Method and apparatus for direct ARC plasma deposition of ceramic coatings

• US 5,306,408 A
• Filed: 06/29/1992
• Issued: 04/26/1994
• Est. Priority Date: 06/29/1992
• Status: Expired due to Fees

• Current Assignee: ISM Technologies Incorporated
• Original Assignee: ISM Technologies Incorporated
• Inventors: Treglio, James R.
• Primary Examiner(s): Weisstuch, Aaron
• Application Number:
  US07/905,342
• Time in Patent Office: 666 Days
• Field of Search: 204/192.38, 204/298.41, 427/580
• US Class Current: 204/192.38
• CPC Class Codes: C23C 14/325 Electric arc evaporation
• CPC Class Codes: H01J 37/32055 Arc discharge

Abstract

A method and apparatus for coating high temperature resistant, electrically-conductive, ceramic compounds, such as titanium carbides and diborides, onto an organic substrate, which may be an organic resin matrix composite. The apparatus basically comprises a vacuum arc plasma generator, a high-voltage insulated substrate holding table and a plasma channel. The plasma generator includes a vacuum chamber having a cylindrical cathode of the material to be deposited, surrounded by a ceramic insulator which is in turn surrounded by a metal trigger ring in contact with a trigger electrode. When a vacuum arc discharge is initiated, a plasma flows outwardly from the cathode through a hole in an adjacent anode and into a drift tube. The drift tube has a plurality of magnets around the tube exterior to push the plasma away from the tube, maintain a uniform plasma density and guide the plasma towards a substrate on a movable high voltage insulated substrate support. The cathode material is nearly 100% ionized, giving the ions impinging on the organic substrate sufficient kinetic energy to react with and adhere tightly to the target substrate without additional heating. The amount of kinetic energy is controllable to provide the selected degree of substrate surface ion mixing with the coating elements.

Claims

1. Apparatus for forming a coating on a substrate by direct ion mixed arc plasma deposition, which comprises:

a vacuum chamber;

a cathode assembly within said chamber, said cathode assembly comprising;

a cathode adapted to comprise the material of said coating;

an electrically insulating ceramic ring around said cathode;

a trigger ring around said insulating ring; and

a trigger electrode in contact with said trigger ring;

an anode spaced from said cathode, said anode having at least one perforation, said anode adapted to receive and pass ions including ions of said coating material from said cathode through said perforation;

a substrate support means spaced from said anode and adapted to support a substrate to be coated with said substrate positioned to receive said ions passing through said anode; and

a plurality of permanent magnets arranged around the volume between said anode and said target, said magnets arranged with like poles on adjacent magnets in a face-to-face pattern;

whereby a uniform, adherent, substantially stoichiometric, coating of the cathode material is formed on said target.

2. The apparatus according to claim 1 further including a drift tube positioned to receive ions passing through said anode, and guide said ions toward said substrate, said guide tube surrounding at least part of the path between said anode and said substrate and comprising a tube of non-magnetic material.

3. The apparatus according to claim 2 wherein said drift tube is formed from copper.

5. The apparatus according to claim 1 wherein said magnets are samarium-cobalt magnets.

6. The apparatus according to claim 1 where said anode is substantially planar, lies substantially perpendicular to the line between the centers of said cathode and said substrate and one anode perforation surrounds said line.

4. The apparatus according to claim further including an electrically conductive screen adjacent to the surface of said substrate facing toward said anode.

7. The method of forming an electrically-conductive, ceramic compound coating on a substrate by direct ion mixed arc plasma deposition, which comprises the steps of:

providing a vacuum chamber containing, in seriatim, a cathode, a perforated anode, and a substrate;

said cathode comprising a high temperature resistant, electrically-conductive, ceramic compound;

initiating an arc at said cathode to form a mixed plasma moving toward and through said anode;

guiding said plasma passing through said anode toward said substrate by surrounding the line between said cathode and said anode with a non-magnetic drift tube and positioning a plurality of permanent magnets along the exterior of said drift tube with the like poles of adjacent magnets in a face-to-face relationship to form magnetic cusps between adjacent magnets;

maintaining a substantially uniform ion mixture and plasma density as said plasma moves toward said substrate;

impinging said plasma onto said target whereby a substantially stoichiometric adherent coating of said compound is formed on said target.

8. The method according to claim 7 including maintaining said substrate at a bias of from about 50 to 200 volts negative during deposition.

9. The method according to claim 7 including varying the bias on said target from about 50 to 200 volts negative to about 10 to 30 kilovolts.

10. The method according to claim 9 wherein said bias is varied at a frequency of from about 10 to 30 cycles per second.

11. The method according to claim 10 further including the step of cleaning the target surface by sputtering away a small amount of the substrate surface before applying the coating.

12. The method according to claim 11 wherein said cleaning is accomplished and ions are implanted in the target surface by initiating cathode ionization with the substrate at a bias of from about 10 to 30 kilovolts for a period sufficient to apply from about 3×

10¹⁶ to 2×

10¹⁷ atoms/cm².

13. The method according to claim 7 wherein said ceramic compound is selected from the group consisting of borides, carbides, silicides and nitrides of titanium tungsten, aluminum, molybdenum, tantalum, niobium, and mixtures thereof.

14. The method according to claim 7 wherein said substrate comprises an organic resin matrix composite material.