Leadless chip-type light emitting element
First Claim
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1. A light emitting element comprising:
- an insulating substrate having a cavity at the center of a top surface thereof and a through-hole formed in the bottom of said cavity, sides of said cavity slope outward toward the top surface, said through-hole extending downward through said insulating substrate to a bottom surface;
a first electrode which is formed to continuously cover a first side of said cavity, a first portion of said through-hole, a first portion of said bottom surface and a first side surface of said substrate, wherein the first electrode does not cover the entire portion of said first side surface;
a second electrode which is formed to continuously cover a second side of said cavity, a second portion of said through-hole, a second portion of the bottom surface and a second side surface of said substrate, said second side of said cavity facing said first side of said cavity, said second side surface of said substrate facing said first surface of said substrate, wherein the second electrode does not cover the entire portion of said second side surface;
light emitting means, electrically joined to said first electrode, for emitting light when electricity is conducted;
connecting means for electrically connecting said light emitting means to said second electrode; and
translucent sealing means for filling said cavity and said through hole.
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Abstract
A light emitting element having a cavity at the center of the top surface of an insulating block body. A through-hole extends downward through the block body to the bottom of the cavity. A metallic layer is present on the sides and bottom of the cavity, the sides of the through-hole, the bottom surface and part of the side surfaces of the block body. An LED chip is disposed on the metallic layer to the side of the bottom of the cavity. The LED chip and the metallic layer formed on a side of the bottom of the cavity separate from the first side are connected by a metallic wire. The cavity and the through-hole are filled with resin for encapsulating the LED chip.
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Citations
23 Claims
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1. A light emitting element comprising:
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an insulating substrate having a cavity at the center of a top surface thereof and a through-hole formed in the bottom of said cavity, sides of said cavity slope outward toward the top surface, said through-hole extending downward through said insulating substrate to a bottom surface; a first electrode which is formed to continuously cover a first side of said cavity, a first portion of said through-hole, a first portion of said bottom surface and a first side surface of said substrate, wherein the first electrode does not cover the entire portion of said first side surface; a second electrode which is formed to continuously cover a second side of said cavity, a second portion of said through-hole, a second portion of the bottom surface and a second side surface of said substrate, said second side of said cavity facing said first side of said cavity, said second side surface of said substrate facing said first surface of said substrate, wherein the second electrode does not cover the entire portion of said second side surface; light emitting means, electrically joined to said first electrode, for emitting light when electricity is conducted; connecting means for electrically connecting said light emitting means to said second electrode; and translucent sealing means for filling said cavity and said through hole. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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Specification