Light emitting diode bars and arrays and method of making same

• US 5,300,788 A
• Filed: 01/18/1991
• Issued: 04/05/1994
• Est. Priority Date: 01/18/1991
• Status: Expired due to Term

• Current Assignee: Kopin Corporation
• Original Assignee: Kopin Corporation
• Inventors: Spitzer, Mark B., Fan, John C. C., Dingle, Brenda, McClelland, Robert W., Shastry, Shambhu
• Primary Examiner(s): Hille, Rolf
• Assistant Examiner(s): POTTER, ROY KARL
• Application Number:
  US07/643,552
• Time in Patent Office: 1,173 Days
• Field of Search: 357/17, 357/45, 357/16, 437/81, 257/13, 257/81, 257/88, 257/99, 257/522
• US Class Current: 257/13
• CPC Class Codes: G02B 2027/0132 comprising binocular systems
• CPC Class Codes: G02B 2027/0138 comprising image capture systems, e.g. camera
• CPC Class Codes: G02B 2027/0187 slaved to motion of at least a part of the body of the user, e.g. head, eye
• CPC Class Codes: G02B 2027/0198 System for aligning or maintaining alignment of an image in a predetermined direction
• CPC Class Codes: G02B 27/0093 with means for monitoring data relating to the user, e.g. head-tracking, eye-tracking
• CPC Class Codes: G02B 27/017 Head mounted
• CPC Class Codes: G02B 27/0172 characterised by optical features
• CPC Class Codes: G02B 5/30 Polarising elements light-modulating devices with active elements G02F1/00
• CPC Class Codes: G02F 1/13336 Combining plural substrates to produce large-area displays, e.g. tiled displays
• CPC Class Codes: G02F 1/13454 Drivers integrated on the active matrix substrate G02F1/136277 takes precedence
• CPC Class Codes: G02F 2202/105 single crystal Si
• CPC Class Codes: G09G 2300/023 Display panel composed of stacked panels
• CPC Class Codes: G09G 2370/042 for monitor identification
• CPC Class Codes: G09G 3/32 semiconductive, e.g. using light-emitting diodes [LED]
• CPC Class Codes: G09G 3/36 using liquid crystals
• CPC Class Codes: G09G 3/3607 for displaying colours or for displaying grey scales with a specific pixel layout, e.g. using sub-pixels display of colours in flat matrix panels other than liquid crystal displays G09G3/2003; grey scales specific for television H04N3/127
• CPC Class Codes: G09G 3/3648 using an active matrix G09G3/367 - G09G3/3696 take precedence
• CPC Class Codes: H01L 21/8221 Three dimensional integrated circuits stacked in different levels
• CPC Class Codes: H01L 21/84 the substrate being other than a semiconductor body, e.g. being an insulating body
• CPC Class Codes: H01L 2221/68359 used as a support during manufacture of interconnect decals or build up layers
• CPC Class Codes: H01L 2221/68363 : used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
• CPC Class Codes: H01L 24/96 : the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/0756 : Stacked arrangements of devices
• CPC Class Codes: H01L 25/50 : Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 27/0688 : Integrated circuits having a three-dimensional layout
• CPC Class Codes: H01L 27/1214 : comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
• CPC Class Codes: H01L 27/1266 : the substrate on which the devices are formed not being the final device substrate, e.g. using a temporary substrate
• CPC Class Codes: H01L 27/156 : two-dimensional arrays
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01012 : Magnesium [Mg]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/0103 : Zinc [Zn]
• CPC Class Codes: H01L 2924/01032 : Germanium [Ge]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01049 : Indium [In]
• CPC Class Codes: H01L 2924/01051 : Antimony [Sb]
• CPC Class Codes: H01L 2924/01072 : Hafnium [Hf]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01077 : Iridium [Ir]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/10329 : Gallium arsenide [GaAs]
• CPC Class Codes: H01L 2924/10336 : Aluminium gallium arsenide [AlGaAs]
• CPC Class Codes: H01L 2924/10349 : Aluminium gallium indium phosphide [AlGaInP]
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/351 : Thermal stress
• CPC Class Codes: H01L 33/0062 : for devices with an active region comprising only III-V compounds
• CPC Class Codes: H01L 33/10 : with a light reflecting structure, e.g. semiconductor Bragg reflector
• CPC Class Codes: H01L 33/405 : Reflective materials
• CPC Class Codes: H01L 33/465 : with a resonant cavity structure
• CPC Class Codes: H01S 5/0217 : Removal of the substrate
• CPC Class Codes: H01S 5/423 : having a vertical cavity
• CPC Class Codes: H04N 5/7441 : the modulator being an array of liquid crystal cells
• CPC Class Codes: H04N 5/7491 : of head mounted projectors
• CPC Class Codes: H04N 9/3141 : Constructional details thereof details not peculiar to the presence of an electronic spatial light modulator G03B21/14
• CPC Class Codes: H05B 33/12 : Light sources with substantially two-dimensional radiating surfaces
• CPC Class Codes: Y10S 438/928 : Front and rear surface processing
• CPC Class Codes: Y10S 438/977 : Thinning or removal of substrate

