Discrete die burn-in for non-packaged die

• US 5,302,891 A
• Filed: 11/10/1992
• Issued: 04/12/1994
• Est. Priority Date: 06/04/1991
• Status: Expired due to Term

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Kinsman, Larry D., Wood, Alan G., Huang, Chender, Chadwick, Gary L., Corbett, Tim J.
• Primary Examiner(s): Karlsen, Ernest F.
• Application Number:
  US07/973,931
• Time in Patent Office: 518 Days
• Field of Search: 324/158 F, 324/158 P, 324/72.5, 324/73.1
• US Class Current: 324/750.05
• CPC Class Codes: G01R 1/0466 concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
• CPC Class Codes: G01R 1/0483 Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips for IC's with connecting points around the edges only G01R1/0433
• CPC Class Codes: G01R 3/00 Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments , e.g. of probe tips
• CPC Class Codes: G01R 31/2863 Contacting devices, e.g. sockets, burn-in boards or mounting fixtures in general G01R1/04
• CPC Class Codes: G01R 31/2893 Handling, conveying or loading, e.g. belts, boats, vacuum fingers G01R31/2867 takes precedence; handling semiconductor devices or wafers during manufacture or treatment H01L21/67
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2225/06562 at least one device in the stack being rotated or offset
• CPC Class Codes: H01L 23/13 characterised by the shape
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H01L 24/80 Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 Silicon [Si]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01075 Rhenium [Re]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15151 : the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
• CPC Class Codes: H01L 2924/15174 : in different layers of the multilayer substrate
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H05K 2201/0133 : Elastomeric or compliant polymer elastomeric conductor H05K2201/0314
• CPC Class Codes: H05K 2201/0347 : Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias reinforcing the conductive pattern H05K3/24
• CPC Class Codes: H05K 2201/0367 : Metallic bump or raised conductor not used as solder bump solder materials or compositions and methods of application thereof H05K3/3457
• CPC Class Codes: H05K 2201/0394 : Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
• CPC Class Codes: H05K 2201/09481 : Via in pad; Pad over filled via if used for surface mounting H05K1/113
• CPC Class Codes: H05K 2201/09563 : Metal filled via plated through-hole filled with insulating material H05K2201/0959
• CPC Class Codes: H05K 2203/0307 : Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
• CPC Class Codes: H05K 2203/0723 : Electroplating, e.g. finish plating
• CPC Class Codes: H05K 3/0058 : Laminating printed circuit boards onto other substrates, e.g. metallic substrates H05K1/0281 takes precedence
• CPC Class Codes: H05K 3/0067 : onto an inorganic, non-metallic substrate
• CPC Class Codes: H05K 3/4007 : Surface contacts, e.g. bumps H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3457
• CPC Class Codes: H05K 3/423 : characterised by electroplating method

Abstract

A reusable burn-in/test fixture for discrete die consists of two halves. The first half of the test fixture contains cavity in which die is inserted. When the two halves are assembled, the fixture establishes electrical contact with the die and with a burn-in oven. The test fixture need not be opened until the burn-in and electrical test are completed. The fixture permits the die to be characterized prior to assembly.

Claims

1. Discrete testing apparatus for testing a semiconductor device in die form, comprising:

a) a first plate;

b) a die-receiving cavity in the first plate;

c) a second plate;

d) means to secure the first and second plates together;

e) an insulative substrate, separate from the first and second plates having a plurality of circuit traces thereon and dimensioned so as to fit within said die receiving cavity being received by the die receiving cavity prior to insertion of the die in a position juxtaposed to a face side of the die when the die is in the die receiving cavity, so that the insulative substrate is at least partially contained within the die receiving cavity when the first and second plates are secured together, and means to retain the insulative substrate is received in the die receiving cavity prior to placement of the die into the die receiving cavity;

f) a plurality of contacts on the plurality of circuit traces, the contacts being positioned so that, when the first plate and the second plate are aligned and the die and the insulative substrate are positioned in the die-receiving cavity, the contacts are in alignment with contact locations on the die;

g) connector terminals in an electrical communication with the plurality of contacts; and

h) means to bias the die and the insulative substrate together when the first plate and the second plate are secured together, thereby causing the contacts to be maintained in electrical communication with said contact locations;

i) the means to secure including a clamp, the clamp extending across at least one of the first and second plates to secure the first and second plates together, wherein

when the first and second plates are secured together with the die in the die receiving cavity, a plurality of said contact locations are in electrical communication with the connector terminals.

2. Discrete testing apparatus as described in claim 1, further comprising:

the connector terminals being positioned on the second plate so that, when the first plate and the second plate are aligned by the alignment means and the die and the insulative substrate are positioned in the die-receiving cavity, the plurality of contacts are in alignment with contact locations on the die.

3. Discrete testing apparatus as described in claim 2, further comprising:

said clamp consisting of a clasp which may either be latched into place.

4. Discrete testing apparatus as described in claim 1, further comprising:

the die receiving cavity having a biased platform therein, the biased platform exerting a biasing force against the die, the biasing force being sufficiently uniform to cause the die to establish contact with the plurality of contacts.

