Apparatus and method for cooling heat generating electronic components in a cabinet

• US 5,297,005 A
• Filed: 09/28/1992
• Issued: 03/22/1994
• Est. Priority Date: 09/28/1992
• Status: Expired due to Fees

• Current Assignee: Energy Innovations, Inc.
• Original Assignee: Energy Innovations, Inc.
• Inventors: Gourdine, Meredith C.
• Primary Examiner(s): Thompson, Gregory D.
• Application Number:
  US07/952,308
• Time in Patent Office: 540 Days
• Field of Search: 361/380-386, 361/390, 361/395, 361/399
• US Class Current: 361/697
• CPC Class Codes: H05K 7/20154 Heat dissipaters coupled to components

Abstract

Electronic components in a cabinet having an exhaust fan that creates a primary air flow across the components are cooled by a cooling enclosure which encloses predetermined heat generating electronic components to isolate them from other electronic components in the cabinet. An air inlet conduit connects the cooling enclosure with the air inlets in the cabinet and an air outlet conduit connects the enclosure with the air outlets of the cabinet and the exhaust fan. The conduits and enclosure define a secondary air flow pathway across the isolated electronic components to the air outlets and exhaust fan. The secondary air flow is isolated from the primary air flow through the cabinet. The exhaust fan creating the primary air flow across the non-isolated components simultaneously creates a separate secondary air flow through the secondary air flow pathway across the isolated heat generating components whereby the non-isolated components and the isolated components are independently cooled by the primary air flow and secondary air flows, respectively, and the heat generated by the isolated components and non-isolated components is not mixed within the cabinet to maximize cooling of all components within the cabinet. The cooling enclosure may also contain a heat sink.

Claims

1. A method of cooling electronic components within a cabinet having an exhaust fan which creates a primary air flow across the components between air inlets and air outlets in the cabinet and exhausts the air to the cabinet exterior, comprising the steps of;

enclosing at least one predetermined heat generating electronic component to isolate it from other electronic components in the cabinet, and

providing a secondary air flow pathway from the air inlets across the enclosed heat generating electronic component to the air outlets and exhaust fan, the secondary air flow being isolated from the primary air flow, such that

the fan in operation creates the primary air flow across the non-isolated components between the air inlets and air outlets in the cabinet and exhausts the air to the cabinet exterior, and

simultaneously creates a separate secondary air flow through said secondary air flow pathway across the enclosed heat generating electronic component between the air inlets and air outlets in the cabinet and exhausts the secondary air flow to the cabinet exterior, whereby

the non-isolated components and the enclosed heat generating electronic component are independently cooled by the primary air flow and secondary air flow, respectively, and the heat generated by the enclosed heat generating electronic component and the non-isolated components is not mixed within the cabinet to maximize cooling of all components within the cabinet.

2. A method of cooling electronic components according to claim 1 including the steps of;

prior to enclosing the predetermined heat generating electronic component, mounting a heat sink member in thermal contact with the heat generating electronic component to be enclosed, the heat sink member having heat conduction means for conducting heat generated by the component to be enclosed;

then

enclosing the heat generating electronic component with the heat sink member mounted thereon to isolate it from other electronic components i the cabinet, and

providing a secondary air flow pathway from the air inlets across the enclosed electronic component and heat sink member heat conduction means to the air outlets and exhaust fan, the secondary air flow being isolated from the primary air flow, such that

the non-isolated components and the enclosed heat generating electronic component with the heat sink member are independently cooled by the primary air flow and secondary air flow, respectively, and the heat generated by the enclosed heat generating electronic component with the heat sing member and the non-isolated components is not mixed within the cabinet to maximize cooling of all components within the cabinet.