Abstract

Light emitting diodes (LEDs) and LED bars and LED arrays formed of semiconductive material, such as III-V, and particularly AlGaAs/GaAs material, are formed in very thin structures using organometallic vapor deposition (OMCVD). Semiconductor p-n junctions are formed as deposited using carbon as the p-type impurity dopant. Various lift-off methods are described which permit back side processing when the growth substrate is removed and also enable device registration for LED bars and arrays to be maintained.

Claims

1. An LED bar comprising a row of light emitting pixel regions formed in an epitaxial thin film semiconductor structure comprising a front side cladding layer on an active p-n junction layer, on a back side cladding layer with pixel regions formed in said structure separated from adjacent pixel regions by high lateral resistivity with a thin contact film on the front side of the structure, and wherein only said contact film is removed between pixel regions, said contact film being formed on said front side cladding layer, said cladding layer having a thickness less than bout 0.5 microns thereby enhancing said high lateral resistivity between adjacent pixel regions, with metal pixel contacts formed on the back side cladding layer and remaining front side pixel contact film.

2. The LED bar of claim 1 wherein the semiconductor is a III-V material and the thickness of the LED bar is less than about 5 microns.

3. The LED bar of claim 2 wherein the width of the LED bar is in the order of 50 to 100 microns.

4. The LED bar of claim 1 wherein the semiconductor is a III-V material and the thickness of the LED bars is about 3 microns.

5. The LED bar of claim 1 wherein the contact film is GaAs of less than about 0.1 microns thickness and the cladding layers are AlGaAs of less than about 2 microns thickness and the active layer is GaAs with carbon doping to form a p-n junction as deposited and the active layer thickness is less than about 1 micron.

6. The LED bar of claim 1 wherein the front side of said structure is supported on a light transparent support member for back side processing.

7. The LED bar of claim 6 further comprising mounting said LED bar with a support structure onto a silicon substrate and interconnecting silicon drive circuits with said metal contacts.

8. The LED bar of claim 1 wherein the width to thickness ratio of the LED bar is higher than about 10 to 1.

9. An LED array comprised of rows and columns of light emitting pixel regions formed in an epitaxial thin film semiconductor structure with pixel regions separated from adjacent pixel regions by high lateral resistivity with a thin contact film overlying said pixel regions on a front side cladding layer over a p-n junction active layer over a back side cladding layer with metal pixel contacts formed on said front side contact film and metal pixel contacts to regions of said back side cladding layer co-extensive with said pixel regions and orthogonally disposed bus bars extending across front side rows of pixel contacts and back side columns of pixel contacts and wherein said pixel regions are defined by removing only portions of said contact film between pixel regions.

10. The LED array of claim 9 wherein the LED array is supported on a light transparent member.

11. The LED bar of claim 9 including a light transparent support member for said LED array, said support member being mounted on a silicon substrate;

and silicon driver circuits formed on said substrate for selectively addressing individual pixel regions to cause such addressed pixel regions to propagate light out the front side of the LED array.

12. The LED array of claim 9 wherein the thickness of the contact film is less than about 1000 Å

, and the semiconductor is formed of III-V material.

13. The LED array of claim 9 wherein the contact film and active layer are formed of GaAs and the p-n junction is formed of GaAs doped with carbon.

14. The LED array of claim 13 wherein the thickness of the array is in the range of 5 microns, or less.

15. The LED array of claim 13 wherein the thickness of the array is about 3 microns.

16. The LED array of claim 9 including a back side reflector surface extending across said pixel region.

17. The array of claim 9 wherein the thickness of the active layer is an integral multiple of one-half the wavelength of the propagated light.

18. The array of claim 9 wherein front and back Bragg reflector layers are formed on opposite sides of the active layer to define a laser cavity whereby light propagated from the LED array is coherent.