5. Discrete testing apparatus as described in claim 1, further comprising:

means to bias die received in the die receiving cavity with the plurality of contacts after the first and second plates have been mated.

6. Discrete testing apparatus as described in claim 5, further comprising:

the external connector leads being secured by the die cavity plate and terminating on the die cavity plate as contact pads, the contact pads being in approximate planar alignment with the contact location on the die.

7. Discrete testing apparatus as described in claim 1, further comprising:

the plurality of contacts including contact pads which are in alignment with the die receiving cavity after the first and second plates have been mated.

8. Discrete testing apparatus as described in claim 1, further comprising:

the plurality of contacts including a contact pads which are in alignment with the die receiving cavity after the first and second plates have been mated.

9. Discrete testing apparatus as described in claim 1, further comprising:

said clamp consisting of a clasp which is latched into place.

10. Discrete testing apparatus for testing a semiconductor device in die form, comprising:

a) a first plate;

b) a die-receiving cavity in the first plate;

c) a second plate;

d) means to secure the first and second plates together;

e) an insulative substrate, separate from the first and second plates having a plurality of circuit traces thereon and dimensioned so as to fit within said die receiving cavity in a position juxtaposed to a face side of the die when the die is in the die receiving cavity, so that the insulative substrate is at least partially contained within the die receiving cavity when the first and second plates are secured together;

f) a plurality of contacts on the plurality of circuit traces, the contacts being positioned so that, when the first plate and the second plate are in alignment, and the die is positioned in the die-receiving cavity, the contacts are in alignment with contact locations on the die;

g) connector terminals in electrical communication with the contacts; and

h) means to bias the die and the insulative substrate together when the first plate and the second plate are secured together, thereby causing the contacts to be maintained in electrical communication with said contact locations;

i) the means to secure including a clamp, the clamp extending across at least one of the first and second plates to secure the first and second plates together, wherein

when the first and second plates are secured together with the die in the die receiving cavity, a plurality of said contact locations are in electrical communication with the connector terminals.

11. Discrete testing apparatus as described in claim 10, further comprising:

said plurality of contacts on the plurality of conductors being mounted to an insulative substrate, the insulative substrate being supported by the first and second plates when the first and second plates are secured together.

12. Discrete testing apparatus as described in claim 10, further comprising:

a spacer plate which fits within the die receiving cavity and the die, and which precisely positions the die for subsequent alignment.

13. Discrete testing apparatus as described in claim 12, further comprising:

a slot in the die cavity plate, for facilitating lifting the die out of the die receiving cavity.

14. Discrete testing apparatus as described in claim 10, further comprising:

the connector terminals in electrical communication with the plurality of contacts comprising a plurality of external connector leads attached to the die cavity plate, and extending from the burn in fixture.

15. Discrete testing apparatus as described in claim 14, further comprising:

said connector terminals extending from the burn in fixture in standard semiconductor package configuration.

16. Discrete testing apparatus as described in claim 10, further comprising:

contact between the contact locations on the die for said electrical communication with the contact terminals being established by TAB (tape automated bonding) tape which is not bonded with the die at the contact locations.

17. Discrete testing apparatus as described in claim 10, further comprising:

the plurality of contacts being conductive polymer contacts.

18. Discrete testing apparatus as described in claim 10, further comprising:

the plurality of contacts being positioned on the insulative substrate so that, when the die and the insulative substrate are positioned in the die receiving cavity, the plurality of contacts are between the die and the second plate.

19. Discrete testing apparatus as described in claim 18, further comprising:

the plurality of contacts being located in the die cavity housing.

20. Discrete testing apparatus as described in claim 10, further comprising:

the plurality of contacts being conductive soft metal contacts.

21. Discrete testing apparatus as described in claim 18, further comprising:

a) the plurality of contacts being positioned on the insulative substrate so that, when the die and the insulative substrate are positioned in the die receiving cavity, the plurality of contacts are between the die and the second plate;

b) one of said first and second plates being a cover plate, the cover plate supporting said plurality of contacts;

c) the first plate including a resilient compressible elastomeric strip, the rigid elastomeric strip biasing the plurality of contacts against the die, thereby establishing an ohmic contact between the die contact locations and the plurality of contacts.

22. Discrete testing apparatus as described in claim 10, further comprising:

a) the cover plate including a dielectric cover; and

b) the plurality of contacts being contact pins which are mounted to the dielectric cover.

23. Discrete testing apparatus as described in claim 10, further comprising:

a) contact between the contact locations on the die for said electrical communication with the contact terminals being established by TAB (tape automated bonding) tape which is not bonded with the die at the contact locations; and

b) the TAB tape extending beyond the confines of a fixture formed by the first and second plates and terminating in an external connector, the external connector including said connector terminals.

24. Discrete testing apparatus as described in claim 10, further comprising:

the plurality of contacts including a flexible rods which extend into the die receiving cavity after the first and second plates have been mated.

25. Discrete testing apparatus as described in claim 10, further comprising:

said clamp consisting of a clasp which is latched into place.

