Integrated heat sink having a sinuous fluid channel for the thermal dissipation of semiconductor modules
First Claim
1. An electronic semiconductor module heat sink for providing direct heat exchange medium contact with a module electrode and possessing a uniform TCE, comprising:
- a) a base having generally a block shape and comprised of a first thermally conductive material, said base containing a sinuous channel therethrough which communicates between inlet and outlet means;
b) a first place disposed on top of said base and covering said channel, said first plate comprising said module electrode, said module electrode comprising an electrically and thermally conductive element layer direct bonded to a ceramic substrate, said ceramic substrate contacting directly with said sinuous channel such that a plurality of semiconductor chips that are soldered to said top-disposed plate contact, in common, said electrically and thermally conductive element layer of said module electrode and are in thermal communication with said channel through said electrically and thermally conductive element layer and said ceramic substrate; and
c) a second plate disposed on said base opposite said top-disposed plate and comprising a second thermally conductive material which is TCE-compatible with said base and covers said channel opposite said top-disposed plate.
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Accused Products
Abstract
An integrated heat sink module includes a sinuously channeled base and a bonded top surface electrode that is dielectrically isolated from the base. The top surface electrode acts as a common modular electrode capable of conducting heat to an ultimate cooling medium with no intervening thermal barrier. Constrained copper technology (CCT) is employed to ensure that the relatively low effective temperature coefficient of expansion of the channel base is acquired by the channel cover, which is the dielectrically (but not thermally) insulated top surface, and that the common electrode is integrated with, by forming a part of, the fluid channel in the base. The heat sink weight is reduced significantly by the channeling, while use of the CCT technology ensures high reliability and integrity of the module.
60 Citations
3 Claims
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1. An electronic semiconductor module heat sink for providing direct heat exchange medium contact with a module electrode and possessing a uniform TCE, comprising:
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a) a base having generally a block shape and comprised of a first thermally conductive material, said base containing a sinuous channel therethrough which communicates between inlet and outlet means; b) a first place disposed on top of said base and covering said channel, said first plate comprising said module electrode, said module electrode comprising an electrically and thermally conductive element layer direct bonded to a ceramic substrate, said ceramic substrate contacting directly with said sinuous channel such that a plurality of semiconductor chips that are soldered to said top-disposed plate contact, in common, said electrically and thermally conductive element layer of said module electrode and are in thermal communication with said channel through said electrically and thermally conductive element layer and said ceramic substrate; and c) a second plate disposed on said base opposite said top-disposed plate and comprising a second thermally conductive material which is TCE-compatible with said base and covers said channel opposite said top-disposed plate. - View Dependent Claims (2, 3)
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Specification