3. Apparatus for cooling electronic components within a cabinet of the type having air inlets and air outlets and an exhaust fan which creates a primary air flow across the components between the air inlets and air outlets in the cabinet and exhausts the air to the cabinet exterior, said apparatus comprising;

an enclosure formed of electrically non-conductive material having an interior cavity configured to enclose at least one predetermined heat generating electronic component and isolate it from other electronic components in the cabinet,

air inlet means on said enclosure connected with the air inlets of the cabinet and air outlet means on said enclosure connected with the air outlets of the cabinet and the exhaust fan, and

said air inlet means, said enclosure, and said air outlet means defining a secondary air flow pathway from the air inlets of the cabinet across the enclosed heat generating electronic component to the air outlets and exhaust fan of the cabinet which is isolated from the primary air flow,

the fan in operation creating the primary air flow across the non-isolated components between the air inlets and air outlets of the cabinet and exhausting the air to the cabinet exterior, and

simultaneously creating a separate secondary air flow through said secondary air flow pathway across the enclosed heat generating electronic component between the air inlets and air outlets of the cabinet and exhausting the secondary air flow to the cabinet exterior, such that

the non-isolated components and the enclosed heat generating electronic component are independently cooled by the primary air flow and said secondary air flow, respectively, and the heat generated by the enclosed heat generating electronic component and the non-isolated components is not mixed within the cabinet to maximize cooling of all components within the cabinet.

4. The apparatus according to claim 3 wherein;

said enclosure has at least one side wall and a top wall defining said interior cavity.

5. The apparatus according to claim 3 wherein;

said enclosure has four side walls and a top wall defining said interior cavity.

6. The apparatus according to claim 3 wherein;

the predetermined heat generating electronic component includes a heat sink component, and

said enclosure interior cavity is configured to enclose the predetermined heat generating electronic component and heat sink component and isolate them from other electronic components in the cabinet.

7. The apparatus according to claim 3 wherein;

said air inlet means and said air outlet means include an air inlet port and an air outlet port on said enclosure each in fluid communication with said interior cavity for directing air through said interior cavity of said enclosure, and

conduit means connecting said air inlet port on said enclosure with the air inlets of the cabinet and said air outlet port of said enclosure with the air outlets of the cabinet and the exhaust fan to isolate said secondary air flow pathway from the primary air flow pathway.

8. The apparatus according to claim 7 wherein;

said conduit means is formed of flexible tubular material.

9. The apparatus according to claim 7 wherein;

said conduit means comprises a tubular section of conduit connected at one end to said air inlet port on said enclosure and having releasable fastener means at its opposite end for releasable connection t the air inlets of the cabinet.

10. The apparatus according to claim 7 wherein;

said conduit means comprises a tubular section of conduit connected at one end to said air outlet port on said enclosure and having releasable fastener means at its opposite end for releasable connection to the air outlets of the cabinet through which air is exhausted by the fan.

11. The apparatus according to claim 7 wherein;

said conduit means comprises a first tubular section of conduit connected at one end to said air inlet port on said enclosure and having releasable fastener means at its opposite end for releasable connection to the air inlets in the cabinet, and

a second tubular section of conduit connected at one end to said air outlet port on said enclosure and having releasable fastener means at its opposite end for releasable connection to the air outlets of the cabinet through which air is exhausted by the fan.

12. The apparatus according to claim 3 including;

a heat sink element having heat conduction means disposed within said interior cavity of said enclosure, and

said enclosure with said heat sink element disposed therein is configured to be mounted on the predetermined heat generating electronic component with said enclosure enclosing the predetermined heat generating electronic component and said heat sink element and isolating them from other electronic components in the cabinet.

13. The apparatus according to claim 12 wherein;

said heat sink element conduction means comprises a series of parallel spaced fins aligned longitudinally between said air inlet means and said air outlet means on said enclosure to allow said secondary air flowing through said secondary air flow pathway to flow between said fins.

14. The apparatus according to claim 12 wherein;

said heat sink element conduction means comprises a series of upstanding pin elements positioned between said air inlet means and said air outlet means to allow said secondary air flowing through said secondary air flow pathway to flow between said pin elements.

