Sensor for semiconductor device manufacturing process control
First Claim
1. A sensor for semiconductor device manufacturing process control wherein said semiconductor device is on a semiconductor wafer comprising:
- a coherent electromagnetic beam energy source;
a fiber optic network associated with said energy source, said fiber optic network including a fiber termination for directing coherent electromagnetic beam energy in the direction of the semiconductor wafer and for receiving coherent electromagnetic beam energy reflected from the semiconductor wafer in a specular direction;
a first receive sensor element connected to said fiber termination for measuring the coherent electromagnetic beam energy reflected in the spectral direction as coherent beam power;
a second receive sensor element for measuring electromagnetic beam energy reflected as scattered beam power from the semiconductor wafer, said second receive sensor element measuring simultaneously with said first receive sensor element;
a lens for focusing said electromagnetic beam energy reflected as scattered beam power to said second receive sensor and disposed between said semiconductor wafer and said fiber termination; and
circuitry of determining semiconductor wafer surface roughness based on the measurements of said beam energy reflected as coherent beam power and reflected as scattered beam power.
1 Assignment
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Accused Products
Abstract
A fiber-optic sensor device (210) for semiconductor device manufacturing process control measures polycrystalline film thickness as well as surface roughness and spectral emissivity of semiconductor wafer (124). The device (210) comprises a sensor arm (212) and an opto-electronic interface and measurement box (214), for directing coherent laser energy in the direction of semiconductor wafer (124). Opto-electronic interface/measurement unit (214) includes circuitry for measuring the amounts of laser power coherently reflected in the specular direction from the semiconductor wafer (124) surface, scatter reflected from the semiconductor wafer (124) surface, coherently transmitted in the specular direction through the semiconductor wafer (124), and scatter transmitted through the semiconductor wafer (124). The present invention determines the semiconductor wafer (124) surface roughness and spectral emissivity values using the measured optical powers of incident, specular reflected, scatter reflected, specular transmitted, and scatter transmitted beams.
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Citations
48 Claims
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1. A sensor for semiconductor device manufacturing process control wherein said semiconductor device is on a semiconductor wafer comprising:
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a coherent electromagnetic beam energy source; a fiber optic network associated with said energy source, said fiber optic network including a fiber termination for directing coherent electromagnetic beam energy in the direction of the semiconductor wafer and for receiving coherent electromagnetic beam energy reflected from the semiconductor wafer in a specular direction; a first receive sensor element connected to said fiber termination for measuring the coherent electromagnetic beam energy reflected in the spectral direction as coherent beam power; a second receive sensor element for measuring electromagnetic beam energy reflected as scattered beam power from the semiconductor wafer, said second receive sensor element measuring simultaneously with said first receive sensor element; a lens for focusing said electromagnetic beam energy reflected as scattered beam power to said second receive sensor and disposed between said semiconductor wafer and said fiber termination; and circuitry of determining semiconductor wafer surface roughness based on the measurements of said beam energy reflected as coherent beam power and reflected as scattered beam power. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method for measuring physical parameters of a semiconductor wafer using a coherent electromagnetic energy sensing process control device, comprising the steps of:
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generating coherent electromagnetic energy; transmitting said coherent electromagnetic energy along a fiber optic path; directing said coherent electromagnetic energy as an electromagnetic beam in a direction substantially perpendicular to the semiconductor wafer; measuring the amount of electromagnetic beam energy coherently reflected from the semiconductor wafer in said substantially perpendicular direction and simultaneously measuring the amount of electromagnetic beam energy scatter reflected from the semiconductor wafer surface; and determining semiconductor wafer surface roughness based on measurements of said coherent beam of electromagnetic energy, said coherently reflected electromagnetic beam energy, and said scatter reflected electromagnetic beam energy. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29)
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30. A system for semiconductor wafer processing comprising:
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a semiconductor wafer fabrication reactor; and an electromagnetic energy sensing fabrication process control device, comprising; an energy source for producing coherent electromagnetic energy; a fiber optic network for directing said coherent electromagnetic energy in the direction of a semiconductor wafer; a first receive sensor element for measuring the amount of electromagnetic power coherently reflected from the semiconductor wafer surface in the specular direction; a second receive sensor element for measuring the amount of electromagnetic power scatter reflected from the semiconductor wafer surface; a transmit sensor element for measuring the amount of electromagnetic power coherently transmitted through the semiconductor wafer and the amount of electromagnetic power scatter transmitted through the semiconductor wafer; and components for determining semiconductor wafer surface roughness based on measurements of said coherently reflected electromagnetic power, said scatter reflected electromagnetic power, said coherently transmitted electromagnetic power, and said scatter transmitted electromagnetic power. - View Dependent Claims (31, 32, 33, 34, 35, 36, 37, 38, 39)
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40. A system for measuring semiconductor wafer temperature and adjusting the temperature measurements in a thermal processing reactor utilizing a heating lamp module, wherein the temperature measurement adjustments compensate for semiconductor wafer surface roughness and emissivity, comprising:
a temperature measurement device, comprising; at least one pyrometer position with the heating lamp module between said pyrometer and the wafer; a light pipe optically coupling said pyrometer and the wafer through the lamp module, such that said pyrometer may determine the temperature of the wafer; a lamp power supply; a controller for adjusting output from the lamp module based on input from said pyrometer, such that the wafer temperature may be adjusted; and a device for measuring the semiconductor wafer surface roughness and spectral emissivity, said device comprising; a coherent electromagnetic energy source; components for directing coherent electromagnetic energy in the direction of the wafer; components for measuring the amount of electromagnetic power coherently reflected from the semiconductor wafer surface in the specular direction; components for measuring the amount of electromagnetic power scatter reflected from the semiconductor wafer surface; components for measuring the amount of electromagnetic power coherently transmitted through the semiconductor wafer in the specular direction; components for measuring the amount of electromagnetic power scatter transmitted through the semiconductor wafer; circuitry for extracting wafer surface roughness and spectral emissivity based on measurements of said . coherent electromagnetic energy, said coherently reflected electromagnetic power, said scattered reflected electromagnetic power, said coherently transmitted electromagnetic power, and said scatter transmitted electromagnetic power; and circuitry for compensating temperature measurements of said temperature measurement device for surface roughness and spectral emissivity measurements from said semiconductor wafer surface roughness and spectral emissivity device. - View Dependent Claims (41, 42, 43, 44, 45, 46, 47)
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48. A sensor for semiconductor device manufacturing process control wherein said semiconductor device is on a stationary semiconductor wafer comprising:
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an incident electromagnetic beam energy source; a fiber optic network associated with said energy source for directing coherent electromagnetic beam energy in the direction of the semiconductor wafer; a first receive sensor module for measuring electromagnetic beam energy reflected as coherent beam power from the semiconductor wafer in the specular direction and electromagnetic beam energy reflected as scattered beam power from the semiconductor wafer; a second receive sensor module for measuring electromagnetic beam energy transmitted as coherent beam power through the semiconductor wafer in the specular direction and electromagnetic beam energy transmitted as scattered beam power through the semiconductor wafer; circuitry for determining semiconductor wafer surface roughness based on the measurements of said beam energy reflected as coherent beam power and reflected as scattered beam power; and circuitry for extracting semiconductor wafer spectral emissivity based on measurements of said incident beam energy, measurements of coherent reflected beam energy, measurements of scattered reflected beam energy, measurements of coherent transmitted beam energy, and measurements of scattered transmitted beam energy.
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Specification