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Endpoint detection apparatus and method for chemical/mechanical polishing

  • US 5,308,438 A
  • Filed: 01/30/1992
  • Issued: 05/03/1994
  • Est. Priority Date: 01/30/1992
  • Status: Expired due to Term
First Claim
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1. In a process of polishing of a layer of a first material requiring a chemical/mechanical removal process arranged over a layer of second material requiring only a mechanical removal process disposed on a surface of a workpiece wherein the workpiece is rotated by a first motor and is brought into contact with a polish wheel rotated by a second motor and having a polishing pad disposed thereon, the improvement comprising:

  • providing a chemical/mechanical slurry on said polishing pad wherein said polishing pad is coated with said slurry;

    placing the workpiece on the polishing pad and rotating the workpiece and the polishing pad,maintaining the rotational speed of the workpiece above the rotational speed of the polish wheel and applying pressure to the workpiece and;

    monitoring the current drawn by the first motor.

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