Method of selectively monitoring trace constituents in plating baths

• US 5,298,129 A
• Filed: 11/13/1992
• Issued: 03/29/1994
• Est. Priority Date: 11/13/1992
• Status: Expired due to Fees

• Current Assignee: Technic, Inc.
• Original Assignee: Hughes Aircraft Company (Rtx Corporation)
• Inventors: Eliash, Bruce M.
• Primary Examiner(s): Niebling, John
• Assistant Examiner(s): Bell, Bruce F.
• Application Number:
  US07/976,118
• Time in Patent Office: 501 Days
• Field of Search: 204/412, 204/434, 204/153.1, 204/DIG. 8, 204/DIG. 9, 205/81, 205/101, 205/102, 205/103, 205/104, 205/105
• US Class Current: 205/782
• CPC Class Codes: G01N 27/42 Measuring deposition or liberation of materials from an electrolyte; Coulometry, i.e. measuring coulomb-equivalent of material in an electrolyte

Abstract

A method of selectively monitoring particular trace constituents within a plating bath containing multiple trace constituents. The method provides improved selectivity over known voltammetric techniques for certain plating baths and trace constituents. The method involves applying a brief voltammetric plating signal to a pretreated electrode positioned within the plating bath solution, applying a rapid stripping signal to the plated electrode, and monitoring the resultant stripping signal response current. The characteristics of the stripping signal response current indicate the particular trace constituent concentration level. The method complements and is easily integrated with known voltammetric techniques and equipment, and thus improves the efficiency and versatility of existing plating bath analysis systems.

Claims

1. A method of selectively monitoring the concentration of an organic addition agent present in a plating bath solution containing multiple trace constituents and metal ions wherein said organic addition agent is more rapidly absorbed than said trace constituents, said method comprising the steps of:

providing at least one sensing electrode in contact with said solution;

applying a pretreatment signal of an amplitude and duration to said sensing electrode in contact with said solution in order to remove contaminants from said sensing electrode to provide a substantially contaminant-free electrode;

applying a plating signal of an amplitude and duration to said electrode, such that a portion of said metal ions from said solution form a plating on the surface of said electrode to form a plated electrode, and such that a portion of said organic addition agent is absorbed on said electrode surface;

applying a stripping signal of an amplitude and duration to said plated electrode, such that said plating on said surface of said plated electrode is removed, and further such that a stripping signal response current is produced, said stripping signal response current having signal characteristics responsive to said organic addition agent absorbed on said electrode surface; and

monitoring said signal characteristics of said stripping response current;

wherein variations in said stripping response current characteristics provide an accurate indication of the concentration level of said organic addition agent.

2. The method of claim 1 wherein said pretreatment signal is a dc signal with an amplitude of about 2.5 to 3.5 volts and a duration of about to 5 to 15 seconds.

3. The method of claim 1 wherein said plating signal is a dc pulse signal with a potential which is cathodic to yield current densities of about 100 to 1000 ma/cm² and a duration of about 50 to 100 ms.

4. The method of claim 1 wherein said stripping signal is a dc pulse signal with a potential which is cathodic to strip the metal deposit over a duration of about 5 to 1000 ms.

5. The method of claim 1 wherein said monitored characteristic of said stripping signal response current is the time interval between the initial application of said stripping signal to said plated electrode and the time at which said stripping signal response current is substantially reduced to zero,, said time interval providing an accurate indication of the concentration of said particular trace constituent.

6. The method of claim 1 wherein said plating signal duration is less than the time required for said adsorbed particular trace constituent to form a monolayer saturating said electrode surface.

7. The method of claim 1 wherein said plating bath is an acid cadmium plating bath and further wherein said multiple trace constituents include Starter K, Brightener KR and Stabilizer.

8. The method of claim 7 wherein said selectively monitored particular trace constituent is Starter K.

9. The method of claim 8 wherein said pretreatment signal is a dc signal with an amplitude of about 3.0 volts and a duration of about 10 seconds.

10. The method of claim 8 wherein said plating signal is a dc pulse signal with an amplitude of about -2 volts and a duration of about 100 ms.

11. The method of claim 8 wherein said stripping signal is a dc pulse signal with an amplitude of about +0.5 volts and a duration of about 1000 ms.