Method for producing semiconductor device

• US 5,302,554 A
• Filed: 08/11/1992
• Issued: 04/12/1994
• Est. Priority Date: 02/06/1992
• Status: Expired due to Fees

• Current Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Original Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Inventors: Kashiwa, Takuo, Notani, Yoshihiro, Ishikawa, Takahide
• Primary Examiner(s): Hearn, Brian E.
• Assistant Examiner(s): NGUYEN, TUAN H
• Application Number:
  US07/928,026
• Time in Patent Office: 609 Days
• Field of Search: 437/226, 437/227, 437/225, 437/974, 148/DIG. 28, 148/DIG. 135
• US Class Current: 438/17
• CPC Class Codes: H01L 21/304 Mechanical treatment, e.g. grinding, polishing, cutting H01L21/30625 takes precedence
• CPC Class Codes: H01L 21/3043 Making grooves, e.g. cutting
• CPC Class Codes: Y10S 148/028 Dicing

Abstract

According to a method for producing semiconductor chips, grooves serving as dicing lines are formed in a front surface of a semiconductor wafer, the semiconductor wafer is ground from the rear surface to a prescribed thickness, leaving portions of the wafer opposite the grooves, a feeding layer is formed on the ground rear surface of the wafer, a metal layer for heat radiation is formed on the feeding layer, a dicing tape is applied to the metal layer, and the wafer and the feeding layer are diced along the dicing lines, resulting in a plurality of semiconductor chips. Therefore, the strength of the wafer is increased because portions of the wafer remain at the dicing lines, preventing curvature of the wafer. When a plurality of metal layers for heat radiation are selectively formed on the feeding layer except for regions opposite the dicing lines, since only thin portions of the wafer and the feeding layer are present at the dicing lines, burrs produced during dicing are reduced and an adequate junction is achieved in a subsequent die-bonding process.

Claims

1. A method for producing semiconductor chips comprising:

forming grooves serving as dicing lines in a front surface of a semiconductor wafer;

depositing one of WSi and SiO₂ as a reinforcing layer in the grooves;

grinding said semiconductor wafer from the rear surface to a prescribed thickness, leaving portions of the wafer in place opposite the dicing lines;

forming a metallic feeding layer on the ground rear surface of the wafer;

forming a metal layer for heat radiation on said feeding layer;

applying a dicing tape to said metal layer; and

cutting through said wafer and said feeding layer along said dicing lines with a dicing blade to produce a plurality of semiconductor chips.

2. The method of claim 1 including forming said metal layer for heat radiation selectively on said feeding layer and not opposite the dicing lines.

3. The method of claim 1 including forming said metal layer for heat radiation over all of the feeding layer.

4. The method of claim 1 including measuring electrical characteristics of a circuit on the front surface of said wafer after forming said metal layer.

5. The method of claim 1 including forming the grooves by chemical etching.

6. The method of claim 5 wherein each groove has a reverse-trapezoid cross section.