet so that said base has a stepwisely recessed central portion in which said IC chip is installed.

6. An IC package assembly according to claim 5, wherein said first green sheet is recessed at a central portion thereof to form a further stepwisely recessed central portion of said base, said IC chip being installed on a bottom of said further stepwisely recessed central portion of said base by way of a mounting made of a conductive joining material.

7. An IC package assembly according to claim 6, wherein said conductive joining material is silver glass.

8. An IC package assembly according to claim 6, wherein said conductive joining material is silver polyimide.

9. An IC package assembly according to claim 5, wherein said first mentioned sealing glass means comprises first low temperature glass and said second sealing glass means comprises second low temperature glass having a lower melting point than said first low temperature glass.

10. An IC package assembly according to claim 9, wherein said closure member comprises a frame secured to said base by means of said second low temperature glass and a cover secured to said frame by means of third sealing glass means.

11. An IC package assembly according to claim 10, wherein said third sealing glass means comprises third low temperature glass having a lower melting point than said second low temperature glass.

12. An IC package assembly according to claim 9, wherein said closure member and said second low temperature glass are formed with a recess for providing a space around a joining portion between said silver glass and said first external lead.

13. An IC package assembly according to claim 9, wherein said closure member and said second low temperature glass are formed with a recess for providing a space around a joining portion between said silver glass and said second external lead.

14. An IC package assembly according to claim 1, wherein said ceramic base has a pair of openings having bottoms defined by said first and second conductive layers, respectively, said openings of said first low temperature glass being arranged so as to coincide with said openings of said ceramic base, said openings of said base being filled with silver glass by way of which said first and second external leads are electrically connected to said first and second conductive layers, respectively.

15. An IC package assembly according to claim 1, wherein said external leads have end portions bent into said silver glass.

16. An IC package assembly according to claim 1, wherein said external leads have end potions formed with openings, said silver glass further filling said openings of said external leads.

19. An IC package assembly according to claim 1, further comprising a mass of synthetic resinous material applied to said base in such a manner that said IC chip is buried and hermetically sealed in said mass of synthetic resinous material.

20. An IC package assembly according to claim 1, wherein said first and second external leads are electrically connected to the first and second conductive layer, respectively, by means selected from the group consisting of silver polyimide, silver glass and bonding wire.

17. An IC package assembly comprising:

a ceramic base having a laminated structure including first and second conductive layers;

an IC chip installed on said base and having a plurality of power source terminals electrically connected to said first conductive layer and a plurality of earth terminals connected to said second conductive layer;

a first external lead electrically connected to said first conductive layer to serve as a power source lead;

a second external lead electrically connected to said second conductive layer to serve as an earth lead;

first sealing glass means for securing said first and second external leads to said base; and

a closure member secured to said base for hermetically sealing said IC chip, said closure member consisting of a frame secured to said base by means of second sealing glass and a cover secured to said frame by means of third sealing glass means, said base and said second sealing glass means cooperating to define cavities extending between said first and second external leads and said first and second conductive layers, respectively, and receiving bonding ires electrically connecting therebetween, said cavities having top ends defined by said frame.

18. An IC package assembly according to claim 17, wherein one of said cavities has a bottom which is defined by a third conductive layer at the same level with said first conductive layer whilst the other of said cavities has a bottom which is defined by said first conductive layer, said second external lead being electrically connected to said second conductive layer by way of one of said bonding wire, said third conductive layer and a conductive post provided between said second and third conductive layers.