Microwave IC package
First Claim
1. A surface mountable microwave IC package comprising:
- a dielectric substrate having opposed front and rear surfaces;
a ground conductor disposed on the front surface of said dielectric substrate to which a microwave IC chip may be mounted and grounded; and
a transmission line for connecting a microwave IC chip mounted on said ground conductor to a coplanar line on an external package substrate outside the microwave IC package wherein said transmission line has a coplanar line structure including a signal conductor and a ground conductor disposed on said dielectric substrate and comprising;
an upper coplanar line disposed on the front surface of said dielectric substrate including said ground conductor;
a lower coplanar line disposed on the rear surface of said dielectric substrate; and
an intermediate coplanar line penetrating through said dielectric substrate and connecting said upper coplanar line to said lower coplanar line.
1 Assignment
0 Petitions
Accused Products
Abstract
A surface mountable microwave IC package includes a dielectric substrate; a ground conductor disposed on a front surface of a dielectric substrate on which a microwave IC chip is disposed and grounded; and a transmission line for connecting the microwave IC chip to a coplanar line on a package substrate outside the microwave IC package. The upper coplanar line is disposed on the front surface of the dielectric substrate and includes the ground conductor on which the IC chip is disposed. The lower coplanar line is disposed on the rear surface of the dielectric substrate. The intermediate coplanar line penetrates through the dielectric substrate and connects the upper coplanar line to the lower coplanar line. Therefore, the microwave transmission path from the package substrate to the IC chip is a coplanar transmission line so that a continuous transmission mode is maintained through the microwave transmission path. As a result, reflection of high frequency signals caused by the mismatching of characteristic impedances in the microwave transmission line is significantly reduced.
369 Citations
9 Claims
-
1. A surface mountable microwave IC package comprising:
-
a dielectric substrate having opposed front and rear surfaces; a ground conductor disposed on the front surface of said dielectric substrate to which a microwave IC chip may be mounted and grounded; and a transmission line for connecting a microwave IC chip mounted on said ground conductor to a coplanar line on an external package substrate outside the microwave IC package wherein said transmission line has a coplanar line structure including a signal conductor and a ground conductor disposed on said dielectric substrate and comprising; an upper coplanar line disposed on the front surface of said dielectric substrate including said ground conductor; a lower coplanar line disposed on the rear surface of said dielectric substrate; and an intermediate coplanar line penetrating through said dielectric substrate and connecting said upper coplanar line to said lower coplanar line. - View Dependent Claims (2, 3, 4, 5, 6)
-
-
7. A surface mountable microwave IC package comprising:
-
a conductive substrate having a front surface on which a microwave IC chip may be mounted and grounded and an opposed rear surface; and a transmission line for connecting a microwave IC chip mounted on said substrate to a microstrip transmission line on a package substrate wherein said transmission line has a microstrip line structure including a ground conductor, a dielectric substrate disposed on said ground conductor, and a strip signal conductor disposed on said ground conductor through said dielectric substrate and comprising; an upper microstrip line disposed on the front surface of said conductive substrate; a lower microstrip line disposed adjacent to said conductive substrate level with the rear surface of said conductive substrate; and an intermediate microstrip line disposed on said conductive substrate and connecting said upper microstrip line to said lower microstrip line. - View Dependent Claims (8, 9)
-
Specification