Package for a semiconductor device

• US 5,293,511 A
• Filed: 03/16/1993
• Issued: 03/08/1994
• Est. Priority Date: 03/16/1993
• Status: Expired due to Term

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: McKinley, John T., Poradish, Frank
• Primary Examiner(s): WOJCIECHOWICZ, EDWARD JOSEPH
• Application Number:
  US08/033,687
• Time in Patent Office: 357 Days
• Field of Search: 257/432, 257/434, 257/680, 257/700, 257/703, 257/704
• US Class Current: 257/434
• CPC Class Codes: G02B 26/0833 the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD G02B26/0825 takes precedence; micromechanical devices in general B81B
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 23/04 characterised by the shape of the container or parts, e.g. caps, walls
• CPC Class Codes: H01L 23/057 the leads being parallel to the base
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 23/26 including materials for absorbing or reacting with moisture or other undesired substances , e.g. getters
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A package (44) for a semiconductor device (10) includes a

ceramic base (46, 146) with a mounting surface (50, 150) for supporting the device (10) and a light-transmissive cover (42, 142). A refractory seal ring (70) is fused to the base (46, 146) and to conductive paths (22) thereon. The upper surface (72) of the seal ring (70) is rendered optically flat with a selected angular relationship to the mounting surface (50). The upper and lower faces (76 & 78) of the cover (42, 142) are rendered optically flat with a selected angular relationship to each other, so that with an outer portion of the lower face (78) resting on the upper surface (72) of the seal ring (70), the faces (76, 78) have a selected angular relationship with the mounting surface (50, 150). The package (44) is expedient where the device (10) includes DMD'"'"'s (30) having deflectable, light-reflective beams (32). The lower face (78) of the cover (42) includes an annular light-reflective coating (60, 160) surrounding a window (80) overlying the device (10). In some embodiments, the reflective coating (60) is deposited on the walls (56, 58) of a groove (54) formed in the lower face (78) of the cover (42). Facilities (90, 72/78 or 100) seal the cover (42, 142) to the seal ring (70). The reflective coating (60, 160) prevents any unmodulated light which is incident on the beams (32) from entering an optical system associated with the DMD-containing device (10). The sealing facilities (90, 72/78 or 100) include adhesives (90), which may contain microspheres, soft metals (90), glass frits (90), fusion bonding of the cover (42) to the seal ring (70), and solder preforms (100).

Claims

1. A package for a semiconductor device, the device being of the type which includes a light-reflecting beam movable between one position, in which light incident on the beam is and one or more other positions, in which the incident light is modulated, the package comprising:

a ceramic base having a mounting surface for supporting the device;

a first metallic pattern on the base, the first pattern including first metallic paths extending from the periphery of the base to the periphery of the mounting surface for electrical connection to the mounted device;

a generally torroidal and planar seal ring constituted of an electrically insulative, refractory material, the seal ring overlying the base and the first metallic paths between the peripheries of the base and the mounting surface, having its lower surface fused to the underlying base and first metallic paths and having an opposed upper surface ground and polished so as to be optically flat with a selected angular relationship relative to the mounting surface;

a light-transmissive glass cover overlying the device, which cover is generally congruent with the outer periphery of the seal ring, upper and lower faces of the cover being ground and polished to optical flatness and having a selected angular relationship to each other so that, with the outer portion of the lower face of the cover resting on the seal ring, the upper and lower faces have a selected angular relationship relative to the mounting surface, the lower face of the cover having formed therein an annular groove which generally overlies the inner periphery of the seal ring and the periphery of the mounting surface cavity, the groove being generally triangular in cross-section and having an outer wall which is generally perpendicular to the faces of the cover and an inner wall which slopes away from the outer wall toward the lower face of the cover;

a light-reflective coating on the walls of the groove; and

means for sealing the outer portion of the lower face of the cover to the seal ring.

2. Apparatus as in claim 1, wherein:

the sealing means comprises an adhesive at the interface of the seal ring and the lower face of the cover.

3. Apparatus as in claim 2, wherein:

the adhesive is a low outgassing adhesive.

4. Apparatus as in claim 3, wherein:

the adhesive contains microspheres which reside in the interface in a single tier to fix the width of the interface.

5. Apparatus as in claim 4, wherein:

the microspheres are plastic or glass.

6. Apparatus as in claim 2, which further comprises:

a getter located in the groove for preventing outgassing from the adhesive from adversely affecting the device.

7. Apparatus as in claim 1, wherein:

the sealing means comprises a soft metal at the interface of the seal ring and the lower face of the cover.

8. Apparatus as in claim 7, wherein:

the soft metal is selected from the group consisting of indium and indium alloy.

