Optical signal free-space conversion board

• US 5,296,950 A
• Filed: 01/31/1992
• Issued: 03/22/1994
• Est. Priority Date: 01/31/1992
• Status: Expired due to Term

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: Sampsell, Jeffrey B., Lin, Tsen-Hwang, Malarcher, Falvey
• Primary Examiner(s): Lerner, Martin
• Application Number:
  US07/829,100
• Time in Patent Office: 781 Days
• Field of Search: 359/9, 359/11, 359/107, 359/108, 385/14, 365/63, 365/64
• US Class Current: 359/9
• CPC Class Codes: G02B 6/42 Coupling light guides with opto-electronic elements
• CPC Class Codes: G06E 3/006 Interconnection networks, e.g. for shuffling

Abstract

This is a board to transport and convert optical outgoing free-space signals from a spatial light modulator which comprises: at least one detector to process the outgoing free-space signal; at least one signal transmitter to process the outgoing free-space signal; and at least one outgoing optical signal carrier to carry a converted outgoing signal. Other methods and devices are disclosed.

Claims

1. A board to transport and convert optical outgoing free-space signals from a spatial light modulator comprising:

a. at least one detector to process said outgoing free-space signal;

b. at least one signal transmitter to process said outgoing free-space signal; and

c. at least one outgoing optical signal carrier to carry a converted outgoing signal, wherein said board converts free-space signals from a processing module which comprises Digital Micro-Mirror Devices and at least one Computer Generated Hologram board.

2. The board of claim 1, wherein said outgoing signal carrier is a waveguide.

3. The board of claim 1, wherein said outgoing signal carrier is a fiber-optic cable.

4. The board of claim 1, wherein said outgoing signal carrier is a combination of waveguides and fiber-optics.

5. The board of claim 1, wherein said signal transmitter is a laser.

6. The board of claim 1, wherein said board comprises one or more multi-chip module substrates.

7. The board of claim 6, wherein each of said multi-chip module substrates comprises said detector, said signal transmitter, said outgoing optical signal carrier and an incoming optical signal carrier.

8. The board of claim 1, wherein said detector, said signal transmitter, said outgoing optical signal carrier and an incoming optical signal carrier run vertically on said board.

9. The board of claim 1, wherein said board is a portion of a crossbar switch.