26. Discrete testing apparatus for testing a semiconductor device in die form, comprising:

a) a first plate;

b) a die-receiving cavity in the first plate;

c) a second plate;

d) means to secure the first and second plates together;

e) an insulative substrate, separate from the first and second plates with a plurality of circuit traces thereon, the plurality of circuit traces being dimensioned so as to fit within said die receiving cavity adjacent to the die when the die is in the die receiving cavity, so that the insulative substrate is at least partially contained within the die receiving cavity when the first and second plates are secured together;

f) a plurality of contacts on the plurality of circuit traces, the contacts being positioned so that, when the first plate and the second plate are in alignment, and the die is positioned in the die-receiving cavity, the contacts are in alignment with contact locations on the die;

g) connector terminals in electrical communication with the contacts; and

h) means to bias the die and the insulative substrate together when the first plate and the second plate are secured together, thereby causing the contacts to be maintained in electrical communication with said contact locations, contact between the contact locations on the die for said electrical communication with the connector terminals being established without bonding the contacts with the die at the contact locations;

i) the second plate including a rigid cover plate and a resilient compressible elastomeric strip, said elastomeric strip biasing the insulative substrate against the die, thereby establishing an ohmic contact between the die contact locations and conductive traces on the insulative substrate;

j) the means to secure including a clamp, the clamp extending across at least one of the first and second plates to secure the first and second plates together, wherein

when the first and second plates are secured together with the die in the die receiving cavity, a plurality of said contact locations are in electrical communication with the connector terminals.

27. Discrete testing apparatus as described in claim 26, further comprising:

the connector terminals being positioned on the second plate so that, when the first plate and the second plate are aligned by the alignment means and the die and the insulative substrate are positioned in the die-receiving cavity, the plurality of contacts are in alignment with contact locations on the die.

28. Discrete testing apparatus as described in claim 26, further comprising:

the biasing force exerted by the biased platform being sufficiently uniform to cause the die to establish contact with the plurality of contacts.

29. Discrete testing apparatus as described in claim 26, further comprising:

the plurality of contacts including contact pads which are in alignment with the die receiving cavity after the first and second plates have been mated.

30. Discrete testing apparatus as described in claim 26, further comprising:

a spacer plate which fits within the die receiving cavity and the die, and which precisely positions the die for subsequent alignment.

31. Discrete testing apparatus as described in claim 30, further comprising:

a slot in the die cavity plate, for facilitating lifting the die out of the die receiving cavity.

32. Discrete testing apparatus as described in claim 26, further comprising:

the connector terminals in electrical communication with the plurality of contacts comprising a plurality of external connector leads attached to the die cavity plate, and extending from the burn in fixture.

33. Discrete testing apparatus as described in claim 32, further comprising:

said connector terminals extending from the burn in fixture in a standard semiconductor package configuration.

34. Discrete testing apparatus as described in claim 26, further comprising:

contact between the contact locations on the die for said electrical communication with the contact terminals being established by TAB (tape automated bonding) tape which is not bonded with the die at the contact locations.

35. Discrete testing apparatus as described in claim 34, further comprising:

the second plate including a rigid cover plate and a resilient compressible elastomeric strip, the rigid elastomeric strip biasing the TAB tape against the die, thereby establishing an ohmic contact between the die contact locations and conductive traces on the TAB tape.

36. Discrete testing apparatus as described in claim 26, further comprising:

the plurality of contacts being conductive polymer contacts.

37. Discrete testing apparatus as described in claim 26, further comprising:

the plurality of contacts being positioned on the insulative substrate so that, when the die and the insulative substrate are positioned in the die receiving cavity, the plurality of contacts are between the die and the second plate.

38. Discrete testing apparatus as described in claim 37, further comprising:

the plurality of contacts being located in the die cavity housing.

39. Discrete testing apparatus as described in claim 26, further comprising:

the plurality of contacts being conductive soft metal contacts.

40. Discrete testing apparatus as described in claim 39, further comprising:

the plurality of contacts being positioned on the insulative substrate so that, when the die and the insulative substrate are positioned in the die receiving cavity, the plurality of contacts are between the die and the second plate;

b) the cover plate supports said plurality of contacts; and

c) the first plate including a resilient compressible elastomeric strip, the rigid elastomeric strip biasing the plurality of contacts against the die, thereby establishing an ohmic contact between the die contact locations and the plurality of contacts.

41. Discrete testing apparatus as described in claim 26, further comprising:

a) the cover plate including a dielectric cover; and

b) the plurality of contacts being contact pins which are mounted to the dielectric cover.

42. Discrete testing apparatus as described in claim 26, further comprising:

a) contact between the contact locations on the die for said electrical communication with the contact terminals being established by TAB (tape automated bonding) tape which is not bonded with the die at the contact locations; and

b) the TAB tape extending beyond the confines of a fixture formed by the first and second plates and terminating in an external connector, the external connector including said connector terminals.

43. Discrete testing apparatus as described in claim 26, further comprising:

said clamp consisting of a clasp which is latched into place.