Adhesive composition with decorative glitter

• US 5,294,657 A
• Filed: 05/15/1992
• Issued: 03/15/1994
• Est. Priority Date: 05/15/1992
• Status: Expired due to Fees

• Current Assignee: Dennis J. Fitzmeyer, Peter S. Melendy
• Original Assignee: Dennis J. Fitzmeyer, Peter S. Melendy
• Inventors: Fitzmeyer, Dennis J., Melendy, Peter S.
• Primary Examiner(s): Michl, Paul R.
• Assistant Examiner(s): CAIN, EDWARD J
• Application Number:
  US07/883,770
• Time in Patent Office: 669 Days
• Field of Search: 524/270, 524/272, 524/274
• US Class Current: 524/270
• CPC Class Codes: C08L 2666/18 Polyesters or polycarbonates according to C08L67/00 - C08L69/00; Derivatives thereof
• CPC Class Codes: C09J 11/08 Macromolecular additives
• CPC Class Codes: C09J 123/08 Copolymers of ethene C09J123/16 takes precedence

Abstract

A hot melt adhesive composition includes decorative polyester glitter flakes. The compositions are designed for use at temperatures low enough that degradation of the glitter is avoided.

Claims

1. A low temperature hot-melt article having decorative glitter dispersed therein for being melted and then applied to a substrate in a liquid state, said article being made of a composition comprising a heat-meltable adhesive capable of being applied at a temperature of less than about 350°

F. and said decorative glitter, wherein said decorative glitter comprises a synthetic material having a specific gravity approximately that of said heat-meltable adhesive in the liquid state.

2. A composition according to claim 1 wherein said synthetic material comprises polyester flakes.

3. A composition according to claim 1 wherein said adhesive is capable of being applied at a temperature of less than about 170°

F.

4. A composition according to claim 1 wherein said adhesive comprises 10-80 percent by weight of the composition of a high melt index polymer, 0-40 percent by weight of the composition of a medium or low melt index polymer, 0-60 percent by weight of the polymer of a tackifying resin, and 0-40 percent by weight of the composition of wax.

5. A composition according to claim 4 wherein the amount of said glitter comprises 1-35 percent by weight of the composition.

6. A composition according to claim 1 wherein the weight of said decorative glitter is less than about 30% of the total weight of the composition.

7. A composition according to claim 6 wherein the weight of said decorative glitter is greater than about 10% of the weight of said composition and less than about 20% of the weight of said composition.

8. A composition according to claim 1 wherein said heat meltable adhesive comprises about 35 parts by weight of the composition of ethylene vinyl acetate with a melt index of about 2500, 7 parts by weight of the composition of ethylene vinyl acetate with a melt index of about 450, and 35 parts by weight of the composition of a tackifier.

9. A composition according to claim 8 wherein the amount of said decorative glitter is about 15 parts by weight of the composition of epoxy coated polyester glitter.

10. A composition according to claim 1 in the shape of a rod.

11. A method for heating a composition according to claim 1 comprising subjecting said composition to electromagnetic energy in the microwave region.

12. A method according to claim 11 further comprising placing said composition in a container that is substantially transparent to said electromagnetic energy.