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Ceramic-glass IC package assembly having multiple conductive layers

  • US 5,293,069 A
  • Filed: 11/12/1992
  • Issued: 03/08/1994
  • Est. Priority Date: 11/15/1991
  • Status: Expired due to Fees
First Claim
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1. An IC package assembly comprising:

  • a ceramic base having a laminated structure including first and second conductive layers;

    an IC chip installed on said base and having a plurality of power source terminals electrically connected to said first conductive layer by wire bonding and a plurality of earth terminals connected to said second conductive layer by wire bonding;

    a first external lead electrically connected to said first conductive layer to serve as a power source lead;

    a second external lead electrically connected to said second conductive layer to serve as an earth lead;

    first sealing glass means for securing said first and second external leads to said base;

    a closure member; and

    second sealing glass means for securing said closure member to said base and hermetically sealing said IC chip;

    said first sealing glass means further comprising a sheet of first low temperature glass having a pair of openings filled with silver glass for electrically connecting said first and second external leads to said first and second conductive layers, respectively.

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