Multiprobe apparatus

• US 5,293,516 A
• Filed: 01/28/1992
• Issued: 03/08/1994
• Est. Priority Date: 01/28/1992
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Smetana, Pavel, Kim, Kyong-Min, Fouere, Jean-Claude
• Primary Examiner(s): NGUYEN, VINH P
• Application Number:
  US07/828,539
• Time in Patent Office: 770 Days
• Field of Search: 324/72.5, 324/158 P, 324/158 F, 357/68, 357/72, 156/647, 156/659.1, 156/662, 439/482
• US Class Current: 324/750.09
• CPC Class Codes: G01R 1/073 Multiple probes

Abstract

A multiprobe apparatus for probing a device having a plurality of contacts includes a holder for holding the device in a fixed position; a plurality of electrically conducting elongated probes, each probe being adapted for electrical communication with a respective one of the contacts by tangential linear contact along the length of the probe; and a probe support for supporting the probes and for maintaining the probes in electrical communication with the contacts.

Claims

1. A multiprobe apparatus for probing a device having a plurality of contacts, comprising:

a plurality of electrically conducting elongated probes, each probe comprising a wire of circular cross section, and each probe being adapted for electrical communication with a respective one of said contacts by tangential linear contact along the length of the probe;

a probe support comprising a silicon wafer having <

100>

orientation, said silicon wafer having a plurality of grooves along the <

110>

direction, each groove corresponding to a respective one of said contacts, and each groove having a respective one of said probes disposed therein for supporting said probes and for maintaining said probes in electrical communication with said contacts; and

holding means having a holding groove for fitting said device and said probe support with said probes therein, wherein said holding groove, in conjunction with the tangential linear contact of said probes with said contacts, allows said contacts to be properly contacted by said probes by alignment in one dimension.

2. A multiprobe apparatus according to claim 1, wherein said probes are sandwiched between said contacts and said probe support.

3. A multiprobe apparatus according to claim 1, wherein said grooves are V-shaped in cross section.

4. A multiprobe apparatus according to claim 1, wherein each of said grooves comprises two sidewalls along the (111) plane of said silicon wafer.

5. A multiprobe apparatus according to claim 1, wherein said probes comprise a material which is at least as soft as said contacts of said device.

6. A multiprobe apparatus according to claim 5, wherein said probes comprise gold.

7. A multiprobe apparatus according to claim 6, wherein said grooves are gold plated.

8. A multiprobe apparatus according to claim 1, wherein said probes are bonded into said grooves.

9. A multiprobe apparatus according to claim 1, wherein said holding means comprises vacuum means.

10. A multiprobe apparatus according to claim 1, further including temperature controlling means for controlling the temperature of the device.

11. A multiprobe apparatus according to claim 10, wherein said temperature controlling means comprises a heatsink having a temperature controlled liquid.