Microstructure control of Al-Cu films for improved electromigration resistance

• US 5,300,307 A
• Filed: 09/14/1992
• Issued: 04/05/1994
• Est. Priority Date: 09/14/1992
• Status: Expired due to Fees

• Current Assignee: Sandia Corporation (Martin Marietta Corporation)
• Original Assignee: United States Department of Energy
• Inventors: Romig, Alton D. Jr., Frear, Darrel R., Michael, Joseph R.
• Primary Examiner(s): Lusignan, Michael
• Assistant Examiner(s): MAIORANA, DAVID MICHAEL
• Application Number:
  US07/944,865
• Time in Patent Office: 568 Days
• Field of Search: 427/383.5, 427/374.3, 427/380, 427/124, 427/96, 427/379, 427/123, 437/198, 437/188, 204/192.15
• US Class Current: 148/518
• CPC Class Codes: C22F 1/057 of alloys with copper as the next major constituent
• CPC Class Codes: C23C 14/185 by cathodic sputtering
• CPC Class Codes: C23C 14/58 After-treatment
• CPC Class Codes: C23C 14/5806 Thermal treatment
• CPC Class Codes: C23C 14/584 Non-reactive treatment
• CPC Class Codes: H01L 21/76838 characterised by the formation and the after-treatment of the conductors etching for patterning the conductors H01L21/3213
• CPC Class Codes: H01L 23/53214 the principal metal being aluminium
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10S 438/927 Electromigration resistant metallization

Abstract

A process for the forming of Al-Cu conductive thin films with reduced electromigration failures is useful, for example, in the metallization of integrated circuits. An improved formation process includes the heat treatment or annealing of the thin film conductor at a temperature within the range of from 200° C. to 300° C. for a time period between 10 minutes and 24 hours under a reducing atmosphere such as 15% H₂ in N₂ by volume. Al-Cu thin films annealed in the single phase region of a phase diagram, to temperatures between 200° C. and 300° C. have θ-phase Al₂ Cu precipitates at the grain boundaries continuously become enriched in copper, due, it is theorized, to the formation of a thin coating of θ-phase precipitate at the grain boundary. Electromigration behavior of the aluminum is, thus, improved because the θ-phase precipitates with copper hinder aluminum diffusion along the grain boundaries. Electromigration, then, occurs mainly within the aluminum grains, a much slower process.

Claims

1. A process for producing a thin layer conductive aluminum film having reduced electromigration failures, comprising:

depositing an aluminum-copper alloy thin film on a substrate;

heating said thin film to a first temperature and maintaining said film at said first temperature for a first length of time; and

heating said thin film to a second temperature, said second temperature being lower than said first temperature, and maintaining said thin film at said second temperature for a second time period sufficient for copper enrichment to occur at grain boundaries of said thin film.

2. The process of claim 1, wherein said thin film comprises in the range of from 0.25 to 4.0 percent copper in aluminum by weight.

3. The process of claim 2, wherein said thin film comprises about 2 percent copper in aluminum by weight.

4. The process of claim 2, wherein said thin film further comprises about 1 percent silicon by weight.

5. The process of claim 1, wherein said second temperature is less than the solvus temperature of said film.

6. The process of claim 1, wherein said heat treatment steps are performed in a reducing atmosphere of forming gas having a composition of about 15 percent hydrogen in nitrogen by volume.

7. The process of claim 1, wherein said second temperature is in the range of from 200°

C. to 300°

C.

8. The process of claim 7, wherein said second temperature is about 300°

C.

9. The process of claim 1, wherein said second time period is in the range of from 10 minutes to 24 hours.

10. The process of claim 9, wherein said second time period is about 24 hours.

11. The process of claim 8, wherein said second time period is about 1 hour.

16. The process of claim 1, wherein said first temperature is higher than the solvus temperature of said film.

17. The process of claim 1, further including cooling said thin film to a third temperature after said first heat treatment, wherein said third temperature is lower than said second temperature.

18. The process of claim 1, further including the step of cooling said thin film to a third temperature after said second heat treatment, wherein said third temperature is lower than said second temperature.

12. In a process for forming conductive films on a substrate in the manufacture of integrated circuit computer chips wherein an aluminum-copper alloy film is deposited on said substrate, the improvement comprising:

heating said thin film to a sufficient temperature and for a sufficient length of time for forming a substantially continuous, coherent copper precipitate along the grain boundaries of the deposited film; and

cooling said thin film to a lower temperature.

13. The improvement of claim 12, wherein said sufficient length of time is between 10 minutes and 24 hours.

14. The improvement of claim 13, wherein said sufficient length of time is about 1 hour and said temperature is about 300°

C.

15. A process for producing thin layer conductive films having reduced electromigration failures comprising:

sputter depositing an aluminum-copper alloy thin film having about 2 percent copper in aluminum by weight on a substrate at about room temperature;

performing a first heat treatment of said thin film, said treatment comprising;

heating said thin film to a first temperature above the solvus temperature of said film;

maintaining said thin film at said first temperature for a first time period; and

cooling said thin film to about room temperature; and

performing a second heat treatment of said thin film, said treatment comprising;

heating said thin film to a second temperature less than the solvus temperature of said film;

maintaining said thin film at said second temperature for a time period sufficient for copper enrichment to occur at aluminum grain boundaries; and

cooling said thin film to about room temperature.