Smart indexing head for universal lead frame work station

• US 5,307,978 A
• Filed: 08/19/1993
• Issued: 05/03/1994
• Est. Priority Date: 11/15/1991
• Status: Expired due to Term

• Current Assignee: Kulicke & Soffa Investments, Inc.
• Original Assignee: Kulicke & Soffa Investments, Inc.
• Inventors: Ricketson, Tommy H., Bram, Bruce M., Shah, Gautam N., Tehrani, Mohmod M.
• Primary Examiner(s): Ramsey, Kenneth J.
• Application Number:
  US08/109,097
• Time in Patent Office: 257 Days
• Field of Search: 228/4.5, 228/6.2, 228/47.1, 228/49.1
• US Class Current: 228/4.5
• CPC Class Codes: H01L 21/67144 Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48 of an individual wire connector
• CPC Class Codes: H01L 2224/78 Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 2224/78703 Mechanical holding means
• CPC Class Codes: H01L 24/78 Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/0102 Calcium [Ca]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01039 Yttrium [Y]
• CPC Class Codes: H01L 2924/01074 Tungsten [W]
• CPC Class Codes: H01L 2924/01075 Rhenium [Re]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]

Abstract

Apparatus and a method for orienting individual bonding sites of a lead frame having a plurality of bonding sites includes a universal work station in a work holder. The work holder comprises a gripper mechanism which is mounted on a transverse rail or bar for grasping a lead frame at an edge portion thereof while exposed in a supply magazine. The jaws of the gripper mechanism are pivoted in a horizontal direction which permits the exposed edge of the lead frame to be aligned parallel to a reference plane in a theta orientation direction. While oriented in the theta orientation direction, the lead frame is moved precisely to the window of the work station of the work holder where it is clamped by the top plate and lower plate of the work station before being subsequently bonded. A modified feature of the invention permits the mechanically theta oriented bonding site to be viewed by a PRS system and reoriented in an X and Y position prior to being clamped in the work station to provide a very high degree of theta, X and Y location of individual bonding sites in the window of a work station prior to bonding.

Claims

1. Apparatus for positioning individual lead frame bonding sites in the bonding window of a work station prior to a bonding operation, comprising:

a work holder base,

a Y-table mounted on said work holder base for movement relative thereto,

Y-drive means for moving said Y-table in a Y direction,

indexing head means comprising X-motor means mounted on said Y-table for movement relative thereto,

said X-motor means comprising an elongated rail means and an X-motor mounted thereon for movement relative thereto,

said indexing head means further comprising a gripper mechanism mounted on said X-motor means for movement therewith,

said gripper mechanism comprising a support arm having an upper jaw arm and a lower jar arm pivoted thereon,

upper and lower jaw arm pivot means mounted on said upper and lower jaw arms respectively for gripping a lead frame in a manner which leaves a lead frame edge exposed,

theta reference means movably mounted on said gripper mechanism for movement perpendicular to the direction of movement of said X-motor and for engaging said exposed edge of said lead frame and for mechanically orienting an individual bonding site on said lead frame in a theta orientation prior to positioning said oriented bonding site in said window of said work station.

2. Apparatus as set forth in claim 1 wherein said theta reference means comprises a linear actuator coupled to a theta bar which is mounted on said gripper mechanism.

3. Apparatus as set forth in claim 2 wherein said theta reference means further comprises a linear slider mounted on said support arm and said theta bar is mounted on said linear slider for linear movement by said linear actuator.

4. Apparatus as set forth in claim 3 which further includes upper and lower jaw insert means pivotally mounted on ball socket points on said jaw arms to enable horizontal pivoting movement of said lead frame when engaged by said theta reference means.

5. Apparatus as set forth in claim 4 which further includes means mounted on said gripper mechanism for sensing the edge of said lead frame.

6. Apparatus as set forth in claim 5 wherein said means for sensing the edge of a lead frame comprises a fiber optic light source and a fiber optic receiver for detecting interruptions of a light path between said fiber optic light source and said fiber optic receiver.

7. Apparatus as set forth in claim 6 which further includes processor control means coupled to said sensor means, said X-motor and said Y-drive means for positioning said jaw insert means juxtaposed an edge portion of said lead frame opposite a bonding site.

8. Apparatus as set forth in claim 7 wherein said gripper mechanism comprises jaw actuation means for closing said jaw insert means on said edge portion of said lead frame.

9. Apparatus as set forth in claim 8 wherein said jaw actuation means comprises a linear actuator coupled to said processor control means.

10. Apparatus as set forth in claim 9 wherein said control means further includes means for programming the pitch distance between lead frame bonding sites into said processor control means to enable said X-motor means to move a lead frame one bonding site pitch distance to place a theta oriented bonding site in said bonding window of said bonding station. theta oriented bonding site in said bonding window of said bonding station.

11. Apparatus as set forth in claim 10 which further includes a pattern recognition system means for electronically scanning said bonding site in said bonding window.

12. Apparatus as set forth in claim 11 wherein said processor control means further includes means coupled to said X-motor and said Y-drive means for pre-positioning said bonding site in said bonding window prior to being clamped in said bonding window by said work station.

13. Apparatus as set forth in claim 12 wherein said work station comprises a removable top clamp plate mounted on a clamp frame of said work station.

14. Apparatus as set forth in claim 13 wherein said work station further includes a removable lower clamp plate mounted on a heat block juxtaposed said top clamp plate.

15. Apparatus as set forth in claim 14 which further includes clamp plate drive means coupled to said processor control means for moving said clamp plates together to clamp a bonding site of a lead frame in a precise predetermined position relative to said bonding window.