9. Apparatus as in claim 7, wherein:

the cover and the seal ring are sealed together by applying force generally perpendicularly to the interface therebetween to cause the soft metal to cold flow.

10. Apparatus as in claim 7, wherein:

the cover and the seal ring are sealed together by applying force generally parallel to the interface therebetween to cause the soft metal to cold flow.

11. Apparatus as in claim 7, wherein:

the cover and the seal ring are sealed together by applying force which is both perpendicular and parallel to the interface therebetween to cause the soft metal to cold flow.

12. Apparatus as in claim 11, wherein:

the force parallel to the interface is vibratory.

13. Apparatus as in claim 7, wherein:

the sealing means further comprises an adherent substance applied to the cover and the seal ring at the outer periphery of the interface therebetween, the adherent substance preventing shear forces applied parallel to the interface from relatively moving the cover and the seal ring.

14. Apparatus as in claim 1, wherein:

the sealing means comprises the ground and polished portions of the seal ring and the lower face of the cover which are sufficiently optically flat so that the application of force perpendicular to the interface therebetween effects a fusion bond of the cover to the seal ring.

15. Apparatus as in claim 14, wherein:

the ground and polished portions are optically flat to about one fringe or less.

16. Apparatus as in claim 14, wherein:

the sealing means further comprises an adherent substance applied to the cover and the seal ring at the outer periphery of the interface therebetween, the adherent substance preventing shear forces applied parallel to the interface from relatively moving the cover and the seal ring.

17. Apparatus as in claim 1, wherein:

the sealing means comprises

a solder-wettable coating on the upper surface of the seal ring,

a solder-wettable coating on the outer portion of the lower face of the cover, and

a solder layer sealing the coatings together.

18. Apparatus as in claim 17, wherein:

the solder layer is produced by placing a solder preform at the interface of the cover and the seal ring and then applying sufficient heat to the preform to effect melting thereof, following which the solder resolidifies to seal the interface.

19. Apparatus as in claim 18, wherein:

the heat is applied to the preform in the form of concentrated radiant energy.

20. Apparatus as in claim 19, wherein:

the radiant energy is applied to the preform through the cover.

21. Apparatus as in claim 20, wherein the coating on the outer portion of the lower face of the cover is radiant-energy-reflective and wherein:

the coating on the outer portion of the lower face of the cover is discontinuous between the inner and outer peripheries of the outer portion for the full circumference of the outer portion, the discontinuity permitting the radiant to reach and melt the preform.

22. Apparatus as in claim 1, wherein:

the sealing means comprises a glass frit layer at the interface of the cover and the seal ring.

23. Apparatus as in claim 22, wherein:

the glass frit layer is produced by placing a glass frit preform at the interface and then fusing the preform to the cover and the seal ring.

24. Apparatus as in claim 23, wherein:

the fusing of the preform is effected by the application to the preform of concentrated radiant energy.

25. Apparatus as in claim 24, wherein:

the radiant energy is applied to the preform through the cover.

26. Apparatus as in claim 1, wherein:

the first metallic pattern is deposited on the base when the ceramic thereof is green, the base being thereafter fired to fuse the first pattern to the base.

27. Apparatus as in claim 26, wherein:

the seal ring is placed on the base when the seal ring is green, the seal ring being thereafter fired to fuse the seal ring to the base and the first metallic pattern.

28. Apparatus as in claim 1, wherein:

the first metallic pattern is deposited on the base after the ceramic has been fired, the first pattern being thereafter fired to fuse it to the base.

29. Apparatus as in claim 28, wherein:

the seal ring is placed on the base when the seal ring is green, the seal ring being thereafter fired to fuse the seal ring to the base and the first metallic pattern.

30. Apparatus as in claim 1, wherein:

the light-reflective coating on the walls of the groove is produced by simultaneously metallizing without masking the walls of the groove and the lower face of the cover and then grinding and polishing the lower face of the cover to remove the metallization therefrom.

31. Apparatus as in claim 1, which further comprises:

a ground path in the first metallic pattern, the ground path and the light-reflective coating being electrically conductive, and

means for electrically interconnecting the ground path and the light-reflective coating when the cover rests on the seal ring.

32. Apparatus as in claim 31, wherein:

the electrical interconnecting means comprises

an electrically conductive surface feature located in the groove and being electrically continuous with the light-reflective coating, and

compliant means attached to the ground path for resiliently electrically engaging the surface feature when the cover rests on the seal.

33. Apparatus as in claim 32, wherein:

the interconnection of the ground path and the light-reflective coating is effective to obviate the presence on the cover of a static electric charge sufficiently large to adversely affect the movement of the beam.