15. The apparatus according to claim 3 wherein;

said air inlet means and said air outlet means on said enclosure include a system of hollow ductwork connecting said enclosure interior cavity in fluid communication with the air inlets of the cabinet and with the air outlets of the cabinet and the exhaust fan to create said secondary air flow pathway across the enclosed heat generating electronic component.

16. A cabinet for containing and cooling heat generating electronic components comprising;

a cabinet housing having mounting means for mounting electronic components thereon and air inlets and air outlets for allowing air to pass through the cabinet interior in a primary air flow pathway across said mounting means.

a plurality of electronic components including heat generating electronic components mounted on said mounting means;

an exhaust fan connected with said housing inlets and outlets to create said primary air flow pathway across said mounting means and said components mounted thereon between said air inlets and air outlets in said cabinet housing and exhaust the air to the housing exterior;

secondary air duct means in said cabinet housing configured to enclose at least one predetermined heat generating electronic component and isolate it from other components mounted therein and to connect said enclosed component in fluid communication with said air inlets, said air outlets, and said exhaust fan;

said secondary air duct means isolated from said primary air flow pathway to define a separate secondary air flow pathway therethrough from said air inlets across said enclosed heat generating electronic component to said air outlets and said exhaust fan;

said exhaust fan in operation creating said primary air flow pathway across the non-isolated components between said air inlets and said air outlets in said cabinet housing and exhausting the air to the cabinet exterior, and

simultaneously creating said separate secondary air flow pathway through said secondary air duct means across said enclosed heat generating component between said air inlets and said air outlets in said cabinet housing and exhausting the secondary air flow to the cabinet exterior, such that

the non-isolated components and said enclosed heat generating electronic component are independently cooled by the primary air flow pathway and said secondary air flow pathway, respectively, and the heat generated by said enclosed heat generating component and the non-isolated components is not mixed within said cabinet housing to maximize cooling of all components within said cabinet housing.

17. The cabinet according to claim 16 wherein;

said secondary air duct means includes a heat sink component.

18. The cabinet according to claim 17 wherein;

said at least one predetermined heat generating electronic component includes a heat sink component, and

said secondary air duct means has an interior cavity configured to enclose said at least one predetermined heat generating electronic component and said heat sink component and isolate them from other electronic components mounted within said cabinet housing.

19. The cabinet according to claim 17 wherein;

said secondary air duct means includes an enclosure formed of electrically non-conductive material having an interior cavity configured to enclose said predetermined heat generating electronic component and isolate it from other electronic components in the cabinet.

22. The cabinet according to claim 16 wherein;

said secondary air duct means comprises a first hollow duct having one end in fluid communication with said air inlets in said cabinet housing and another end positioned adjacent to said mounting means, and

a second hollow duct having one end positioned adjacent said mounting means and another end in fluid communication with said air outlets in said cabinet housing through which air is exhausted by said fan.

23. The cabinet according to claim 22 wherein;

said secondary air duct means includes a removable enclosure formed of electrically non-conducive material having an interior cavity configured to removably enclose said predetermined heat generating electronic component mounted on said mounting means and isolate it from other electronic components in said cabinet housing, and

to encompass the ends of said first and second ducts and adjacent said mounting means, such that

air flowing through said first and second ducts flow across said enclosed heat generating component between said air inlets and said air outlets in said cabinet housing and is exhausted to exterior of said cabinet housing.

24. The cabinet according to claim 23 wherein;

said enclosure includes a heat sink element in said cavity having heat conduction means, and

said enclosure with said heat sink element is configured to be mounted on said predetermined heat generating electronic component with said enclosure enclosing said heat sink element and isolating said heat sink element from other electronic components in the cabinet.

20. The cabinet according to claim 20 wherein;

said enclosure is removably connected with said secondary air duct means, and

said enclosure has at least one side wall and a top wall defining an interior cavity configured to enclose said predetermined heat generating electronic component.

21. The cabinet according to claim 20 wherein;

said enclosure has four side walls and a top wall defining an interior cavity configured to enclose said predetermined heat generating electronic component.