Integrated circuit package and assembly thereof for thermal and EMI management

• US 5,294,826 A
• Filed: 04/16/1993
• Issued: 03/15/1994
• Est. Priority Date: 04/16/1993
• Status: Expired due to Fees

• Current Assignee: Nortel Networks Limited (Nortel Networks Corporation)
• Original Assignee: Northern Telecom Limited (Nortel Networks Corporation)
• Inventors: Nguyen, Khanh, Marcantonio, Gabriel
• Primary Examiner(s): Hille, Rolf
• Assistant Examiner(s): CLARK, SHEILA V
• Application Number:
  US08/047,084
• Time in Patent Office: 333 Days
• Field of Search: 257/659, 257/660, 257/677, 257/729, 257/691, 257/706, 257/676
• US Class Current: 257/659
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/315 the encapsulation having a cavity
• CPC Class Codes: H01L 23/3735 Laminates or multilayers, e.g. direct bond copper ceramic substrates
• CPC Class Codes: H01L 23/4334 Auxiliary members in encapsulations H01L23/49568 takes precedence
• CPC Class Codes: H01L 23/49541 Geometry of the lead-frame
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1433 : Application-specific integrated circuit [ASIC]
• CPC Class Codes: H01L 2924/1532 : the connection portion being formed on the die mounting surface of the substrate
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19107 : off-chip wires
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H05K 1/0218 : by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence

Abstract

A package is provided for an integrated circuit comprising a combined heat dissipating and electromagnetic shielding structure. Conveniently, the heat dissipation and shielding structure is a laminated composite structure including layers of several materials having complementary characteristics to provide high magnetic permeability, electrical conductivity, and thermal conductivity. For example, a sandwich structure of layers of copper/Kovar™/copper is effective in dissipating heat and reducing electromagnetic emission from ASICs for telecommunications applications, each dissipating in excess of 2 Watts. Preferably a substrate of the package includes a conductive die attach pad which may be grounded to bring a ground plane close to the integrated circuit. The composite electromagnetic shielding and heat dissipation structure is grounded to improve attenuation of radiated electromagnetic emission from the chip. The electromagnetic shielding and heat dissipation structure is applicable for packages for individual IC chips and for multi-chip modules.

Claims

1. An integrated circuit package, comprising:

a body comprising a dielectric portion cooperable with a substrate portion for enclosing the integrated circuit with electrically conductive members extending from the integrated circuit through the dielectric portion of the body to an exterior of the body;

the body also comprising a combined electromagnetic shielding and heat dissipation means comprising a plurality of layers forming a laminate structure overlying the dielectric portion and including;

a layer of a thermally conductive material;

a layer of a magnetic material having a high magnetic permeability to electromagnetic radiation generated by the integrated circuit;

at least one of said plurality of layers comprising an electrically conductive material and having conductive grounding means.

2. An integrated circuit package according to claim 1 wherein the substrate portion comprises a conductive region forming a die attach pad for the integrated circuit, and conductive means are provided for grounding the die attach pad.

3. An integrated circuit package according to claim 1 wherein the substrate portion of the body is thermally and electrically conductive and the shielding and heat dissipation means is thermally coupled to the substrate portion of the body and extends over the dielectric portion of the body.

4. An integrated circuit package according to claim 1 wherein the thermally conductive material comprises copper.

5. An integrated circuit package according to claim 1 wherein the magnetic material is selected from the group consisting of Kovar, Mu-metal and nickel-iron alloys.

6. An integrated circuit package according to claim 1 wherein the electromagnetic shielding and heat dissipation means comprises a first layer of copper, an overlying layer of Kovar and another layer of copper, the first copper layer being thermally coupled to the substrate portion.

7. An assembly of an integrated circuit chip and an integrated circuit package, comprising:

an integrated circuit chip;

an integrated circuit package comprising a body; and

a plurality of electrically conductive terminal members;

the body of the package having a substrate portion supporting the chip and a dielectric portion cooperable with the substrate enclosing the integrated circuit chip, with electrical connections extending between the chip and the electrically conductive terminal members, and with the conductive terminal members extending through the dielectric portion of the body to an exterior of the body;

the package providing a combined electromagnetic shielding and heat dissipation means, the combined electromagnetic shielding and heat dissipation means comprising a plurality of layers forming a laminate structure extending over at least part of the dielectric portion and being thermally coupled with the substrate portion of the body;

the plurality of layers including;

a layer of a thermally conductive material;

a layer of a magnetic material having a high magnetic permeability for electromagnetic radiation generated by operation of the integrated circuit chip;

at least one of said plurality of layers being electrically conductive and having conductive means for making a ground connection;

the integrated circuit chip being thermally coupled to the combined electromagnetic shielding and heat dissipation means through the substrate portion.

8. An assembly according to claim 7 wherein the substrate comprises an electrically conductive material providing a die attach pad for the integrated circuit chip, and conductive means are provided for grounding the die attach pad.

9. An assembly according to claim 8 wherein an electrical connection is provided from the die attach pad to at least one of said electrically conductive terminal members.

10. An assembly according to claim 8 wherein the assembly includes a conductive lead frame, and the die attach pad is integral with the conductive lead frame.

11. An assembly according to claim 7 wherein the package is supported on a printed circuit pack including a ground plane, the package being mounted so that the electrically active face of the integrated circuit chip within the package faces the ground plane of the printed circuit pack.

12. An assembly according to claim 7 including a printed circuit pack supporting the package, the printed circuit pack having a ground plane conductor;

the package is mounted so that the electrically active face of the integrated circuit chip within the package faces the ground plane of the printed circuit pack; and

the substrate of the package comprises an electrically conductive material providing a die attach pad for the integrated circuit chip, the die attach pad having an electrical connection to at least one terminal member of the package whereby the die attach pad is electrically connected to the ground plane of the printed circuit pack.

13. An assembly according to claim 7 wherein the combined electromagnetic shielding and heat dissipation comprises a first layer of an electrically and thermally conductive material and second layer of another material having a relatively low electrical conductivity and high magnetic permeability, the first and second layers being laminated together.

14. An assembly according to claim 13 wherein the first layer comprises a layer of copper and the second layer comprises a layer of Kovar.

15. An assembly according to claim 7 wherein the shielding means and heat dissipation means comprises a first layer of a thermally and electrically conductive material, an overlying layer of a magnetic material and another layer of a thermally and electrically conductive material.

16. An assembly according to claim 15 wherein the thermally and electrically conductive material comprises copper.

17. An assembly according to claim 15 wherein the magnetic material is selected from the group consisting of Kovar, Mu-metal and nickel-iron alloys.

18. An assembly according to claim 7 wherein the combined electromagnetic shielding and heat dissipation means extends over at least parts of the conductive terminal members on the exterior of the body of the package.

19. An assembly according to claim 7 wherein the laminate structure includes an exposed layer of thermally conductive material having sufficient surface area to dissipate heat generated by operation of the integrated circuit chip.