Discrete die burn-in for non-packaged die
First Claim
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1. Discrete testing apparatus for testing a semiconductor device in die form, comprising:
- a) a first plate;
b) a die-receiving cavity in the first plate;
c) a second plate;
d) means to secure the first and second plates together;
e) an insulative substrate, separate from the first and second plates having a plurality of circuit traces thereon and dimensioned so as to fit within said die receiving cavity being received by the die receiving cavity prior to insertion of the die in a position juxtaposed to a face side of the die when the die is in the die receiving cavity, so that the insulative substrate is at least partially contained within the die receiving cavity when the first and second plates are secured together, and means to retain the insulative substrate is received in the die receiving cavity prior to placement of the die into the die receiving cavity;
f) a plurality of contacts on the plurality of circuit traces, the contacts being positioned so that, when the first plate and the second plate are aligned and the die and the insulative substrate are positioned in the die-receiving cavity, the contacts are in alignment with contact locations on the die;
g) connector terminals in an electrical communication with the plurality of contacts; and
h) means to bias the die and the insulative substrate together when the first plate and the second plate are secured together, thereby causing the contacts to be maintained in electrical communication with said contact locations;
i) the means to secure including a clamp, the clamp extending across at least one of the first and second plates to secure the first and second plates together, whereinwhen the first and second plates are secured together with the die in the die receiving cavity, a plurality of said contact locations are in electrical communication with the connector terminals.
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Abstract
A reusable burn-in/test fixture for discrete die consists of two halves. The first half of the test fixture contains cavity in which die is inserted. When the two halves are assembled, the fixture establishes electrical contact with the die and with a burn-in oven. The test fixture need not be opened until the burn-in and electrical test are completed. The fixture permits the die to be characterized prior to assembly.
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Citations
43 Claims
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1. Discrete testing apparatus for testing a semiconductor device in die form, comprising:
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a) a first plate; b) a die-receiving cavity in the first plate; c) a second plate; d) means to secure the first and second plates together; e) an insulative substrate, separate from the first and second plates having a plurality of circuit traces thereon and dimensioned so as to fit within said die receiving cavity being received by the die receiving cavity prior to insertion of the die in a position juxtaposed to a face side of the die when the die is in the die receiving cavity, so that the insulative substrate is at least partially contained within the die receiving cavity when the first and second plates are secured together, and means to retain the insulative substrate is received in the die receiving cavity prior to placement of the die into the die receiving cavity; f) a plurality of contacts on the plurality of circuit traces, the contacts being positioned so that, when the first plate and the second plate are aligned and the die and the insulative substrate are positioned in the die-receiving cavity, the contacts are in alignment with contact locations on the die; g) connector terminals in an electrical communication with the plurality of contacts; and h) means to bias the die and the insulative substrate together when the first plate and the second plate are secured together, thereby causing the contacts to be maintained in electrical communication with said contact locations; i) the means to secure including a clamp, the clamp extending across at least one of the first and second plates to secure the first and second plates together, wherein when the first and second plates are secured together with the die in the die receiving cavity, a plurality of said contact locations are in electrical communication with the connector terminals. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. Discrete testing apparatus for testing a semiconductor device in die form, comprising:
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a) a first plate; b) a die-receiving cavity in the first plate; c) a second plate; d) means to secure the first and second plates together; e) an insulative substrate, separate from the first and second plates having a plurality of circuit traces thereon and dimensioned so as to fit within said die receiving cavity in a position juxtaposed to a face side of the die when the die is in the die receiving cavity, so that the insulative substrate is at least partially contained within the die receiving cavity when the first and second plates are secured together; f) a plurality of contacts on the plurality of circuit traces, the contacts being positioned so that, when the first plate and the second plate are in alignment, and the die is positioned in the die-receiving cavity, the contacts are in alignment with contact locations on the die; g) connector terminals in electrical communication with the contacts; and h) means to bias the die and the insulative substrate together when the first plate and the second plate are secured together, thereby causing the contacts to be maintained in electrical communication with said contact locations; i) the means to secure including a clamp, the clamp extending across at least one of the first and second plates to secure the first and second plates together, wherein when the first and second plates are secured together with the die in the die receiving cavity, a plurality of said contact locations are in electrical communication with the connector terminals. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
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26. Discrete testing apparatus for testing a semiconductor device in die form, comprising:
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a) a first plate; b) a die-receiving cavity in the first plate; c) a second plate; d) means to secure the first and second plates together; e) an insulative substrate, separate from the first and second plates with a plurality of circuit traces thereon, the plurality of circuit traces being dimensioned so as to fit within said die receiving cavity adjacent to the die when the die is in the die receiving cavity, so that the insulative substrate is at least partially contained within the die receiving cavity when the first and second plates are secured together; f) a plurality of contacts on the plurality of circuit traces, the contacts being positioned so that, when the first plate and the second plate are in alignment, and the die is positioned in the die-receiving cavity, the contacts are in alignment with contact locations on the die; g) connector terminals in electrical communication with the contacts; and h) means to bias the die and the insulative substrate together when the first plate and the second plate are secured together, thereby causing the contacts to be maintained in electrical communication with said contact locations, contact between the contact locations on the die for said electrical communication with the connector terminals being established without bonding the contacts with the die at the contact locations; i) the second plate including a rigid cover plate and a resilient compressible elastomeric strip, said elastomeric strip biasing the insulative substrate against the die, thereby establishing an ohmic contact between the die contact locations and conductive traces on the insulative substrate; j) the means to secure including a clamp, the clamp extending across at least one of the first and second plates to secure the first and second plates together, wherein when the first and second plates are secured together with the die in the die receiving cavity, a plurality of said contact locations are in electrical communication with the connector terminals. - View Dependent Claims (27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43)
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Specification