Thermally conductive electrical assembly

• US 5,298,791 A
• Filed: 01/26/1993
• Issued: 03/29/1994
• Est. Priority Date: 08/13/1991
• Status: Expired due to Term

• Current Assignee: Parker Intangibles LLC (Parker-Hannifin Corporation)
• Original Assignee: Chomerics, Inc. (Parker-Hannifin Corporation)
• Inventors: Jones, Peter, Liberty, James
• Primary Examiner(s): Clark, Sheila V.
• Application Number:
  US08/008,937
• Time in Patent Office: 427 Days
• Field of Search: 257/705, 257/706, 257/707, 257/708, 257/712, 257/713, 257/714, 257/717, 257/718, 257/720, 257/722
• US Class Current: 257/707
• CPC Class Codes: H01L 23/367 Cooling facilitated by shape of device H01L23/38, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence
• CPC Class Codes: H01L 23/3733 having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures H01L23/3732, H01L23/3737 take precedence
• CPC Class Codes: H01L 23/3737 Organic materials with or without a thermoconductive filler
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 428/24273 including aperture
• CPC Class Codes: Y10T 428/24579 with particulate matter
• CPC Class Codes: Y10T 428/2848 Three or more layers

Abstract

A thermally conductive interface material formed of a polymeric binder and one or more thermally fillers is disclosed. One or both of the major surfaces of the interface material has a means for removing air from between that surface and the surface to which it is attached, such as a heat sinker an electronic component. Alternatively, the heat sink or component may have the air removal means instead of or in addition to the interface material. The air removal means may be a series of embossments, channels or grooves or throughholes. Preferably, the interface is a pressure sensitive acrylic adhesive material and more preferably, it is in the form of a tape.

Claims

1. An electrical assembly comprising a means for dissipating thermal energy selected from the group consisting of heat sinks and heat spreaders, an electronic component which generates thermally energy and a means for transferring thermal energy from the electronic component to the means for dissipating thermal energy, the means for transferring thermal energy is a thermally conductive polymeric material interposed between the means for dissipating thermal energy and the electronic component and wherein the means for dissipating thermal energy and the means for transferring thermal energy have a means for removing air from between the means for transferring thermal energy and the electronic component selected from the group consisting of throughholes, embossments and grooves.

2. The assembly of claim 1 wherein the means for removing air is a series of corresponding throughholes.

3. The assembly of claim 1 wherein the means for removing air is formed in a surface of the means for transferring thermal energy adjacent the electronic component and in a surface of the means for dissipating thermal energy adjacent the means for transferring thermal energy.

4. A thermally conductive assembly comprising an electrical component mounted to a first major surface of a thermally conductive material and a heat sink mounted to a second major surface of the thermally conductive material, the second major surface being opposite the first major surface, wherein the first and second major surfaces of the thermally conductive material have an embossed surface for removing air from the first and second major surfaces of an adjacent substrate.

5. The assembly of claim 4 further comprising a surface of the heat sink adjacent the second major surface of the thermally conductive material has an embossed surface for removing air from between the surface of the heat sink and the thermally conductive material.

6. An electrical assembly comprising an electronic component, a thermally conductive material having a first major surface mounted to a surface of the electronic component, the thermally conductive material having a second major surface mounted to a heat sink, wherein the thermally conductive material has a series of throughholes running from the first major surface to the second major surface and the heat sink has a series of throughholes arranged to be in a pattern corresponding to the arrangement of throughholes in the thermally conductive material.

7. The assembly of claim 6 wherein the electronic component is selected from the group consisting of integrated circuit components and semiconductors.

8. An electrical assembly comprising a means for dissipating thermal energy having a first surface, a means for transferring thermal energy mounted to a first surface of the means for dissipating thermal energy and a means for generating thermal energy mounted to a second surface of to the means for transferring thermal energy and wherein the means for transferring thermal energy and the means for dissipating thermal energy have a means for removing air from between the first surface of the means for dissipating thermal energy and the first surface of the means for transferring thermal energy wherein the means for removing air is selected from the group consisting of throughholes, channels, grooves and embossments.

9. The assembly of claim 8 wherein the means for removing air is selected from the group consisting of throughholes, channels, groove and embossments.

10. The assembly of claim 8 wherein the means for removing air in the means for dissipating thermal energy and the means for transferring thermal energy is a series of corresponding throughholes.