Method for manufacturing an encapsulated semiconductor package using an adhesive barrier frame

• US 5,304,513 A
• Filed: 05/13/1993
• Issued: 04/19/1994
• Est. Priority Date: 07/16/1987
• Status: Expired due to Fees

• Current Assignee: GAO Gesellschaft Fur Automation und Organisation mbH
• Original Assignee: GAO Gesellschaft Fur Automation und Organisation mbH
• Inventors: Haghiri-Tehrani, Yahya, Barak, Renee-Lucia
• Primary Examiner(s): Chaudhuri, Olik
• Assistant Examiner(s): Graybill, David E.
• Application Number:
  US08/060,704
• Time in Patent Office: 341 Days
• Field of Search: 257/679, 257/787
• US Class Current: 156/245
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: G06K 19/07747 at least one of the integrated circuit chips being mounted as a module
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48228 the bond pad being disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01079 Gold [Au]

Abstract

A process for manufacturing a carrier element is described that has one or more ICs to be incorporated into an identity card or credit card. The carrier element comprises a substrate having on its surface a plurality of contact areas which are connected via connector paths to corresponding terminals of the IC disposed on the substrate. The IC, including the connections to the conductor paths, is protected from mechanical stresses by a cured casting compound. In order to prevent the casting compound from flowing off uncontrollably during its application, an opening is provided in the heat-set adhesive layer applied to one side of the substrate, said opening holding back the liquid resin during its application and acting as a limiting frame. The opening in the adhesive layer is located at least where the IC is to be disposed.

Claims

1. A method of making a carrier element including an integrated circuit device mounted on a substrate with terminals connected to contact pads by leads and having an adhesive layer on one side of the carrier element for enabling the carrier element to be bonded to a separate core layer, comprising the steps of:

providing a carrier substrate with contact pads having an aperture for receiving an integrated circuit device;

mounting an integrated circuit device having terminals in the aperture;

providing leads connecting the pads to the terminals;

providing a layer of a heat activatable adhesive film substantially covering one surface of the substrate except the substrate aperture, said adhesive film layer surrounding said substrate aperture at a distance therefrom on the substrate and defining by its thickness a barrier frame adjacent and surrounding said substrate aperture; and

depositing uncured liquid casting compound into the aperture so that it covers the integrated circuit device, its terminals and leads, and said one substrate surface only up to the adhesive film layer barrier frame and curing the casting compound while it is retained against flow away from said aperture solely by said barrier frame while leaving the adhesive film unactivated.

2. The method as claimed in claim 1, including mounting the contact pads on the surface of the substrate opposite the adhesive film layer, and extending the leads from the terminal of the integrated circuit device to the contact pads through openings in the substrate and filling said openings with said casting compound.

3. A method of making an identity card including an integrated circuit carrier comprising an integrated circuit device mounted in the carrier and protected by a casting compound covering at least one side of the integraded circuit device, comprising:

providing a carrier substrate with contact pads and an aperture for receiving an integrated circuit device;

mounting an integrated circuit device having terminals in the aperture;

providing leads connecting the pads to the terminals of the integrated circuit device;

providing a layer of heat activatable adhesive film substantially covering one surface of the substrate except the substrate aperture, said adhesive film layer surrounding said substrate aperture at a distance therefrom on the substrate and defining by its thickness a barrier frame adjacent and surrounding said substrate aperture;

depositing casting compound into the aperture so that it covers the integrated circuit device, its terminals and leads, and the one substrate surface only up to the adhesive film layer barrier frame and curing the casting compound while it is retained against flow away from said aperture solely by said barrier frame;

then providing a core layer of an identity card; and

then bonding the carrier to the core layer by activating the adhesive film with the integrated circuit device and the casting compound facing the core layer, and with the contact pads facing away from the core layer.

4. The method as claimed in claim 3, including filling the aperture with casting compound to a greater thickness than the combined thickness of the substrate and adhesive film layers adjacent the aperture before bonding the carrier element to the core layer, so as to leave a protrusion of casting compound above the substrate and adhesive film layers;

providing an opening in the core layer for receiving the protrusion of casting compound;

carrying out bonding of the carrier to the core layer with the protrusion of casting compound in said opening in the core layer.

5. The method as claimed in claim 3, including providing a cover layer adhered to the core layer and surrounding the carrier, said carrier and cover presenting a flush surface on the core layer.

6. The method as claimed in claim 3, including mounting the contact pads on the surface of the substrate opposite the adhesive film layer and extending the leads from the terminals to the contact pads though openings in the substrate, and filling said openings with said casting compound before bonding the carrier to the core layer.