Heat sink for an electronic pin grid array

• US 5,304,735 A
• Filed: 12/29/1992
• Issued: 04/19/1994
• Est. Priority Date: 02/14/1992
• Status: Expired due to Fees

• Current Assignee: Aavid Thermal Products Incorporated (Ansys Incorporated)
• Original Assignee: Aavid Thermal Products Incorporated (Ansys Incorporated)
• Inventors: Villaume, Henry F., Panek, Jeffrey J., Churchill, Jack, Earl, George F.
• Primary Examiner(s): Tolin, Gerald P.
• Application Number:
  US07/998,877
• Time in Patent Office: 476 Days
• Field of Search: 174/16.3, 257/706, 257/707, 257/718, 257/719, 24/455-458, 24/556, 24/625, 24/543, 24/555, 24/316.7, 361/382, 361/383-386, 361/400, 361/403, 361/405, 361/417, 361/419, 361/420, 361/427, 361/689, 361/690, 361/703, 361/704, 361/709, 361/717, 361/718, 361/722, 361/702 , 361/760, 361/763, 361/773, 361/807, 361/809, 361/810, 361/825, 248/72, 248/228, 248/505, 248/506, 248/510, 248/316.7
• US Class Current: 174/16.3
• CPC Class Codes: B25B 31/00 Hand tools for applying fasteners nailing or stapling tools B25C
• CPC Class Codes: B25B 7/02 Jaws
• CPC Class Codes: H01L 23/4093 Snap-on arrangements, e.g. clips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 24/44855 Terminal end of resilient member having engagement or disengagement enhancing structural modifications

Abstract

A heat sink in adapted to be attached to a pin grid array comprising a pair of grooves extending along opposite sides into which grooves the tops of attachment clips are disposed. The heat sink has a pair of indentations on opposite sides of each clip holds each clip in place in the groove, the heat sink with the clips attached being positioned between two compression sections of a pair of attachment pliers and when a pin grid array is positioned adjacent to the heat sink, compression of the plier handles connects the clips to the pin grid array. Removal is accomplished by a pair of pliers having projecting points which fit beneath the clips so that compression of the plier handles forces the clip away from the pin grid array disconnecting it.

Claims

1. A heat sink for attaching to a pin grid array comprising:

a heat dissipating portion, and

a base having sides,

said heat dissipating portion being integrally connected to said base, said base having at least two lips, each said lip being adjacent to a different side of said base, each said lip forming a groove between said lip and the remainder of said base, each said groove receiving a means for attaching said heat sink to a pin grid array, each said groove including at least one indentation, said indentation at least partially blocking said groove so that said indentation operates to hold said means for attaching in said groove so that said heat sink and said means for attaching may be held as a single unit for assembly and disassembly with the pin grid array.

2. The heat sink of claim 1 wherein said base is rectangular having four sides, each said groove and each said lip extending the length of one side of said base of said heat sink.

3. The heat sink of claim 1 wherein said means for attaching comprises at least one clip.

4. The heat sink of claim 1 wherein a pair of indentations are used, said indentations being disposed on opposite sides of said means for attaching.