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Fluid flow control method and apparatus for an ion implanter

  • US 5,308,989 A
  • Filed: 12/22/1992
  • Issued: 05/03/1994
  • Est. Priority Date: 12/22/1992
  • Status: Expired due to Term
First Claim
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1. A system for treating one or more generally circular wafers comprising:

  • a) a chamber that defines a chamber interior having a wafer support onto which one or more wafers are moved prior to treatment;

    said chamber having cylindrical internal flow-defining surfaces that encircle an outer periphery of the wafer support;

    b) means for inserting wafers into the chamber and placing them on the wafer support prior to treatment and removing the wafers from the chamber after they have been treated;

    c) structure for venting fluid into the chamber through a first passageway and for evacuating the chamber by withdrawing fluid from the chamber through a second passageway;

    d) a controller for adjusting fluid flow entering or exiting the chamber via the first and the second passageways; and

    e) fluid flow distribution means mounted relative the wafer support within the chamber for providing radial fluid flow away from the cylindrical internal flow-defining surfaces to a region of the wafers during chamber venting and for providing radial fluid flow toward the cylindrical internal flow-defining surfaces from the region of the wafers during chamber evacuation to impede particle contamination of wafers within the chamber;

    f) said cylindrical internal flow-defining surfaces and the flow distribution means defining a flow region through the chamber for promoting laminar fluid flow within the chamber.

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