19. Apparatus for converting a first light image of wavelength λ

1 to a second light of wavelength λ

2 comprising;

a) an array of rows and columns of individual light detectors for detecting said first light image and converting said image to electrical signals corresponding to the instantaneous light intensity of said first image as detected by said light detectors;

b) an LED array comprised of rows and columns of pixel regions for emitting light of λ

2 wavelength formed in an epitaxial thin film semiconductor structure with pixel regions separated from adjacent pixel regions and front and back contacts formed on said pixel regions with front side bus bars extending along rows of front pixel contacts and back side bus bars extending along columns of back pixel contacts;

c) multiplexer means for coupling the electrical signals to said contacts to cause said LED array to generate a second light image at λ

2 wavelength corresponding to said first image.

20. The apparatus of claim 19 wherein λ

1 is in the range of ultraviolet light and λ

2 is visible light.

21. The apparatus of claim 19 wherein λ

1 is in the range of infra-red light.

22. The apparatus of claim 19 wherein the pixels in the LED array are energized by a drive circuit and the intensity of the image generated by the LED array is controlled by modulating the drive current.

23. The apparatus of claim 19 in which the light detectors are charge coupled devices.

24. The apparatus of claim 19 in which the light detectors are p-i-n diodes.

25. The apparatus of claim 19 in which the array of light detectors and the LED array are bonded together by a transparent adhesive to form a hybrid structure.

26. The apparatus of claim 25 wherein the hybrid structure is joined to a substrate containing said multiplexer means.

27. The apparatus of claim 19 wherein the LED array is mounted on glasses for image enhancement of visible light.

28. The apparatus of claim 19 wherein the LED array is mounted on glasses for display of data superimposed on video images.

29. A hybrid LED bar bonded to an L-shaped silicon section of a structure comprising silicon circuits on a silicon wafer connected to pixels in an LED bar by a cantilevered first contact bar extending over a second contact bar located on a surface of said wafer.

30. The structure of claim 29 wherein the contact bars are trimmed to provide appropriate connections between pixels on the LED Bar and circuits on the silicon wafer.

31. An LED comprising a light emitting pixel region formed in an epitaxial thin film semiconductor structure having a thin front contact on the front side of the structure, said front contact being formed on a front side epitaxial cladding layer formed on an active doped p-n junction layer, on a back side cladding layer with a back contact coupled to the back side cladding layer and a contact pad formed laterally adjacent said pixel region and coupled to said thin front contact.

32. The LED of claim 31 wherein the active layer is a carbon doped III-V material.

33. The LED of claim 32 wherein the semiconductor is a III-V material and the thickness of the LED is about 3 microns.

34. The LED of claim 33 wherein the front contact is GaAs of less than about 0.1 microns in thickness and the cladding layers are AlGaAs of less than about 2 microns thickness and the active layer is GaAs and the active layer thickness is less than about 1 micron.

35. An LED comprising a light emitting pixel region formed in an epitaxial thin film semiconductor structure having a thin front contact formed of a contact film on the front side of the structure and formed on a front side cladding layer on an active carbon doped p-n junction layer, formed on a back side cladding layer with a back contact coupled to the back side cladding layer and wherein only portions of the contact film surrounding the contact are removed to define said pixel region.

36. The LED of claim 35 wherein a bonding pad is formed on said structure adjacent said pixel region and coupled to one of said contacts by a wire.

37. The LED of claim 36 wherein the semiconductor is a III-V material and the thickness of the LED is about 3 microns.

38. The LED of claim 37 wherein the contact is GaAs of about 0.1 microns, or less, thickness and the cladding layers are AlGaAs of about 2 microns, or less, thickness and the active layer is GaAs and the active layer thickness is about 1 microns, or less.

39. The LED of claim 35 wherein the cladding layers and the active layer are formed of AlGaAs.

40. An LED bar comprising a row of light emitting pixel regions formed in an epitaxial thin film semiconductor structure with pixel regions separated from adjacent pixel regions by high lateral resistivity with a thin contact film on the front side of the structure, which contact film is removed between pixel regions, said contact film being deposited on a front side epitaxial cladding layer having a thickness less than about 0.5 microns thereby enhancing said high lateral resistivity between adjacent pixel regions, said front side cladding layer being formed on an active p-n junction layer, on a back side cladding layer with metal pixel contacts formed on the back side cladding layer and remaining front side contact film and wherein said LED bar is supported on the front side by a light transparent support and is mounted with the support onto a silicon substrate and interconnected with silicon drive circuits to said metal pixel contacts.

41. An LED comprising a light emitting pixel region formed in an epitaxial thin film semiconductor structure of less than about 3 microns thickness having a thin front contact film on the front side of the structure, said contact film being formed on a front side AlGaAs cladding layer formed on an carbon doped p-n junction AlGaAs active layer, on a back side AlGaAs cladding layer with a back contact coupled to the back side cladding layer and a contact pad formed laterally adjacent said pixel region and coupled to said thin front contact film.