34. Apparatus as in claim 32, wherein:

the portion of the cover overlying the device is spaced sufficiently far therefrom to obviate any static electric charge on the cover from adversely affecting the movement of the beam.

35. Apparatus as in claim 34, wherein:

the interconnection of the ground path and the light-reflective coating is effective to obviate the presence on the cover of a static electric charge sufficiently large to adversely affect the movement of the beam,

the interconnection and the cover-device spacing minimizing any significant static electric charge on the cover and preventing such charge as occurs from adversely affecting movement of the beam.

36. Apparatus as in claim 1, wherein:

the base has a device-conformal, device-receiving first cavity therein, and

the mounting surface is a floor of the cavity.

37. A package for a semiconductor device, the device being of the type which includes a light-reflecting beam movable between one position, in which light incident on the beam is modulated, and one or more other positions, in which the incident light is not modulated, the package comprising:

a ceramic base having a mounting surface for supporting the device;

a first metallic pattern on the base, the first pattern including first metallic paths extending from near the periphery of the base to near the periphery of the mounting surface for electrical connection to the mounted device;

a generally torroidal and planar seal ring constituted of an electrically insulative, refractory material, the seal ring overlying the base and the first metallic paths between the peripheries of the base and the mounting surface, having its lower surface fused to the underlying base and first metallic paths and having an opposed upper surface ground and polished so as to be optically flat with a selected angular relationship relative to the mounting surface;

a light-transmissive glass cover overlying the device, which cover is generally congruent with the outer periphery of the seal ring, upper and lower faces of the cover being ground and polished to optical flatness and having a selected angular relationship to each other so that, with the outer portion of the lower face of the cover resting on the seal ring, the upper and lower faces have a selected angular relationship relative to the mounting surface;

a generally annular light-reflective coating on the lower face of the cover, the coating defining a central uncoated window aligned with the device; and

means for sealing the outer portion of the lower face of the cover to the seal ring.

38. Apparatus as in claim 37, wherein:

the lower face of the cover has formed therein an annular groove which generally overlies the inner periphery of the seal ring and the periphery of the mounting surface cavity, the light reflective coating residing on the walls of the groove.

39. Apparatus as in claim 38, wherein:

the groove is generally triangular in cross-section and has an outer wall which is generally perpendicular to the faces of the cover and an inner wall which slopes away from the outer wall toward the lower face of the cover.

40. Apparatus as in claim 37, wherein:

the sealing means comprises an adhesive at the interface of the seal ring and the lower face of the cover.

41. Apparatus as in claim 40, wherein:

the adhesive is a low outgassing adhesive.

42. Apparatus as in claim 40, wherein:

the adhesive contains microspheres which reside in the interface in a single tier to fix the width of the interface.

43. Apparatus as in claim 42, wherein:

the microspheres are plastic or glass.

44. Apparatus as in claim 37, which further comprises:

a getter located in the volume defined by the base, the seal ring and the cover for preventing outgassing from the adhesive from adversely affecting the device.

45. Apparatus as in claim 37, wherein:

the sealing means comprises a soft metal at the interface of the seal ring and the lower face of the cover.

46. Apparatus as in claim 45, wherein:

the soft metal is selected from the group consisting of indium and indium alloys.

47. Apparatus as in claim 45, wherein:

the cover and the seal ring are sealed together by applying force generally perpendicularly to the interface therebetween to cause the soft metal to cold flow.

48. Apparatus as in claim 45, wherein:

the cover and the seal ring are sealed together by applying force generally parallel to the interface therebetween to cause the soft metal to cold flow.

49. Apparatus as in claim 45, wherein:

the cover and the seal ring are sealed together by applying force which is both perpendicular and parallel to the interface therebetween to cause the soft metal to cold flow.

50. Apparatus as in claim 49, wherein:

the force parallel to the interface is vibratory.

51. Apparatus as in claim 45, wherein:

the sealing means further comprises an adherent substance applied to the cover and the seal ring at the outer periphery of the interface therebetween, the adherent substance preventing shear forces applied parallel to the interface from relatively moving the cover and the seal ring.

52. Apparatus as in claim 37, wherein:

the sealing means comprises the ground and polished portions of the seal ring and the lower face of the cover which are sufficiently optically flat so that the application of force perpendicular to the interface therebetween effects a fusion bond of the cover to the seal ring.

53. Apparatus as in claim 52, wherein:

the ground and polished portions are optically flat to about one fringe or less.

54. Apparatus as in claim 52, wherein:

the sealing means further comprises an adherent substance applied to the cover and the seal ring at the outer periphery of the interface therebetween, the adherent substance preventing shear forces applied parallel to the interface from relatively moving the cover and the seal ring.

