Endpoint detection apparatus and method for chemical/mechanical polishing

• US 5,308,438 A
• Filed: 01/30/1992
• Issued: 05/03/1994
• Est. Priority Date: 01/30/1992
• Status: Expired due to Term

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Hill, William R., Hoffman, Cheryl A., Cote, William J., Cronin, John E.
• Primary Examiner(s): Hearn, Brian E.
• Assistant Examiner(s): HOLTZMAN, LAURA
• Application Number:
  US07/828,054
• Time in Patent Office: 824 Days
• Field of Search: 437/228, 156/636, 156/627, 51/307, 51/281 R, 51/283 R
• US Class Current: 216/86
• CPC Class Codes: B24B 37/013 Devices or means for detecting lapping completion
• CPC Class Codes: B24B 49/16 taking regard of the load
• CPC Class Codes: H01L 21/31053 involving a dielectric removal step

Abstract

An apparatus and method for determining a selected endpoint in the polishing of layers on a workpiece in a chemical/mechanical polishing apparatus where the workpiece is rotated by a motor against a polishing pad. When a difficult to polish layer, i.e., one requiring a chemical change in a surface skin of the layer which skin is then abraded away by a mechanical process is removed from a more easy to polish surface, i.e., one that relies solely on mechanical abrasion and does not need to have a chemically converted skin thereon. The power required to maintain a set rotational speed in a motor rotating the workpiece significantly drops when the difficult to polish layer is removed. This current drop is used to detect the point at which the polishing must be stopped to avoid over polishing effects, i.e., dishing or thinning or removal of the more easily removed underlying material. Thus, an end point in the process can be established.

Claims

1. In a process of polishing of a layer of a first material requiring a chemical/mechanical removal process arranged over a layer of second material requiring only a mechanical removal process disposed on a surface of a workpiece wherein the workpiece is rotated by a first motor and is brought into contact with a polish wheel rotated by a second motor and having a polishing pad disposed thereon, the improvement comprising:

providing a chemical/mechanical slurry on said polishing pad wherein said polishing pad is coated with said slurry;

placing the workpiece on the polishing pad and rotating the workpiece and the polishing pad,

maintaining the rotational speed of the workpiece above the rotational speed of the polish wheel and applying pressure to the workpiece and;

monitoring the current drawn by the first motor.

2. The processes recited in claim 1, wherein the temperature of the slurry is maintained between 60°

and 85°

F.

3. The processes recited in claim 1, wherein the slurry comprises water containing an oxidizing agent and an abrasive.

4. The processes recited in claim 3, wherein the abrasive agent is comprised of aluminum trioxide.

5. The processes recited in claim 3, wherein the oxidizing is metal salt.

6. The processes recited in claim 3, wherein iron nitrate serves as the oxidizing agent.

7. The process of claim 1 wherein said pad is comprised of an underlayer impervious at least to the slurry, and covered with a plurality of fibers.

8. The process of claim 7 wherein there is disposed over the polishing pad an air brush conditioner for conditioning the polishing pad before it encounters the workpiece by blowing off used slurry.

9. The process of claim 1 wherein said first material is tungsten and said second underlying material is titanium nitride.

10. The process of claim 1 further comprising stopping the polishing after the current drawn by the motor being monitored is reduced.

11. The process of claim 1 wherein there is further provided the steps of:

treating a surface of the workpiece by,

depositing a layer of a first material having a first coefficient of friction on said surface of said workpiece;

depositing on said first material a layer of a second material having a second coefficient of friction wherein said second coefficient of friction is higher that said first coefficient;

holding said workpiece with said materials in contact with said polishing pad disposed on said polish wheel;

providing a slurry on said polishing pad;

monitoring said current in said first motor for a reduction in current; and

stopping said polishing after said reduction in current is detected.

12. The process as recited in claim 11 further comprising,

depositing a third material having a third coefficient of friction after depositing said first material and before depositing said second material, wherein said second coefficient is higher than said third coefficient.

13. The process as recited in claim 12 wherein said second coefficient is not higher than said first coefficient.

14. A process for polishing a workpiece wherein said workpiece comprises a first material having a first coefficient of friction arranged over a second material having a second coefficient of friction wherein said first coefficient is higher than said second coefficient, comprising,

holding said workpiece in contact with a polishing pad disposed on a polishing wheel;

providing a slurry on said polishing pad;

rotating said workpiece by a first motor;

rotating said polishing wheel by a second motor wherein rotational speed of said workpiece is above rotational speed of said polishing wheel;

monitoring current in said first motor;

detecting an endpoint in said polishing after current in said first motor is reduced.