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Film-type power resistor combination with anchored exposed substrate/heatsink

  • US 5,304,977 A
  • Filed: 04/06/1992
  • Issued: 04/19/1994
  • Est. Priority Date: 09/12/1991
  • Status: Expired due to Term
First Claim
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1. A film-type electrical power resistor, which comprises:

  • (a) a flat nonmetal chip having an upper surface and a lower surface, having a high dielectric strength, and having relatively high thermal conductivity for a nonmetal,(b) a resistive film applied to said upper surface of said chip,(c) terminals connected mechanically to said upper surface of said chip and connected electrically to said resistive film, said terminals being such that said chip with said film thereon may be positioned by said terminals in a predetermined position in a mold cavity, during manufacture of the power resistor, prior to introduction of synthetic resin into said mold cavity,(d) a molded electrically insulating body embedding those portions of said terminals that are relatively adjacent said chip, and also embedding only the upper portion and edge portions of said chip,said molded body not having any mold cup therearound.said lower chip surface and said body being so related to each other that said lower surface may be engaged in flatwise relationship to a flat region of a chassis or heatsink.said chip serving as a substrate for said film, as a heatsink for heat generated by said film, as an insulator maintaining said film electrically insulated from said chassis, and as a spacer maintaining said terminals spaced from said chassis.said resistor not containing any metal layer that is either in an electric circuit or projects outwardly relative to the edges of said chip, and(e) a bolthole extended through said body for clamping of said resistor in effective heat-transfer relationship to said flat region of said chassis or heatsink.

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