55. Apparatus as in claim 37, wherein:

the sealing means comprises

a solder-wettable coating on the upper surface of the seal ring,

a solder-wettable coating on the outer portion of the lower face of the cover, and

a solder layer sealing the coatings together.

56. Apparatus as in claim 55, wherein:

the solder layer is produced by placing a solder preform at the interface of the cover and the seal ring and then applying sufficient heat to the preform to effect melting thereof, following which the solder resolidifies to seal the interface.

57. Apparatus as in claim 56, wherein:

the heat is applied to the preform in the form of concentrated radiant energy.

58. Apparatus as in claim 57, wherein:

the radiant energy is applied to the preform through the cover.

59. Apparatus as in claim 58, wherein the coating on the outer portion of the lower face of the cover is radiant-energy-reflective and wherein:

the coating on the outer portion of the lower face of the cover is discontinuous between the inner and outer peripheries of the outer portion for the full circumference of the outer portion, the discontinuity permitting the radiant to reach and melt the preform.

60. Apparatus as in claim 37, wherein:

the sealing means comprises a glass frit layer at the interface of the cover and the seal ring.

61. Apparatus as in claim 60, wherein:

the glass frit layer is produced by placing a glass frit preform at the interface and then fusing the preform to the cover and the seal ring.

62. Apparatus as in claim 61, wherein:

the fusing of the preform is effected by the application to the preform of concentrated radiant energy.

63. Apparatus as in claim 62, wherein:

the radiant energy is applied to the preform through the cover.

64. Apparatus as in claim 37, wherein:

the first metallic pattern is deposited on the base when the ceramic thereof is green, the base being thereafter fired to fuse the first pattern to the base.

65. Apparatus as in claim 64, wherein:

the seal ring is placed on the base when the seal ring is green, the seal ring being thereafter fired to fuse the seal ring to the base and the first metallic pattern.

66. Apparatus as in claim 37, wherein:

the first metallic pattern is deposited on the base after the ceramic has been fired, the first pattern being thereafter fired to fuse it to the base.

67. Apparatus as in claim 66, wherein:

the seal ring is placed on the base when the seal ring is green, the seal ring being thereafter fired to fuse the seal ring to the base and the first metallic pattern.

68. Apparatus as in claim 37, which further comprises:

a ground path in the first metallic pattern, the ground path and the light-reflective coating being electrically conductive, and

means for electrically interconnecting the ground path and the light-reflective coating when the cover rests on the seal ring.

69. Apparatus as in claim 68, wherein:

the electrical interconnecting means comprises

a conductive surface feature located in the groove and being electrically continuous with the light-reflective coating, and

compliant means attached to the ground path for resiliently electrically engaging the surface feature when the cover rests on the seal.

70. Apparatus as in claim 69, wherein:

the interconnection of the ground path and the light-reflective coating is effective to obviate the presence on the cover of a static electric charge sufficiently large to adversely affect the movement of the beam.

71. Apparatus as in claim 69, wherein:

the portion of the cover overlying the device is spaced sufficiently far therefrom to obviate any static electric charge on the cover from adversely affecting the movement of the beam.

72. Apparatus as in claim 69, wherein:

the interconnection of the ground path and the light-reflective coating is effective to obviate the presence on the cover of a static electric charge sufficiently large to adversely affect the movement of the beam, and

the interconnection and the cover-device spacing minimizing any significant static electric charge on the cover and preventing such charge as occurs from adversely affecting movement of the beam.

73. Apparatus as in claim 37, wherein:

the base has a device-conformal, device-receiving first cavity therein, and

the mounting surface is a floor of the cavity.

74. Apparatus as in claim 37 adapted to serve as a package for the device and for one or more chips which are electrically associated with the device, which further comprises:

one or more second cavities in the base, each second cavity being adapted to retain one of the chips therein, the size of the seal ring and the cover being sufficient for the former to surround all of the cavities and the latter to overlie all of the cavities.

75. Apparatus as in claim 74, wherein:

the first cavity is generally centrally located with respect to the second cavities.

76. Apparatus as in claim 74, which further comprises:

second metallic paths extending (i) from the first metallic paths to the second cavities, (ii) among the second cavities and (iii) from the second cavities to the periphery of the base, the seal ring being fused to the base and to the underlying metallic paths which extend to the periphery of the base.

77. Apparatus as in claim 76 wherein:

the second metallic paths are formed by selective metallization of the base after fusion of the metallic pattern to the base and before placement of the seal ring on the base.

78. Apparatus as in claim 76 which further comprises:

electrical connections among the second metallic paths, which connections cross over the metallic paths.

79. Apparatus as in claim 78 wherein:

the electrical connections comprise wires insulatively crossing over selected metallic paths and bonded to other selected metallic paths.